USD613702S1 - Two-pin lead frame for a LED device - Google Patents

Two-pin lead frame for a LED device Download PDF

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Publication number
USD613702S1
USD613702S1 US29/278,104 US27810407F USD613702S US D613702 S1 USD613702 S1 US D613702S1 US 27810407 F US27810407 F US 27810407F US D613702 S USD613702 S US D613702S
Authority
US
United States
Prior art keywords
lead frame
led device
pin lead
pin
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/278,104
Inventor
Jui-Kang Yen
Yung-Wei Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SemiLEDs Optoelectronics Co Ltd
Original Assignee
SemiLEDs Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/249,575 external-priority patent/USD580375S1/en
Application filed by SemiLEDs Optoelectronics Co Ltd filed Critical SemiLEDs Optoelectronics Co Ltd
Priority to US29/278,104 priority Critical patent/USD613702S1/en
Priority to TW096305164F priority patent/TWD128703S1/en
Priority to TW096305165F priority patent/TWD128704S1/en
Assigned to SemiLEDs Optoelectronics Co., Ltd. reassignment SemiLEDs Optoelectronics Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YUNG-WEI, YEN, JUI-KANG
Application granted granted Critical
Publication of USD613702S1 publication Critical patent/USD613702S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a two-pin lead frame for a LED device in accordance with one embodiment of the present invention.
FIG. 2 is a front view of the two-pin lead frame for a LED device of FIG. 1.
FIG. 3 is a rear view of the two-pin lead frame for a LED device of FIG. 1.
FIG. 4 is a top view of the two-pin lead frame for a LED device of FIG. 1.
FIG. 5 is a bottom view of the two-pin lead frame for a LED device of FIG. 1.
FIG. 6 is a left view of the two-pin lead frame for a LED device of FIG. 1; and,
FIG. 7 is a right view of the two-pin lead frame for a LED device of FIG. 1.

Claims (1)

  1. The ornamental design for a two-pin lead frame for a LED device, as shown and described.
US29/278,104 2006-10-12 2007-03-20 Two-pin lead frame for a LED device Expired - Lifetime USD613702S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/278,104 USD613702S1 (en) 2006-10-12 2007-03-20 Two-pin lead frame for a LED device
TW096305164F TWD128703S1 (en) 2007-03-20 2007-09-20 Two-pin led device
TW096305165F TWD128704S1 (en) 2007-03-20 2007-09-20 Metal structure of two-pin led device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/249,575 USD580375S1 (en) 2006-10-12 2006-10-12 Lead frame for a two-pin light emitting diode device
US29/278,104 USD613702S1 (en) 2006-10-12 2007-03-20 Two-pin lead frame for a LED device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/249,575 Continuation-In-Part USD580375S1 (en) 2006-10-12 2006-10-12 Lead frame for a two-pin light emitting diode device

Publications (1)

Publication Number Publication Date
USD613702S1 true USD613702S1 (en) 2010-04-13

Family

ID=42078602

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/278,104 Expired - Lifetime USD613702S1 (en) 2006-10-12 2007-03-20 Two-pin lead frame for a LED device

Country Status (1)

Country Link
US (1) USD613702S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
US6559379B2 (en) * 1995-02-24 2003-05-06 Novasensor, Inc. Pressure sensor with transducer mounted on a metal base
US6569764B1 (en) * 1999-08-25 2003-05-27 Hitachi, Ltd. Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
US20030116769A1 (en) * 2001-12-24 2003-06-26 Samsung Electro-Mechanics Co., Ltd. Light emission diode package
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US6943433B2 (en) * 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
USD532383S1 (en) * 2005-06-08 2006-11-21 Matsushita Electric Industrial Co., Ltd. Light emitting diode module
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US7211882B2 (en) 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
US7321161B2 (en) 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6559379B2 (en) * 1995-02-24 2003-05-06 Novasensor, Inc. Pressure sensor with transducer mounted on a metal base
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
US6569764B1 (en) * 1999-08-25 2003-05-27 Hitachi, Ltd. Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US20050127483A1 (en) 2001-10-22 2005-06-16 Rajeev Joshi Thin, thermally enhanced flip chip in a leaded molded package
US20030116769A1 (en) * 2001-12-24 2003-06-26 Samsung Electro-Mechanics Co., Ltd. Light emission diode package
US6943433B2 (en) * 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
US7321161B2 (en) 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7211882B2 (en) 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
USD532383S1 (en) * 2005-06-08 2006-11-21 Matsushita Electric Industrial Co., Ltd. Light emitting diode module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card

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