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Conductive sheet

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Publication number
USD598380S1
USD598380S1 US29327598 US32759808F USD598380S1 US D598380 S1 USD598380 S1 US D598380S1 US 29327598 US29327598 US 29327598 US 32759808 F US32759808 F US 32759808F US D598380 S1 USD598380 S1 US D598380S1
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US
Grant status
Grant
Patent type
Design
Prior art keywords
fig
view
sheet
conductive
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29327598
Inventor
Tadashi Kuriki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIFILM Corp
Original Assignee
FUJIFILM Corp
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Filing date
Publication date
Grant date

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Description

FIG. 1 is a front view of a conductive sheet showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a right side view thereof.

Claims (1)

  1. The ornamental design for a conductive sheet, as shown.
US29327598 2008-05-09 2008-11-10 Conductive sheet Active USD598380S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008011618 2008-05-09

Publications (1)

Publication Number Publication Date
USD598380S1 true USD598380S1 (en) 2009-08-18

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US29327598 Active USD598380S1 (en) 2008-05-09 2008-11-10 Conductive sheet

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD743356S1 (en) * 2011-06-17 2015-11-17 Soraa, Inc. Diamond-shaped semiconductor die
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD743356S1 (en) * 2011-06-17 2015-11-17 Soraa, Inc. Diamond-shaped semiconductor die
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer

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