USD588557S1 - 4040-28J matrix leadframe - Google Patents

4040-28J matrix leadframe Download PDF

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Publication number
USD588557S1
USD588557S1 US29/292,225 US29222507F USD588557S US D588557 S1 USD588557 S1 US D588557S1 US 29222507 F US29222507 F US 29222507F US D588557 S USD588557 S US D588557S
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United States
Prior art keywords
matrix leadframe
matrix
leadframe
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/292,225
Inventor
James Harnden
Anthony Chia
Hongbo Yang
Teng Hui
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GEM Services Inc USA
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GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to US29/292,225 priority Critical patent/USD588557S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARNDEN, JAMES, CHIA, ANTHONY, TENG, Hui, YANG, HONGBO
Application granted granted Critical
Publication of USD588557S1 publication Critical patent/USD588557S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 4040-28J matrix leadframe showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the 4040-28J matrix leadframe shown in FIG. 1 for ease of illustration; and,
FIG. 3 is a perspective view of FIG. 1.

Claims (1)

  1. The ornamental design for 4040-28J matrix leadframe, as shown and described.
US29/292,225 2007-10-02 2007-10-02 4040-28J matrix leadframe Expired - Lifetime USD588557S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/292,225 USD588557S1 (en) 2007-10-02 2007-10-02 4040-28J matrix leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/292,225 USD588557S1 (en) 2007-10-02 2007-10-02 4040-28J matrix leadframe

Publications (1)

Publication Number Publication Date
USD588557S1 true USD588557S1 (en) 2009-03-17

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ID=40434465

Family Applications (1)

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US29/292,225 Expired - Lifetime USD588557S1 (en) 2007-10-02 2007-10-02 4040-28J matrix leadframe

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130292811A1 (en) * 2012-05-02 2013-11-07 Texas Instruments Incorporated Leadframe having selective planishing
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130292811A1 (en) * 2012-05-02 2013-11-07 Texas Instruments Incorporated Leadframe having selective planishing
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
US8963300B2 (en) 2012-05-02 2015-02-24 Texas Instruments Incorporation Semiconductor device with selective planished leadframe
US9006038B2 (en) * 2012-05-02 2015-04-14 Texas Instruments Incorporated Selective leadframe planishing
US20150221526A1 (en) * 2012-05-02 2015-08-06 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
US9972506B2 (en) * 2012-05-02 2018-05-15 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
US10438816B2 (en) 2012-05-02 2019-10-08 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

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