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USD580895S1 - Grooves formed around a semiconductor device on a circuit board - Google Patents

Grooves formed around a semiconductor device on a circuit board Download PDF

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Publication number
USD580895S1
USD580895S1 US29306339 US30633908F USD580895S US D580895 S1 USD580895 S1 US D580895S1 US 29306339 US29306339 US 29306339 US 30633908 F US30633908 F US 30633908F US D580895 S USD580895 S US D580895S
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US
Grant status
Grant
Patent type
Design
Prior art keywords
fig
shows
view
enlarged
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29306339
Inventor
Naohiro Terada
Kouji Kataoka
Tetsuya Ohsawa
Toshiki Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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Description

FIG. 1 shows a plan view of the design according to a first embodiment of the invention.

FIG. 2 shows a bottom view of the design according to the invention. A claimed portion is not seen from the bottom.

FIG. 3 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 4 shows an enlarged sectional view along the line 44 in FIG. 3.

FIG. 5 shows an enlarged sectional view along the line 55 in FIG. 3.

FIG. 6 shows a perspective view of the design in FIG. 1, on which an semiconductor device (not claimed) is disposed.

FIG. 7 shows an enlarged sectional view along the line 55 in FIG. 3, on which a semiconductor device (not claimed) is disposed.

FIG. 8 shows a plan view of the design according to a second embodiment of the invention.

FIG. 9 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 8.

FIG. 10 shows an enlarged sectional view along the line 1010 in FIG. 9; and,

FIG. 11 shows an enlarged sectional view along the line 1111 in FIG. 9.

The elements shown in broken lines are for illustrative purpose only and form no part of the claimed invention.

Claims (1)

  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
US29306339 2006-05-01 2008-04-08 Grooves formed around a semiconductor device on a circuit board Active USD580895S1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2006011439 2006-05-01
JP2006011426 2006-05-01
JP2006011440 2006-05-01
JP2006011435 2006-05-01
JP2006011442 2006-05-01
JP2006011441 2006-05-01
JP2006011431 2006-05-01
JP2006011430 2006-05-01
JP2006011429 2006-05-01
JP2006011432 2006-05-01
US29268260 USD568838S1 (en) 2006-05-01 2006-11-01 Grooves formed around a semiconductor device on a circuit board
US29306339 USD580895S1 (en) 2006-05-01 2008-04-08 Grooves formed around a semiconductor device on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29306339 USD580895S1 (en) 2006-05-01 2008-04-08 Grooves formed around a semiconductor device on a circuit board

Publications (1)

Publication Number Publication Date
USD580895S1 true USD580895S1 (en) 2008-11-18

Family

ID=39362047

Family Applications (2)

Application Number Title Priority Date Filing Date
US29268260 Active USD568838S1 (en) 2006-05-01 2006-11-01 Grooves formed around a semiconductor device on a circuit board
US29306339 Active USD580895S1 (en) 2006-05-01 2008-04-08 Grooves formed around a semiconductor device on a circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29268260 Active USD568838S1 (en) 2006-05-01 2006-11-01 Grooves formed around a semiconductor device on a circuit board

Country Status (1)

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US (2) USD568838S1 (en)

Also Published As

Publication number Publication date Type
USD568838S1 (en) 2008-05-13 grant

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