USD570796S1 - Light emitting diode (LED) - Google Patents

Light emitting diode (LED) Download PDF

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Publication number
USD570796S1
USD570796S1 US29/263,845 US26384506F USD570796S US D570796 S1 USD570796 S1 US D570796S1 US 26384506 F US26384506 F US 26384506F US D570796 S USD570796 S US D570796S
Authority
US
United States
Prior art keywords
led
light emitting
emitting diode
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/263,845
Inventor
Bang Hyun Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Semiconductor Co Ltd
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Assigned to SEOUL SEMICONDUCTOR CO., LTD. reassignment SEOUL SEMICONDUCTOR CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, BANG HYUN
Application granted granted Critical
Publication of USD570796S1 publication Critical patent/USD570796S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a light emitting diode (LED) showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a sectional view taken along line 88 in FIG. 6.

Claims (1)

    CLAIM
  1. The ornamental design for light emitting diode (LED), as shown and described.
US29/263,845 2006-04-05 2006-07-28 Light emitting diode (LED) Expired - Lifetime USD570796S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2006-0012565 2006-04-05
KR20060012565 2006-04-05

Publications (1)

Publication Number Publication Date
USD570796S1 true USD570796S1 (en) 2008-06-10

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ID=39484813

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/263,845 Expired - Lifetime USD570796S1 (en) 2006-04-05 2006-07-28 Light emitting diode (LED)

Country Status (2)

Country Link
US (1) USD570796S1 (en)
TW (1) TWD127765S1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD576573S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
USD593967S1 (en) * 2008-02-01 2009-06-09 C. I. Kasei Company, Limited Light emitting device
USD607420S1 (en) * 2007-12-05 2010-01-05 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD608740S1 (en) * 2008-08-29 2010-01-26 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
USD615052S1 (en) 2009-10-27 2010-05-04 Citizen Electronics Co. Ltd. Light-emitting diode
USD619110S1 (en) * 2009-11-20 2010-07-06 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD621798S1 (en) * 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
USD622677S1 (en) 2009-02-03 2010-08-31 Everlight Electronics Co., Ltd. Light emitting diode package device
USD624885S1 (en) * 2010-01-27 2010-10-05 Silitek Electronic (Guangzhou) Co., Ltd. LED package structure

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
USD491899S1 (en) * 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
US6774406B2 (en) * 2001-11-26 2004-08-10 Citizen Electronics Co., Ltd. Light emitting diode device
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD503930S1 (en) 2003-09-15 2005-04-12 Nichia Corporation Light emitting diode
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD510912S1 (en) 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
USD512694S1 (en) * 2004-06-30 2005-12-13 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD515043S1 (en) * 2004-06-24 2006-02-14 Citizen Electronics Co., Ltd. Light emitting diode
USD517026S1 (en) * 2003-07-09 2006-03-14 Nichia Corporation Light emitting diode
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
USD531140S1 (en) * 2005-11-14 2006-10-31 Kabushiki Kaisha Toshiba Light emitting semiconductor device
US20070030703A1 (en) * 2005-08-08 2007-02-08 Samsung Electro-Mechanics Co., Ltd. LED package having recess in heat conducting part

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774406B2 (en) * 2001-11-26 2004-08-10 Citizen Electronics Co., Ltd. Light emitting diode device
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
USD491899S1 (en) * 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
USD517026S1 (en) * 2003-07-09 2006-03-14 Nichia Corporation Light emitting diode
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD510912S1 (en) 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
USD503930S1 (en) 2003-09-15 2005-04-12 Nichia Corporation Light emitting diode
USD515043S1 (en) * 2004-06-24 2006-02-14 Citizen Electronics Co., Ltd. Light emitting diode
USD512694S1 (en) * 2004-06-30 2005-12-13 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
US20070030703A1 (en) * 2005-08-08 2007-02-08 Samsung Electro-Mechanics Co., Ltd. LED package having recess in heat conducting part
USD531140S1 (en) * 2005-11-14 2006-10-31 Kabushiki Kaisha Toshiba Light emitting semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD576573S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
USD607420S1 (en) * 2007-12-05 2010-01-05 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD618635S1 (en) 2007-12-05 2010-06-29 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD593967S1 (en) * 2008-02-01 2009-06-09 C. I. Kasei Company, Limited Light emitting device
USD608740S1 (en) * 2008-08-29 2010-01-26 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
USD621798S1 (en) * 2008-08-29 2010-08-17 Foxsemicon Integrated Technology, Inc. Light-emitting diode substrate
USD622677S1 (en) 2009-02-03 2010-08-31 Everlight Electronics Co., Ltd. Light emitting diode package device
USD615052S1 (en) 2009-10-27 2010-05-04 Citizen Electronics Co. Ltd. Light-emitting diode
USD619110S1 (en) * 2009-11-20 2010-07-06 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD624885S1 (en) * 2010-01-27 2010-10-05 Silitek Electronic (Guangzhou) Co., Ltd. LED package structure

Also Published As

Publication number Publication date
TWD127765S1 (en) 2009-03-11

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