USD570795S1 - Mini blower heat sink module - Google Patents
Mini blower heat sink module Download PDFInfo
- Publication number
- USD570795S1 USD570795S1 US29/274,496 US27449607F USD570795S US D570795 S1 USD570795 S1 US D570795S1 US 27449607 F US27449607 F US 27449607F US D570795 S USD570795 S US D570795S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink module
- blower heat
- mini blower
- mini
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for mini blower heat sink module, as shown and described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW30113602 | 2007-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD570795S1 true USD570795S1 (en) | 2008-06-10 |
Family
ID=39484812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/274,496 Expired - Lifetime USD570795S1 (en) | 2007-02-16 | 2007-04-27 | Mini blower heat sink module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD570795S1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD936622S1 (en) * | 2019-01-17 | 2021-11-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Baffle for heat sink |
USD986898S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986901S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD997161S1 (en) * | 2020-09-10 | 2023-08-29 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD998612S1 (en) * | 2020-06-09 | 2023-09-12 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD1042778S1 (en) * | 2023-04-14 | 2024-09-17 | Acer Incorporated | Heat dissipation module |
-
2007
- 2007-04-27 US US29/274,496 patent/USD570795S1/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD936622S1 (en) * | 2019-01-17 | 2021-11-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Baffle for heat sink |
USD998612S1 (en) * | 2020-06-09 | 2023-09-12 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
US11979996B2 (en) | 2020-06-09 | 2024-05-07 | Samsung Electronics Co., Ltd. | Memory device and electronic device including the same |
USD997161S1 (en) * | 2020-09-10 | 2023-08-29 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986898S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986901S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD1042778S1 (en) * | 2023-04-14 | 2024-09-17 | Acer Incorporated | Heat dissipation module |
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