USD559804S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD559804S1
USD559804S1 US29/261,719 US26171906F USD559804S US D559804 S1 USD559804 S1 US D559804S1 US 26171906 F US26171906 F US 26171906F US D559804 S USD559804 S US D559804S
Authority
US
United States
Prior art keywords
led package
view
led
package
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/261,719
Inventor
Kwang Cheol LEE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Assigned to LG INNOTEK CO., LTD reassignment LG INNOTEK CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, KWANG CHEOL
Application granted granted Critical
Publication of USD559804S1 publication Critical patent/USD559804S1/en
Assigned to SUZHOU LEKIN SEMICONDUCTOR CO., LTD. reassignment SUZHOU LEKIN SEMICONDUCTOR CO., LTD. ASSIGNMENT OF ASSIGNOR'S INTEREST Assignors: LG INNOTEK CO., LTD.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the LED package showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof, the right side view being a mirror image thereof;
FIG. 5 is a top view thereof; and,
FIG. 6 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an LED package, as shown and described.
US29/261,719 2005-12-21 2006-06-20 LED package Expired - Lifetime USD559804S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050043207 2005-12-21
KR30-2005-0043207 2005-12-21

Publications (1)

Publication Number Publication Date
USD559804S1 true USD559804S1 (en) 2008-01-15

Family

ID=38921418

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/261,719 Expired - Lifetime USD559804S1 (en) 2005-12-21 2006-06-20 LED package

Country Status (2)

Country Link
US (1) USD559804S1 (en)
TW (1) TWD127499S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD576115S1 (en) * 2006-11-14 2008-09-02 Lg Innotek Co., Ltd. Light-emitting diode
USD586765S1 (en) * 2008-01-31 2009-02-17 Lg Electronics Inc. Light-emitting diode
USD592160S1 (en) * 2008-02-14 2009-05-12 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
USD599750S1 (en) * 2008-06-20 2009-09-08 Samsung Electro-Mechanics Co., Ltd. Case for light emitting diode
USD626096S1 (en) * 2010-01-29 2010-10-26 Silitek Electronic (Guangzhou) Co., Ltd. Package of a light emitting diode

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US6774406B2 (en) * 2001-11-26 2004-08-10 Citizen Electronics Co., Ltd. Light emitting diode device
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD517026S1 (en) * 2003-07-09 2006-03-14 Nichia Corporation Light emitting diode
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
US20070030703A1 (en) * 2005-08-08 2007-02-08 Samsung Electro-Mechanics Co., Ltd. LED package having recess in heat conducting part

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774406B2 (en) * 2001-11-26 2004-08-10 Citizen Electronics Co., Ltd. Light emitting diode device
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
USD517026S1 (en) * 2003-07-09 2006-03-14 Nichia Corporation Light emitting diode
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
US20070030703A1 (en) * 2005-08-08 2007-02-08 Samsung Electro-Mechanics Co., Ltd. LED package having recess in heat conducting part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD576115S1 (en) * 2006-11-14 2008-09-02 Lg Innotek Co., Ltd. Light-emitting diode
USD586765S1 (en) * 2008-01-31 2009-02-17 Lg Electronics Inc. Light-emitting diode
USD592160S1 (en) * 2008-02-14 2009-05-12 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
USD599750S1 (en) * 2008-06-20 2009-09-08 Samsung Electro-Mechanics Co., Ltd. Case for light emitting diode
USD626096S1 (en) * 2010-01-29 2010-10-26 Silitek Electronic (Guangzhou) Co., Ltd. Package of a light emitting diode

Also Published As

Publication number Publication date
TWD127499S1 (en) 2009-02-21

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