USD559648S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD559648S1
USD559648S1 US29225833 US22583305F USD559648S US D559648 S1 USD559648 S1 US D559648S1 US 29225833 US29225833 US 29225833 US 22583305 F US22583305 F US 22583305F US D559648 S USD559648 S US D559648S
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US
Grant status
Grant
Patent type
Design
Prior art keywords
fig
view
along
enlarged
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29225833
Inventor
Hiroyuki Miyauchi
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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Description

FIG. 1 is a top plan view of a polishing pad, showing our new design;

FIG. 2 is a front elevational view thereof, the rear, left, and right side elevational views being mirror images of the view shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is an enlarged, partial top plan view thereof taken along the intersection of lines 44 in FIG. 1;

FIG. 5 is an enlarged, partial sectional view thereof taken along line 55 in FIG. 4;

FIG. 6 is a greatly enlarged, partial cross-sectional view thereof taken along line 6 in FIG. 5;

FIG. 7 is an enlarged, partial bottom plan view of taken along the intersection of lines 77 in FIG. 3;

FIG. 8 is a top plan view of a second embodiment of the polishing pad;

FIG. 9 is a front elevational view thereof, the rear, left, and right side elevational views being mirror images of the view shown;

FIG. 10 is a bottom plan view thereof;

FIG. 11 is an enlarged, partial top plan view thereof taken along the intersection of lines 1111 in FIG. 8;

FIG. 12 is an enlarged, partial sectional view thereof taken along line 1212 in FIG. 11;

FIG. 13 is a greatly enlarged, partial cross-sectional view thereof taken along line 13 in FIG. 12; and,

FIG. 14 is an enlarged, partial bottom plan view taken along the intersection of lines 1414 in FIG. 10.

Claims (1)

  1. The ornamental design for a polishing pad, as shown and described.
US29225833 2004-10-05 2005-03-22 Polishing pad Active USD559648S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004030295 2004-10-05
JP2004030293 2004-10-05

Publications (1)

Publication Number Publication Date
USD559648S1 true USD559648S1 (en) 2008-01-15

Family

ID=38921279

Family Applications (1)

Application Number Title Priority Date Filing Date
US29225833 Active USD559648S1 (en) 2004-10-05 2005-03-22 Polishing pad

Country Status (1)

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US (1) USD559648S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate

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