USD558694S1 - Quad-28JW surface mount package - Google Patents

Quad-28JW surface mount package Download PDF

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Publication number
USD558694S1
USD558694S1 US29/240,406 US24040605F USD558694S US D558694 S1 USD558694 S1 US D558694S1 US 24040605 F US24040605 F US 24040605F US D558694 S USD558694 S US D558694S
Authority
US
United States
Prior art keywords
quad
surface mount
mount package
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/240,406
Inventor
James Harnden
Anthony Chia
Liming Wong
Hongbo Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/240,406 priority Critical patent/USD558694S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIA, ANTHONY, YANG, HONGBO, HARNDEN, JAMES, WONG, LIMING
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARNDEN, JAMES, CHIA, ANTHONY, WONG, LIMING, YANG, HONGBO
Application granted granted Critical
Publication of USD558694S1 publication Critical patent/USD558694S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a quad-28JW surface mount package showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for quad-28JW surface mount package, as shown and described.
US29/240,406 2005-10-11 2005-10-11 Quad-28JW surface mount package Expired - Lifetime USD558694S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/240,406 USD558694S1 (en) 2005-10-11 2005-10-11 Quad-28JW surface mount package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/240,406 USD558694S1 (en) 2005-10-11 2005-10-11 Quad-28JW surface mount package

Publications (1)

Publication Number Publication Date
USD558694S1 true USD558694S1 (en) 2008-01-01

Family

ID=38870879

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/240,406 Expired - Lifetime USD558694S1 (en) 2005-10-11 2005-10-11 Quad-28JW surface mount package

Country Status (1)

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US (1) USD558694S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1112117S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112116S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112118S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5742169A (en) * 1996-02-20 1998-04-21 Micron Technology, Inc. Apparatus for testing interconnects for semiconductor dice
USD402638S (en) * 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6222379B1 (en) * 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD461172S1 (en) * 2001-07-17 2002-08-06 Gem Services, Inc. Surface mount package
USD461170S1 (en) * 2001-05-15 2002-08-06 Gem Services, Inc. Surface mount package
USD462062S1 (en) * 2001-05-18 2002-08-27 Gem Services, Inc. Surface mount package
USD467231S1 (en) * 2001-07-17 2002-12-17 Gem Services, Inc. Surface mount package
USD467560S1 (en) * 2001-07-17 2002-12-24 Gem Services, Inc. Surface mount package
USD467884S1 (en) * 2001-05-15 2002-12-31 Gem Services, Inc. Surface mount package
USD467885S1 (en) * 2001-07-18 2002-12-31 Gem Services, Inc. Surface mount package
US7057273B2 (en) * 2001-05-15 2006-06-06 Gem Services, Inc. Surface mount package

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US6222379B1 (en) * 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
US5742169A (en) * 1996-02-20 1998-04-21 Micron Technology, Inc. Apparatus for testing interconnects for semiconductor dice
US5949241A (en) * 1996-02-20 1999-09-07 Micron Technology, Inc. Method for testing interconnects and semiconductor dice
USD402638S (en) * 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD461170S1 (en) * 2001-05-15 2002-08-06 Gem Services, Inc. Surface mount package
USD467884S1 (en) * 2001-05-15 2002-12-31 Gem Services, Inc. Surface mount package
US7057273B2 (en) * 2001-05-15 2006-06-06 Gem Services, Inc. Surface mount package
USD462062S1 (en) * 2001-05-18 2002-08-27 Gem Services, Inc. Surface mount package
USD461172S1 (en) * 2001-07-17 2002-08-06 Gem Services, Inc. Surface mount package
USD467231S1 (en) * 2001-07-17 2002-12-17 Gem Services, Inc. Surface mount package
USD467560S1 (en) * 2001-07-17 2002-12-24 Gem Services, Inc. Surface mount package
USD467885S1 (en) * 2001-07-18 2002-12-31 Gem Services, Inc. Surface mount package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1112117S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112116S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112118S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

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