USD548199S1 - Flip chip on glass (FCOG) image sensor - Google Patents

Flip chip on glass (FCOG) image sensor Download PDF

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Publication number
USD548199S1
USD548199S1 US29/237,072 US23707205F USD548199S US D548199 S1 USD548199 S1 US D548199S1 US 23707205 F US23707205 F US 23707205F US D548199 S USD548199 S US D548199S
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US
United States
Prior art keywords
fcog
glass
image sensor
flip chip
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/237,072
Inventor
Wen Ching Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Exquisite Optical Tech Co Ltd
Original Assignee
Exquisite Optical Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exquisite Optical Tech Co Ltd filed Critical Exquisite Optical Tech Co Ltd
Priority to US29/237,072 priority Critical patent/USD548199S1/en
Application granted granted Critical
Publication of USD548199S1 publication Critical patent/USD548199S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a flip chip on glass (FCOG) image sensor showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plain view thereof; and,
FIG. 7 is a bottom plain view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a flip chip on glass (FCOG) image sensor, as shown and described.
US29/237,072 2005-08-26 2005-08-26 Flip chip on glass (FCOG) image sensor Expired - Lifetime USD548199S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/237,072 USD548199S1 (en) 2005-08-26 2005-08-26 Flip chip on glass (FCOG) image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/237,072 USD548199S1 (en) 2005-08-26 2005-08-26 Flip chip on glass (FCOG) image sensor

Publications (1)

Publication Number Publication Date
USD548199S1 true USD548199S1 (en) 2007-08-07

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Family Applications (1)

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US29/237,072 Expired - Lifetime USD548199S1 (en) 2005-08-26 2005-08-26 Flip chip on glass (FCOG) image sensor

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US (1) USD548199S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD602885S1 (en) * 2008-04-04 2009-10-27 Capres A/S Connector for a microchip probe
USD658602S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD785609S1 (en) * 2016-01-06 2017-05-02 Symbol Technologies, Llc WLAN module
USD791748S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc Locationing module
USD791747S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc RFID module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4940849A (en) * 1985-10-25 1990-07-10 Oxley Developments Company Limited Metallizing paste
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
US5098769A (en) * 1989-10-26 1992-03-24 Polyplastics Co., Ltd. Two-shot molded article for use in circuit formation
US6049122A (en) * 1997-10-16 2000-04-11 Fujitsu Limited Flip chip mounting substrate with resin filled between substrate and semiconductor chip
USD473198S1 (en) * 2001-10-26 2003-04-15 Kabushiki Kaisha Toshiba Semiconductor device
US20060055016A1 (en) * 2004-09-10 2006-03-16 Aiptek International Inc. Chip package assembly produced thereby
US20060154405A1 (en) * 2002-08-29 2006-07-13 Kinsman Larry D Methods of fabrication for flip-chip image sensor packages

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4940849A (en) * 1985-10-25 1990-07-10 Oxley Developments Company Limited Metallizing paste
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
US5098769A (en) * 1989-10-26 1992-03-24 Polyplastics Co., Ltd. Two-shot molded article for use in circuit formation
US6049122A (en) * 1997-10-16 2000-04-11 Fujitsu Limited Flip chip mounting substrate with resin filled between substrate and semiconductor chip
USD473198S1 (en) * 2001-10-26 2003-04-15 Kabushiki Kaisha Toshiba Semiconductor device
US20060154405A1 (en) * 2002-08-29 2006-07-13 Kinsman Larry D Methods of fabrication for flip-chip image sensor packages
US20060055016A1 (en) * 2004-09-10 2006-03-16 Aiptek International Inc. Chip package assembly produced thereby

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD573731S1 (en) * 2006-06-20 2008-07-22 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD602885S1 (en) * 2008-04-04 2009-10-27 Capres A/S Connector for a microchip probe
USD658602S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD785609S1 (en) * 2016-01-06 2017-05-02 Symbol Technologies, Llc WLAN module
USD791748S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc Locationing module
USD791747S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc RFID module

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