USD514531S1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
USD514531S1
USD514531S1 US29/173,580 US17358003F USD514531S US D514531 S1 USD514531 S1 US D514531S1 US 17358003 F US17358003 F US 17358003F US D514531 S USD514531 S US D514531S
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US
United States
Prior art keywords
optical module
elevational view
view
side elevational
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/173,580
Inventor
Shinichi Takagi
Hiroshi Aruga
Kiyohide Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARUGA, HIROSHI, SAKAI, KIYOHIDE, TAKAGI, SHINICHI
Application granted granted Critical
Publication of USD514531S1 publication Critical patent/USD514531S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a optical module, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical module, showing our new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a bottom plan view thereof; and,
FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.
The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an optical module, as shown and described.
US29/173,580 2002-07-10 2003-01-03 Optical module Expired - Lifetime USD514531S1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2002018485 2002-07-10
JP2002018486 2002-07-10
JP2002-018484 2002-07-10
JP2002018484 2002-07-10
JP2002018483 2002-07-10
JP2002-018486 2002-07-10
JP2002-018485 2002-07-10
JP2002-018483 2002-07-10

Publications (1)

Publication Number Publication Date
USD514531S1 true USD514531S1 (en) 2006-02-07

Family

ID=35734671

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/173,580 Expired - Lifetime USD514531S1 (en) 2002-07-10 2003-01-03 Optical module

Country Status (1)

Country Link
US (1) USD514531S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8611094B2 (en) 2010-07-08 2013-12-17 Mitsubishi Electric Corporation Optical module
USD769230S1 (en) * 2015-01-22 2016-10-18 Samsung Electronics Co., Ltd. Optical repeater
USD879768S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Cp., Ltd. Optical communication module
USD879767S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Co., Ltd. Optical communication module
USD1069740S1 (en) * 2023-01-19 2025-04-08 Wingcomm Co. Ltd. Optical engine
USD1077762S1 (en) * 2023-01-19 2025-06-03 Wingcomm Co. Ltd. Optical engine

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089861A (en) * 1990-05-09 1992-02-18 Rohm Co., Ltd. Semiconductor laser device with mounting block
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device
US6157012A (en) * 1998-09-07 2000-12-05 Nippon Sheet Glass Co., Ltd. Method of manufacturing an optical module using multiple applications of thermosetting resins and multiple heating processes
US6181720B1 (en) * 1997-01-16 2001-01-30 Nec Corporation Semiconductor laser device and method for manufacturing same
US20020003705A1 (en) * 2000-07-07 2002-01-10 Hiroyuki Tanaka Method of producing an optical module
USD483338S1 (en) * 2002-07-10 2003-12-09 Mitsubishi Denki Kabushiki Kaisha Optical module
USD484105S1 (en) * 2002-07-10 2003-12-23 Mitsubishi Denki Kabushiki Kaisha Optical module
US6750535B2 (en) * 2002-04-18 2004-06-15 Hon Hai Precision Ind. Co., Ltd. Package for enclosing a laser diode module
USD494147S1 (en) * 2002-07-10 2004-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
US20040264888A1 (en) * 2003-04-30 2004-12-30 Sumitomo Electric Industries, Ltd. Optical module having individual housing for an optical processing unit and an optical sub-assembly

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089861A (en) * 1990-05-09 1992-02-18 Rohm Co., Ltd. Semiconductor laser device with mounting block
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device
US6181720B1 (en) * 1997-01-16 2001-01-30 Nec Corporation Semiconductor laser device and method for manufacturing same
US6157012A (en) * 1998-09-07 2000-12-05 Nippon Sheet Glass Co., Ltd. Method of manufacturing an optical module using multiple applications of thermosetting resins and multiple heating processes
US20020003705A1 (en) * 2000-07-07 2002-01-10 Hiroyuki Tanaka Method of producing an optical module
US6750535B2 (en) * 2002-04-18 2004-06-15 Hon Hai Precision Ind. Co., Ltd. Package for enclosing a laser diode module
USD483338S1 (en) * 2002-07-10 2003-12-09 Mitsubishi Denki Kabushiki Kaisha Optical module
USD484105S1 (en) * 2002-07-10 2003-12-23 Mitsubishi Denki Kabushiki Kaisha Optical module
USD494147S1 (en) * 2002-07-10 2004-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
US20040264888A1 (en) * 2003-04-30 2004-12-30 Sumitomo Electric Industries, Ltd. Optical module having individual housing for an optical processing unit and an optical sub-assembly

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
NEC Compound Semiconductor Devices, "Data Sheet, laser Diode NX7313UA NEC", 10 pages, 2002.
Patent Abstracts of Japan, JP 05-129461, May 25, 1993.
Patent Abstracts of Japan, JP 07-176649, Jul. 14, 1995.
Patent Abstracts of Japan, JP 08-031970, Feb. 2, 1996.
Patent Abstracts of Japan, JP 10-284640, Oct. 23, 1998.
Patent Abstracts of Japan, JP 11-087577, Mar. 30, 1999.
Product Overview, wysiwyg://mainframe.1101/http://www.shinko.co.jp/e.product/e.glass/e.glass.4.htm, "Glass-to-Metal Seals", 2 pages, 2001-2002.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8611094B2 (en) 2010-07-08 2013-12-17 Mitsubishi Electric Corporation Optical module
USD769230S1 (en) * 2015-01-22 2016-10-18 Samsung Electronics Co., Ltd. Optical repeater
USD879768S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Cp., Ltd. Optical communication module
USD879767S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Co., Ltd. Optical communication module
USD1069740S1 (en) * 2023-01-19 2025-04-08 Wingcomm Co. Ltd. Optical engine
USD1077762S1 (en) * 2023-01-19 2025-06-03 Wingcomm Co. Ltd. Optical engine

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