USD511331S1 - Optoelectronic IC package - Google Patents

Optoelectronic IC package Download PDF

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Publication number
USD511331S1
USD511331S1 US29/191,635 US19163503F USD511331S US D511331 S1 USD511331 S1 US D511331S1 US 19163503 F US19163503 F US 19163503F US D511331 S USD511331 S US D511331S
Authority
US
United States
Prior art keywords
optoelectronic
package
view
ornamental design
drawings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/191,635
Inventor
Shogo Horinouchi
Hideki Ohyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HORINOUCHI, SHOGO, OHYAMA, HIDEKI
Application granted granted Critical
Publication of USD511331S1 publication Critical patent/USD511331S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top perspective view of an optoelectronic IC package of the present invention;
FIG. 2 is a first side view thereof;
FIG. 3 is a second side view thereof;
FIG. 4 is a third side view thereof;
FIG. 5 is a top view thereof; and,
FIG. 6 is a fourth side view thereof.
The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. We claim the ornamental design for an optoelectronic IC package, as shown and described.
US29/191,635 2003-07-09 2003-10-10 Optoelectronic IC package Expired - Lifetime USD511331S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-019764 2003-07-09
JP2003019764 2003-07-09

Publications (1)

Publication Number Publication Date
USD511331S1 true USD511331S1 (en) 2005-11-08

Family

ID=35207278

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/191,635 Expired - Lifetime USD511331S1 (en) 2003-07-09 2003-10-10 Optoelectronic IC package

Country Status (2)

Country Link
US (1) USD511331S1 (en)
TW (1) TWD100418S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100264436A1 (en) * 2009-04-17 2010-10-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. PLCC Package With A Reflector Cup Surrounded By A Single Encapsulant
US20100264437A1 (en) * 2009-04-17 2010-10-21 Avago Technologies Ecbu Ip (Singapore) Pte.Ltd. PLCC Package With A Reflector Cup Surrounded By An Encapsulant
USD1056862S1 (en) * 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package
US12224218B2 (en) 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5218223A (en) * 1989-05-19 1993-06-08 Siemens Aktiengesellschaft Opto-electronic semiconductor component
US5679976A (en) * 1993-06-14 1997-10-21 Polyplastics Co., Ltd. Molded electric parts and method of manufacturing the same
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US20010040300A1 (en) * 1998-07-24 2001-11-15 Chien-Ping Huang Semiconductor package with heat dissipation opening
US6328483B1 (en) * 1997-02-14 2001-12-11 Ixas Conseil Electronic or optoelectronic housing with ceramic insert
US6355946B1 (en) * 1998-12-16 2002-03-12 Rohm Co., Ltd. Semiconductor device with reflector
US6570190B2 (en) * 1997-06-03 2003-05-27 Lumileds Lighting, U.S., Llc LED having angled sides for increased side light extraction
USD476961S1 (en) * 2002-04-12 2003-07-08 Citizen Electronics Co., Ltd. Light-emitting diode
US6642449B2 (en) * 2000-01-26 2003-11-04 Tdk Corporation Electronic component and manufacturing method thereof
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20040201987A1 (en) * 2003-04-09 2004-10-14 Citizen Electronics Co., Ltd. LED lamp

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5218223A (en) * 1989-05-19 1993-06-08 Siemens Aktiengesellschaft Opto-electronic semiconductor component
US5679976A (en) * 1993-06-14 1997-10-21 Polyplastics Co., Ltd. Molded electric parts and method of manufacturing the same
US6328483B1 (en) * 1997-02-14 2001-12-11 Ixas Conseil Electronic or optoelectronic housing with ceramic insert
US6570190B2 (en) * 1997-06-03 2003-05-27 Lumileds Lighting, U.S., Llc LED having angled sides for increased side light extraction
US20010040300A1 (en) * 1998-07-24 2001-11-15 Chien-Ping Huang Semiconductor package with heat dissipation opening
US6355946B1 (en) * 1998-12-16 2002-03-12 Rohm Co., Ltd. Semiconductor device with reflector
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US6642449B2 (en) * 2000-01-26 2003-11-04 Tdk Corporation Electronic component and manufacturing method thereof
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
USD476961S1 (en) * 2002-04-12 2003-07-08 Citizen Electronics Co., Ltd. Light-emitting diode
US20040201987A1 (en) * 2003-04-09 2004-10-14 Citizen Electronics Co., Ltd. LED lamp

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100264436A1 (en) * 2009-04-17 2010-10-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. PLCC Package With A Reflector Cup Surrounded By A Single Encapsulant
US20100264437A1 (en) * 2009-04-17 2010-10-21 Avago Technologies Ecbu Ip (Singapore) Pte.Ltd. PLCC Package With A Reflector Cup Surrounded By An Encapsulant
US8089075B2 (en) * 2009-04-17 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LFCC package with a reflector cup surrounded by a single encapsulant
US8101955B2 (en) * 2009-04-17 2012-01-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. PLCC package with a reflector cup surrounded by an encapsulant
US12224218B2 (en) 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1056862S1 (en) * 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package

Also Published As

Publication number Publication date
TWD100418S1 (en) 2004-09-21

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