USD509486S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD509486S1
USD509486S1 US29/220,423 US22042304F USD509486S US D509486 S1 USD509486 S1 US D509486S1 US 22042304 F US22042304 F US 22042304F US D509486 S USD509486 S US D509486S
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US
United States
Prior art keywords
heat sink
view
elevational view
ornamental design
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/220,423
Inventor
Fang-Xiang Yu
Meng-Tzu Lee
Shu-Ho Lin
Ming-Kun Cao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Priority to US29/220,423 priority Critical patent/USD509486S1/en
Assigned to HON HAI PRECISION IND. CO., LTD. reassignment HON HAI PRECISION IND. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CAO, Ming-kun, LEE, MENG-TZU, LIN, SHU-HO, YU, FANG-XIANG
Application granted granted Critical
Publication of USD509486S1 publication Critical patent/USD509486S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is an isometric view of a heat sink showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is similar to FIG. 1, but shown in a second state; and,
FIG. 9 shows the heat sink of FIG. 1 being mounted to a retention module and having a fan mounted thereon, wherein the retention module and the fan are shown for illustrative purpose only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a heat sink, as shown and described.
US29/220,423 2004-12-29 2004-12-29 Heat sink Expired - Lifetime USD509486S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/220,423 USD509486S1 (en) 2004-12-29 2004-12-29 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/220,423 USD509486S1 (en) 2004-12-29 2004-12-29 Heat sink

Publications (1)

Publication Number Publication Date
USD509486S1 true USD509486S1 (en) 2005-09-13

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ID=34910568

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/220,423 Expired - Lifetime USD509486S1 (en) 2004-12-29 2004-12-29 Heat sink

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US (1) USD509486S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD541758S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD567192S1 (en) * 2007-05-04 2008-04-22 Asia Vital Components Co., Ltd. Heat sink
USD581883S1 (en) * 2007-05-04 2008-12-02 Asia Vital Components Co., Ltd. Heat sink

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118661A (en) * 1999-07-02 2000-09-12 Foxconn Precision Components Co., Ltd. Clip for retaining a heat sink on a chip
US6556443B1 (en) * 2000-03-13 2003-04-29 Wen Chen Wei Heat dissipation device coupling structure
US6731504B1 (en) * 2003-01-17 2004-05-04 A-Sheng Liu Heat sink fastener
US6798663B1 (en) * 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location
US6816373B2 (en) * 2002-10-04 2004-11-09 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118661A (en) * 1999-07-02 2000-09-12 Foxconn Precision Components Co., Ltd. Clip for retaining a heat sink on a chip
US6556443B1 (en) * 2000-03-13 2003-04-29 Wen Chen Wei Heat dissipation device coupling structure
US6816373B2 (en) * 2002-10-04 2004-11-09 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device
US6731504B1 (en) * 2003-01-17 2004-05-04 A-Sheng Liu Heat sink fastener
US6798663B1 (en) * 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD541758S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD567192S1 (en) * 2007-05-04 2008-04-22 Asia Vital Components Co., Ltd. Heat sink
USD581883S1 (en) * 2007-05-04 2008-12-02 Asia Vital Components Co., Ltd. Heat sink

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