USD505664S1 - Optical package - Google Patents

Optical package Download PDF

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Publication number
USD505664S1
USD505664S1 US29/173,579 US17357903F USD505664S US D505664 S1 USD505664 S1 US D505664S1 US 17357903 F US17357903 F US 17357903F US D505664 S USD505664 S US D505664S
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US
United States
Prior art keywords
optical package
elevational view
view
side elevational
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/173,579
Inventor
Shinichi Takagi
Hiroshi Aruga
Kiyohide Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARUGA, HIROSHI, SAKAI, KIYOHIDE, TAKAGI, SHINICHI
Application granted granted Critical
Publication of USD505664S1 publication Critical patent/USD505664S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a optical package, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical package, showing our new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a bottom plan view thereof;
FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 13 is a front, top and right side perspective view of a third embodiment of the optical package, showing our new design;
FIG. 14 is a front elevational view thereof;
FIG. 15 is a rear elevational view thereof;
FIG. 16 is a top plan view thereof;
FIG. 17 is a bottom plan view thereof; and,
FIG. 18 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.
The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a optical package, as shown and described.
US29/173,579 2002-07-10 2003-01-03 Optical package Expired - Lifetime USD505664S1 (en)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2002-018458 2002-01-28
JP2002-018455 2002-01-28
JP2002-018460 2002-01-28
JP2002018459 2002-07-10
JP2002-018454 2002-07-10
JP2002-018456 2002-07-10
JP2002018455 2002-07-10
JP2002-018457 2002-07-10
JP2002018460 2002-07-10
JP2002018456 2002-07-10
JP2002018458 2002-07-10
JP2002-018459 2002-07-10
JP2002018454 2002-07-10
JP2002018457 2002-07-10

Publications (1)

Publication Number Publication Date
USD505664S1 true USD505664S1 (en) 2005-05-31

Family

ID=34596257

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/173,579 Expired - Lifetime USD505664S1 (en) 2002-07-10 2003-01-03 Optical package

Country Status (1)

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US (1) USD505664S1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040247004A1 (en) * 2003-06-04 2004-12-09 Yong-Chan Keh Optical element module package and method for manufacturing the same
US8611094B2 (en) 2010-07-08 2013-12-17 Mitsubishi Electric Corporation Optical module
US10431955B2 (en) * 2014-04-25 2019-10-01 Lmd Power Of Light Corp Laser core having conductive mass electrical connection
USD879768S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Cp., Ltd. Optical communication module
USD879767S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Co., Ltd. Optical communication module
USD908646S1 (en) * 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
US20210184056A1 (en) * 2019-12-17 2021-06-17 CIG Photonics Japan Limited Optical module
US11340412B2 (en) * 2020-02-28 2022-05-24 CIG Photonics Japan Limited Optical module
USD1009943S1 (en) * 2022-03-22 2024-01-02 Schott Ag Air bag detonator
USD1069740S1 (en) * 2023-01-19 2025-04-08 Wingcomm Co. Ltd. Optical engine
USD1077762S1 (en) * 2023-01-19 2025-06-03 Wingcomm Co. Ltd. Optical engine

Citations (9)

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Publication number Priority date Publication date Assignee Title
US4768070A (en) * 1986-03-20 1988-08-30 Hitachi, Ltd Optoelectronics device
US5052009A (en) * 1989-08-18 1991-09-24 Sony Corporation Semiconductor laser device and process of assembling the same
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device
US5814871A (en) * 1996-08-15 1998-09-29 Fujitsu Ltd. Optical semiconductor assembly having a conductive float pad
US6181720B1 (en) * 1997-01-16 2001-01-30 Nec Corporation Semiconductor laser device and method for manufacturing same
US6479889B1 (en) * 1998-09-04 2002-11-12 Sony Corporation Semiconductor device package, and fabrication method thereof
US6577656B2 (en) * 2001-03-13 2003-06-10 Finisar Corporation System and method of packaging a laser/detector
USD476296S1 (en) * 2001-09-06 2003-06-24 Sharp Kabushiki Kaisha Semiconductor device
US6587491B1 (en) * 1999-10-06 2003-07-01 Rohm Co., Ltd. Semiconductor laser

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4768070A (en) * 1986-03-20 1988-08-30 Hitachi, Ltd Optoelectronics device
US5052009A (en) * 1989-08-18 1991-09-24 Sony Corporation Semiconductor laser device and process of assembling the same
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device
US5814871A (en) * 1996-08-15 1998-09-29 Fujitsu Ltd. Optical semiconductor assembly having a conductive float pad
US6181720B1 (en) * 1997-01-16 2001-01-30 Nec Corporation Semiconductor laser device and method for manufacturing same
US6479889B1 (en) * 1998-09-04 2002-11-12 Sony Corporation Semiconductor device package, and fabrication method thereof
US6587491B1 (en) * 1999-10-06 2003-07-01 Rohm Co., Ltd. Semiconductor laser
US6577656B2 (en) * 2001-03-13 2003-06-10 Finisar Corporation System and method of packaging a laser/detector
USD476296S1 (en) * 2001-09-06 2003-06-24 Sharp Kabushiki Kaisha Semiconductor device

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
Patent Abstracts of Japan, JP 05-129461, May 25, 1993.
Patent Abstracts of Japan, JP 08-031970, Feb. 2, 1996.
Patent Abstracts of Japan, JP 10-284640, Oct. 23, 1998.
Patent Abstracts of Japan, JP 11-087577, Mar. 30, 1999.
Patent Abstracts of Japan, JP-07-176649, Jul. 14, 1995.
Product Overview, wysiwyg://mainframe.1101/http://www.shinko.co.jp/e.product/e.glass/e.glass.4.htm, "Glass-to-Metal Seals", 2 pages, 2001-2002.

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158550B2 (en) * 2003-06-04 2007-01-02 Samsung Electronics Co., Ltd. Optical element module package and method for manufacturing the same
US20040247004A1 (en) * 2003-06-04 2004-12-09 Yong-Chan Keh Optical element module package and method for manufacturing the same
US8611094B2 (en) 2010-07-08 2013-12-17 Mitsubishi Electric Corporation Optical module
US10431955B2 (en) * 2014-04-25 2019-10-01 Lmd Power Of Light Corp Laser core having conductive mass electrical connection
USD909318S1 (en) * 2017-03-30 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
USD909317S1 (en) * 2017-03-30 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
USD908646S1 (en) * 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
USD908647S1 (en) * 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
USD879768S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Cp., Ltd. Optical communication module
USD879767S1 (en) * 2017-05-30 2020-03-31 Kohoku Kogyo Co., Ltd. Optical communication module
US20210184056A1 (en) * 2019-12-17 2021-06-17 CIG Photonics Japan Limited Optical module
US11456393B2 (en) * 2019-12-17 2022-09-27 CIG Photonics Japan Limited Optical module
US11340412B2 (en) * 2020-02-28 2022-05-24 CIG Photonics Japan Limited Optical module
USD1009943S1 (en) * 2022-03-22 2024-01-02 Schott Ag Air bag detonator
USD1069740S1 (en) * 2023-01-19 2025-04-08 Wingcomm Co. Ltd. Optical engine
USD1077762S1 (en) * 2023-01-19 2025-06-03 Wingcomm Co. Ltd. Optical engine

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