USD505664S1 - Optical package - Google Patents
Optical package Download PDFInfo
- Publication number
- USD505664S1 USD505664S1 US29/173,579 US17357903F USD505664S US D505664 S1 USD505664 S1 US D505664S1 US 17357903 F US17357903 F US 17357903F US D505664 S USD505664 S US D505664S
- Authority
- US
- United States
- Prior art keywords
- optical package
- elevational view
- view
- side elevational
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 is a front, top and right side perspective view of a optical package, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical package, showing our new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a bottom plan view thereof;
FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 13 is a front, top and right side perspective view of a third embodiment of the optical package, showing our new design;
FIG. 14 is a front elevational view thereof;
FIG. 15 is a rear elevational view thereof;
FIG. 16 is a top plan view thereof;
FIG. 17 is a bottom plan view thereof; and,
FIG. 18 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.
The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a optical package, as shown and described.
Applications Claiming Priority (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-018458 | 2002-01-28 | ||
| JP2002-018455 | 2002-01-28 | ||
| JP2002-018460 | 2002-01-28 | ||
| JP2002018459 | 2002-07-10 | ||
| JP2002-018454 | 2002-07-10 | ||
| JP2002-018456 | 2002-07-10 | ||
| JP2002018455 | 2002-07-10 | ||
| JP2002-018457 | 2002-07-10 | ||
| JP2002018460 | 2002-07-10 | ||
| JP2002018456 | 2002-07-10 | ||
| JP2002018458 | 2002-07-10 | ||
| JP2002-018459 | 2002-07-10 | ||
| JP2002018454 | 2002-07-10 | ||
| JP2002018457 | 2002-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD505664S1 true USD505664S1 (en) | 2005-05-31 |
Family
ID=34596257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/173,579 Expired - Lifetime USD505664S1 (en) | 2002-07-10 | 2003-01-03 | Optical package |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD505664S1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040247004A1 (en) * | 2003-06-04 | 2004-12-09 | Yong-Chan Keh | Optical element module package and method for manufacturing the same |
| US8611094B2 (en) | 2010-07-08 | 2013-12-17 | Mitsubishi Electric Corporation | Optical module |
| US10431955B2 (en) * | 2014-04-25 | 2019-10-01 | Lmd Power Of Light Corp | Laser core having conductive mass electrical connection |
| USD879768S1 (en) * | 2017-05-30 | 2020-03-31 | Kohoku Kogyo Cp., Ltd. | Optical communication module |
| USD879767S1 (en) * | 2017-05-30 | 2020-03-31 | Kohoku Kogyo Co., Ltd. | Optical communication module |
| USD908646S1 (en) * | 2017-03-30 | 2021-01-26 | Mitsubishi Electric Corporation | Semiconductor package |
| US20210184056A1 (en) * | 2019-12-17 | 2021-06-17 | CIG Photonics Japan Limited | Optical module |
| US11340412B2 (en) * | 2020-02-28 | 2022-05-24 | CIG Photonics Japan Limited | Optical module |
| USD1009943S1 (en) * | 2022-03-22 | 2024-01-02 | Schott Ag | Air bag detonator |
| USD1069740S1 (en) * | 2023-01-19 | 2025-04-08 | Wingcomm Co. Ltd. | Optical engine |
| USD1077762S1 (en) * | 2023-01-19 | 2025-06-03 | Wingcomm Co. Ltd. | Optical engine |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4768070A (en) * | 1986-03-20 | 1988-08-30 | Hitachi, Ltd | Optoelectronics device |
| US5052009A (en) * | 1989-08-18 | 1991-09-24 | Sony Corporation | Semiconductor laser device and process of assembling the same |
| US5252856A (en) * | 1990-09-26 | 1993-10-12 | Nec Corporation | Optical semiconductor device |
| US5814871A (en) * | 1996-08-15 | 1998-09-29 | Fujitsu Ltd. | Optical semiconductor assembly having a conductive float pad |
| US6181720B1 (en) * | 1997-01-16 | 2001-01-30 | Nec Corporation | Semiconductor laser device and method for manufacturing same |
| US6479889B1 (en) * | 1998-09-04 | 2002-11-12 | Sony Corporation | Semiconductor device package, and fabrication method thereof |
| US6577656B2 (en) * | 2001-03-13 | 2003-06-10 | Finisar Corporation | System and method of packaging a laser/detector |
| USD476296S1 (en) * | 2001-09-06 | 2003-06-24 | Sharp Kabushiki Kaisha | Semiconductor device |
| US6587491B1 (en) * | 1999-10-06 | 2003-07-01 | Rohm Co., Ltd. | Semiconductor laser |
-
2003
- 2003-01-03 US US29/173,579 patent/USD505664S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4768070A (en) * | 1986-03-20 | 1988-08-30 | Hitachi, Ltd | Optoelectronics device |
| US5052009A (en) * | 1989-08-18 | 1991-09-24 | Sony Corporation | Semiconductor laser device and process of assembling the same |
| US5252856A (en) * | 1990-09-26 | 1993-10-12 | Nec Corporation | Optical semiconductor device |
| US5814871A (en) * | 1996-08-15 | 1998-09-29 | Fujitsu Ltd. | Optical semiconductor assembly having a conductive float pad |
| US6181720B1 (en) * | 1997-01-16 | 2001-01-30 | Nec Corporation | Semiconductor laser device and method for manufacturing same |
| US6479889B1 (en) * | 1998-09-04 | 2002-11-12 | Sony Corporation | Semiconductor device package, and fabrication method thereof |
| US6587491B1 (en) * | 1999-10-06 | 2003-07-01 | Rohm Co., Ltd. | Semiconductor laser |
| US6577656B2 (en) * | 2001-03-13 | 2003-06-10 | Finisar Corporation | System and method of packaging a laser/detector |
| USD476296S1 (en) * | 2001-09-06 | 2003-06-24 | Sharp Kabushiki Kaisha | Semiconductor device |
Non-Patent Citations (6)
| Title |
|---|
| Patent Abstracts of Japan, JP 05-129461, May 25, 1993. |
| Patent Abstracts of Japan, JP 08-031970, Feb. 2, 1996. |
| Patent Abstracts of Japan, JP 10-284640, Oct. 23, 1998. |
| Patent Abstracts of Japan, JP 11-087577, Mar. 30, 1999. |
| Patent Abstracts of Japan, JP-07-176649, Jul. 14, 1995. |
| Product Overview, wysiwyg://mainframe.1101/http://www.shinko.co.jp/e.product/e.glass/e.glass.4.htm, "Glass-to-Metal Seals", 2 pages, 2001-2002. |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158550B2 (en) * | 2003-06-04 | 2007-01-02 | Samsung Electronics Co., Ltd. | Optical element module package and method for manufacturing the same |
| US20040247004A1 (en) * | 2003-06-04 | 2004-12-09 | Yong-Chan Keh | Optical element module package and method for manufacturing the same |
| US8611094B2 (en) | 2010-07-08 | 2013-12-17 | Mitsubishi Electric Corporation | Optical module |
| US10431955B2 (en) * | 2014-04-25 | 2019-10-01 | Lmd Power Of Light Corp | Laser core having conductive mass electrical connection |
| USD909318S1 (en) * | 2017-03-30 | 2021-02-02 | Mitsubishi Electric Corporation | Semiconductor package |
| USD909317S1 (en) * | 2017-03-30 | 2021-02-02 | Mitsubishi Electric Corporation | Semiconductor package |
| USD908646S1 (en) * | 2017-03-30 | 2021-01-26 | Mitsubishi Electric Corporation | Semiconductor package |
| USD908647S1 (en) * | 2017-03-30 | 2021-01-26 | Mitsubishi Electric Corporation | Semiconductor package |
| USD879768S1 (en) * | 2017-05-30 | 2020-03-31 | Kohoku Kogyo Cp., Ltd. | Optical communication module |
| USD879767S1 (en) * | 2017-05-30 | 2020-03-31 | Kohoku Kogyo Co., Ltd. | Optical communication module |
| US20210184056A1 (en) * | 2019-12-17 | 2021-06-17 | CIG Photonics Japan Limited | Optical module |
| US11456393B2 (en) * | 2019-12-17 | 2022-09-27 | CIG Photonics Japan Limited | Optical module |
| US11340412B2 (en) * | 2020-02-28 | 2022-05-24 | CIG Photonics Japan Limited | Optical module |
| USD1009943S1 (en) * | 2022-03-22 | 2024-01-02 | Schott Ag | Air bag detonator |
| USD1069740S1 (en) * | 2023-01-19 | 2025-04-08 | Wingcomm Co. Ltd. | Optical engine |
| USD1077762S1 (en) * | 2023-01-19 | 2025-06-03 | Wingcomm Co. Ltd. | Optical engine |
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