USD487885S1 - Heat pipe heat sink assembly - Google Patents

Heat pipe heat sink assembly Download PDF

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Publication number
USD487885S1
USD487885S1 US29/180,906 US18090603F USD487885S US D487885 S1 USD487885 S1 US D487885S1 US 18090603 F US18090603 F US 18090603F US D487885 S USD487885 S US D487885S
Authority
US
United States
Prior art keywords
sink assembly
heat
heat sink
heat pipe
pipe heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/180,906
Inventor
Wei-Feng Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Datech Technology Co Ltd
Original Assignee
Datech Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datech Technology Co Ltd filed Critical Datech Technology Co Ltd
Assigned to DATECH TECHNOLOGY CO., LTD. reassignment DATECH TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FAN, WEI-FENG
Application granted granted Critical
Publication of USD487885S1 publication Critical patent/USD487885S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat pipe heat sink assembly, in accordance with the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a heat pipe heat sink assembly, as shown and described.
US29/180,906 2003-03-14 2003-05-02 Heat pipe heat sink assembly Expired - Lifetime USD487885S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW092301452 2003-03-14
TW92301452 2003-03-14

Publications (1)

Publication Number Publication Date
USD487885S1 true USD487885S1 (en) 2004-03-30

Family

ID=31989848

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/180,906 Expired - Lifetime USD487885S1 (en) 2003-03-14 2003-05-02 Heat pipe heat sink assembly

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US (1) USD487885S1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040066628A1 (en) * 2001-07-26 2004-04-08 Jefferson Liu Rapidly self-heat-conductive heat-dissipating module
USD530682S1 (en) * 2005-08-04 2006-10-24 Molex Incorporated Heat sink fins
USD533145S1 (en) * 2005-08-04 2006-12-05 Molex Incorporated Heat sink
USD551633S1 (en) * 2005-08-04 2007-09-25 Molex Incorporated Heat sink fins
US20090154105A1 (en) * 2007-12-18 2009-06-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
USD663276S1 (en) * 2011-06-22 2012-07-10 Foxconn Technology Co., Ltd. Cooling fin
USD664102S1 (en) * 2011-09-28 2012-07-24 Foxconn Technology Co., Ltd. Cooling fin
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5704419A (en) 1995-06-30 1998-01-06 International Business Machines Corporation Air flow distribution in integrated circuit spot coolers
US6263957B1 (en) 2000-01-13 2001-07-24 Lucent Technologies Inc. Integrated active cooling device for board mounted electric components
US6394175B1 (en) 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6414846B1 (en) 2001-02-20 2002-07-02 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6434004B1 (en) 2000-10-11 2002-08-13 International Business Machines Corporation Heat sink assembly
USD475354S1 (en) 2001-12-21 2003-06-03 Tung-Yuan Wang Heat pipe of radiator of computer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5704419A (en) 1995-06-30 1998-01-06 International Business Machines Corporation Air flow distribution in integrated circuit spot coolers
US6263957B1 (en) 2000-01-13 2001-07-24 Lucent Technologies Inc. Integrated active cooling device for board mounted electric components
US6394175B1 (en) 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6434004B1 (en) 2000-10-11 2002-08-13 International Business Machines Corporation Heat sink assembly
US6414846B1 (en) 2001-02-20 2002-07-02 Foxconn Precision Components Co., Ltd. Heat sink assembly
USD475354S1 (en) 2001-12-21 2003-06-03 Tung-Yuan Wang Heat pipe of radiator of computer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040066628A1 (en) * 2001-07-26 2004-04-08 Jefferson Liu Rapidly self-heat-conductive heat-dissipating module
USD530682S1 (en) * 2005-08-04 2006-10-24 Molex Incorporated Heat sink fins
USD533145S1 (en) * 2005-08-04 2006-12-05 Molex Incorporated Heat sink
USD551633S1 (en) * 2005-08-04 2007-09-25 Molex Incorporated Heat sink fins
US20090154105A1 (en) * 2007-12-18 2009-06-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
US7643293B2 (en) * 2007-12-18 2010-01-05 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
USD663276S1 (en) * 2011-06-22 2012-07-10 Foxconn Technology Co., Ltd. Cooling fin
USD664102S1 (en) * 2011-09-28 2012-07-24 Foxconn Technology Co., Ltd. Cooling fin
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink

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