USD486129S1 - Heat pipe heat sink assembly - Google Patents

Heat pipe heat sink assembly Download PDF

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Publication number
USD486129S1
USD486129S1 US29/174,038 US17403803F USD486129S US D486129 S1 USD486129 S1 US D486129S1 US 17403803 F US17403803 F US 17403803F US D486129 S USD486129 S US D486129S
Authority
US
United States
Prior art keywords
sink assembly
heat
heat sink
heat pipe
pipe heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/174,038
Inventor
Chun-Chi Chen
Jianjun Zhang
Chin Hsien Lan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION IND. CO., LTD. reassignment HON HAI PRECISION IND. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUN-CHI, LAN, CHIN HSIEN, ZHANG, JIANJUN
Application granted granted Critical
Publication of USD486129S1 publication Critical patent/USD486129S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat pipe heat sink assembly showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a heat pipe heat sink assembly, as shown and described.
US29/174,038 2002-10-11 2003-01-09 Heat pipe heat sink assembly Expired - Lifetime USD486129S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN02362903 2002-10-11
CN02362903 2002-10-11

Publications (1)

Publication Number Publication Date
USD486129S1 true USD486129S1 (en) 2004-02-03

Family

ID=30122418

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/174,038 Expired - Lifetime USD486129S1 (en) 2002-10-11 2003-01-09 Heat pipe heat sink assembly

Country Status (1)

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US (1) USD486129S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD541758S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD1033417S1 (en) * 2021-10-15 2024-07-02 Siemens Aktiengesellschaft Computer
USD1038110S1 (en) 2021-10-15 2024-08-06 Siemens Aktiengesellschaft Computer
USD1046842S1 (en) * 2021-09-28 2024-10-15 Siemens Aktiengesellschaft Computer
USD1055906S1 (en) * 2021-10-15 2024-12-31 Siemens Aktiengesellschaft Computer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD400188S (en) 1997-05-22 1998-10-27 Hon Hai Precision Ind. Co., Ltd. Heat sink
US6269003B1 (en) 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6341644B1 (en) 2000-07-01 2002-01-29 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6397941B1 (en) 1999-12-01 2002-06-04 Cool Options, Inc. Net-shape molded heat exchanger
US6401810B1 (en) 2001-08-16 2002-06-11 Chaun-Choung Technology Corp. Retaining structure of heat-radiating fins
US6538889B1 (en) 2001-09-20 2003-03-25 Hewlett-Packard Company Heat dissipation device retention assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD400188S (en) 1997-05-22 1998-10-27 Hon Hai Precision Ind. Co., Ltd. Heat sink
US6397941B1 (en) 1999-12-01 2002-06-04 Cool Options, Inc. Net-shape molded heat exchanger
US6269003B1 (en) 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6341644B1 (en) 2000-07-01 2002-01-29 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6401810B1 (en) 2001-08-16 2002-06-11 Chaun-Choung Technology Corp. Retaining structure of heat-radiating fins
US6538889B1 (en) 2001-09-20 2003-03-25 Hewlett-Packard Company Heat dissipation device retention assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD541758S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD1046842S1 (en) * 2021-09-28 2024-10-15 Siemens Aktiengesellschaft Computer
USD1033417S1 (en) * 2021-10-15 2024-07-02 Siemens Aktiengesellschaft Computer
USD1038110S1 (en) 2021-10-15 2024-08-06 Siemens Aktiengesellschaft Computer
USD1055906S1 (en) * 2021-10-15 2024-12-31 Siemens Aktiengesellschaft Computer
USD1061508S1 (en) * 2021-10-15 2025-02-11 Siemens Aktiengesellschaft Computer

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