USD485241S1 - Radiator for a heat generating components in electronic equipment - Google Patents

Radiator for a heat generating components in electronic equipment Download PDF

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Publication number
USD485241S1
USD485241S1 US29/177,544 US17754403F USD485241S US D485241 S1 USD485241 S1 US D485241S1 US 17754403 F US17754403 F US 17754403F US D485241 S USD485241 S US D485241S
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United States
Prior art keywords
radiator
electronic equipment
heat generating
generating components
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/177,544
Inventor
Sang-Cheol Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US29/177,544 priority Critical patent/USD485241S1/en
Assigned to ZALMAN TECH CO., LTD. reassignment ZALMAN TECH CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, SANG-CHEOL
Application granted granted Critical
Publication of USD485241S1 publication Critical patent/USD485241S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a radiator for a heat generating components in electronic equipment according to the present invention.
FIG. 2 is a front view of the radiator according to the present invention.
FIG. 3 is a rear view of the radiator according to the present invention.
FIG. 4 is a left side view of the radiator according to the present invention.
FIG. 5 is a right side view of the radiator according to the present invention.
FIG. 6 is a top plan view of the radiator according to the present invention.
FIG. 7 is a bottom plan view of the radiator according to the present invention; and,
FIG. 8 is a perspective view illustrating use of the radiator according to the present invention.
The broken lines in the FIG. 8 drawing view indicate environmental elements for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a radiator for a heat generating components in electronic equipment, as shown and described.
US29/177,544 2003-03-11 2003-03-11 Radiator for a heat generating components in electronic equipment Expired - Lifetime USD485241S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/177,544 USD485241S1 (en) 2003-03-11 2003-03-11 Radiator for a heat generating components in electronic equipment

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US29/177,544 USD485241S1 (en) 2003-03-11 2003-03-11 Radiator for a heat generating components in electronic equipment

Publications (1)

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USD485241S1 true USD485241S1 (en) 2004-01-13

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US29/177,544 Expired - Lifetime USD485241S1 (en) 2003-03-11 2003-03-11 Radiator for a heat generating components in electronic equipment

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD494549S1 (en) 2003-04-14 2004-08-17 Zalman Tech Co., Ltd. Supporting block of VGA chipset cooling device
USD509806S1 (en) * 2004-07-16 2005-09-20 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20120063092A1 (en) * 2009-06-11 2012-03-15 Zaonzi Co., Ltd. Heat-dissipating device and electric apparatus having the same
USD714956S1 (en) * 2014-03-07 2014-10-07 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718472S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718468S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718470S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718466S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-Dimensional large capacity cell encapsulation device
USD718471S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718469S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718467S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD720469S1 (en) * 2013-03-07 2014-12-30 Viacyte, Inc. Cell encapsulation device
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
USD953339S1 (en) * 2019-05-06 2022-05-31 Dell Products L.P. Information handling system bezel

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724901A (en) 1980-05-19 1988-02-16 Showa Aluminum Kabushiki Kaisha Device for releasing heat
US5555931A (en) 1993-09-03 1996-09-17 Goldstar Co., Ltd. Heat exchanger for separable air conditioner
US5647430A (en) 1995-03-20 1997-07-15 Calsonic Corporation Electronic component cooling unit
US6360814B1 (en) 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US6390183B2 (en) 1998-05-18 2002-05-21 Matsushita Electric Industrial Co. Ltd. Heat exchanger
US6591898B1 (en) 2002-06-20 2003-07-15 International Business Machines Corporation Integrated heat sink system for a closed electronics container

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724901A (en) 1980-05-19 1988-02-16 Showa Aluminum Kabushiki Kaisha Device for releasing heat
US5555931A (en) 1993-09-03 1996-09-17 Goldstar Co., Ltd. Heat exchanger for separable air conditioner
US5647430A (en) 1995-03-20 1997-07-15 Calsonic Corporation Electronic component cooling unit
US6390183B2 (en) 1998-05-18 2002-05-21 Matsushita Electric Industrial Co. Ltd. Heat exchanger
US6360814B1 (en) 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US6591898B1 (en) 2002-06-20 2003-07-15 International Business Machines Corporation Integrated heat sink system for a closed electronics container

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD494549S1 (en) 2003-04-14 2004-08-17 Zalman Tech Co., Ltd. Supporting block of VGA chipset cooling device
USD509806S1 (en) * 2004-07-16 2005-09-20 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20120063092A1 (en) * 2009-06-11 2012-03-15 Zaonzi Co., Ltd. Heat-dissipating device and electric apparatus having the same
US8773855B2 (en) * 2009-06-11 2014-07-08 Zaonzi Co., Ltd. Heat-dissipating device and electric apparatus having the same
USD720469S1 (en) * 2013-03-07 2014-12-30 Viacyte, Inc. Cell encapsulation device
USD755986S1 (en) 2013-03-07 2016-05-10 Viacyte, Inc. Cell encapsulation device
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
USD714956S1 (en) * 2014-03-07 2014-10-07 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718466S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-Dimensional large capacity cell encapsulation device
USD718471S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718469S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718467S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718470S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718468S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718472S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD953339S1 (en) * 2019-05-06 2022-05-31 Dell Products L.P. Information handling system bezel

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