USD471168S1 - Heat dissipating RF electronics housing - Google Patents
Heat dissipating RF electronics housing Download PDFInfo
- Publication number
- USD471168S1 USD471168S1 US29/152,997 US15299702F USD471168S US D471168 S1 USD471168 S1 US D471168S1 US 15299702 F US15299702 F US 15299702F US D471168 S USD471168 S US D471168S
- Authority
- US
- United States
- Prior art keywords
- heat dissipating
- electronics housing
- electronics
- housing
- housing according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 is a perspective photographic view from a first side of the electronics housing according to the invention.
FIG. 2 is a perspective photographic view from the opposite side of the housing according to FIG. 1.
FIG. 3 is a top photographic view of the housing according to FIG. 1.
FIG. 4 is a side photographic view of the housing according to FIG. 1.
FIG. 5 is a perspective photographic view from an end of the housing according to FIG. 1.
FIG. 6 is an end view of the housing according to FIG. 5; and,
FIG. 7 is a photographic view of the bottom of the housing according to FIG. 1.
Claims (1)
- The ornamental design for a heat dissipating RF electronics housing, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/152,997 USD471168S1 (en) | 2002-01-07 | 2002-01-07 | Heat dissipating RF electronics housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/152,997 USD471168S1 (en) | 2002-01-07 | 2002-01-07 | Heat dissipating RF electronics housing |
Publications (1)
Publication Number | Publication Date |
---|---|
USD471168S1 true USD471168S1 (en) | 2003-03-04 |
Family
ID=22545356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/152,997 Expired - Lifetime USD471168S1 (en) | 2002-01-07 | 2002-01-07 | Heat dissipating RF electronics housing |
Country Status (1)
Country | Link |
---|---|
US (1) | USD471168S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080144279A1 (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co., Ltd. | Heat sink |
USD622229S1 (en) * | 2009-11-09 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Illumination device |
USD758301S1 (en) * | 2013-03-29 | 2016-06-07 | Gs Yuasa International Ltd. | Rechargeable battery |
USD927435S1 (en) * | 2019-04-12 | 2021-08-10 | Shin-Etsu Polymer Co., Ltd. | Heat dissipating device for batteries or electric devices |
-
2002
- 2002-01-07 US US29/152,997 patent/USD471168S1/en not_active Expired - Lifetime
Non-Patent Citations (2)
Title |
---|
HyperLink Technologies, Inc., "HyperAmp™ HA2401A," Jan. 20, 2001, Web Article: www.hyperlinktech.com/html/products/ha2401a.html. |
Young Design, Inc., "AMP 2440," Jan. 20, 2001, Web Article: www.ydi.com/Products/Amplifiers/AMP2440/amp2440.html. |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080144279A1 (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co., Ltd. | Heat sink |
USD622229S1 (en) * | 2009-11-09 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Illumination device |
USD758301S1 (en) * | 2013-03-29 | 2016-06-07 | Gs Yuasa International Ltd. | Rechargeable battery |
USD927435S1 (en) * | 2019-04-12 | 2021-08-10 | Shin-Etsu Polymer Co., Ltd. | Heat dissipating device for batteries or electric devices |
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