USD466140S1 - Tool for dispensing adhesives and sealants - Google Patents

Tool for dispensing adhesives and sealants Download PDF

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Publication number
USD466140S1
USD466140S1 US29/151,038 US15103801F USD466140S US D466140 S1 USD466140 S1 US D466140S1 US 15103801 F US15103801 F US 15103801F US D466140 S USD466140 S US D466140S
Authority
US
United States
Prior art keywords
sealants
tool
dispensing adhesives
adhesives
dispensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/151,038
Inventor
Brett Huey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson Corp
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Priority to US29/151,038 priority Critical patent/USD466140S1/en
Assigned to NORDSON CORPORATION reassignment NORDSON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUEY, BRETT
Priority to KR10-2004-7000237A priority patent/KR20040017281A/en
Priority to US10/483,128 priority patent/US20040241262A1/en
Priority to PCT/US2002/021458 priority patent/WO2003006230A1/en
Priority to JP2003512021A priority patent/JP2005514760A/en
Priority to CNA028137981A priority patent/CN1525910A/en
Application granted granted Critical
Publication of USD466140S1 publication Critical patent/USD466140S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of the new design for a tool for dispensing adhesives and sealants;
FIG. 2 is a top plan view;
FIG. 3 is a bottom view;
FIG. 4 is a right side elevational view;
FIG. 5 is a left side elevational view;
FIG. 6 is a rear elevational view;
FIG. 7 is a perspective view; and,
FIG. 8 is a bottom perspective view.

Claims (1)

  1. The ornamental design for a tool for dispensing adhesives and sealants, as shown and described.
US29/151,038 2001-07-09 2001-10-31 Tool for dispensing adhesives and sealants Expired - Lifetime USD466140S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US29/151,038 USD466140S1 (en) 2001-10-31 2001-10-31 Tool for dispensing adhesives and sealants
KR10-2004-7000237A KR20040017281A (en) 2001-07-09 2002-07-08 Method and apparatus for underfilling electronic components using vacuum assist
US10/483,128 US20040241262A1 (en) 2001-07-09 2002-07-08 Method and apparatus for underfilling electronic components using vacuum assist
PCT/US2002/021458 WO2003006230A1 (en) 2001-07-09 2002-07-08 Method and apparatus for underfilling electronic components using vacuum assist
JP2003512021A JP2005514760A (en) 2001-07-09 2002-07-08 Method and apparatus for underfilling electronic components using vacuum assist
CNA028137981A CN1525910A (en) 2001-07-09 2002-07-08 Method and apparatus for underfilling electronic components using vacuum assist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/151,038 USD466140S1 (en) 2001-10-31 2001-10-31 Tool for dispensing adhesives and sealants

Publications (1)

Publication Number Publication Date
USD466140S1 true USD466140S1 (en) 2002-11-26

Family

ID=27661661

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/151,038 Expired - Lifetime USD466140S1 (en) 2001-07-09 2001-10-31 Tool for dispensing adhesives and sealants

Country Status (1)

Country Link
US (1) USD466140S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040241262A1 (en) * 2001-07-09 2004-12-02 Brett Huey Method and apparatus for underfilling electronic components using vacuum assist
US8956923B2 (en) 2012-06-18 2015-02-17 Samsung Electronics Co., Ltd. Methods of fabricating semiconductor devices and underfill equipment for the same
USD824968S1 (en) * 2016-10-30 2018-08-07 Nordson Corporation Hot melt dispenser

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040241262A1 (en) * 2001-07-09 2004-12-02 Brett Huey Method and apparatus for underfilling electronic components using vacuum assist
US8956923B2 (en) 2012-06-18 2015-02-17 Samsung Electronics Co., Ltd. Methods of fabricating semiconductor devices and underfill equipment for the same
USD824968S1 (en) * 2016-10-30 2018-08-07 Nordson Corporation Hot melt dispenser
USD851694S1 (en) 2016-10-30 2019-06-18 Nordson Corporation Hot melt dispenser

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