USD466140S1 - Tool for dispensing adhesives and sealants - Google Patents
Tool for dispensing adhesives and sealants Download PDFInfo
- Publication number
- USD466140S1 USD466140S1 US29/151,038 US15103801F USD466140S US D466140 S1 USD466140 S1 US D466140S1 US 15103801 F US15103801 F US 15103801F US D466140 S USD466140 S US D466140S
- Authority
- US
- United States
- Prior art keywords
- sealants
- tool
- dispensing adhesives
- adhesives
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front elevational view of the new design for a tool for dispensing adhesives and sealants;
FIG. 2 is a top plan view;
FIG. 3 is a bottom view;
FIG. 4 is a right side elevational view;
FIG. 5 is a left side elevational view;
FIG. 6 is a rear elevational view;
FIG. 7 is a perspective view; and,
FIG. 8 is a bottom perspective view.
Claims (1)
- The ornamental design for a tool for dispensing adhesives and sealants, as shown and described.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/151,038 USD466140S1 (en) | 2001-10-31 | 2001-10-31 | Tool for dispensing adhesives and sealants |
KR10-2004-7000237A KR20040017281A (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
US10/483,128 US20040241262A1 (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
PCT/US2002/021458 WO2003006230A1 (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
JP2003512021A JP2005514760A (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
CNA028137981A CN1525910A (en) | 2001-07-09 | 2002-07-08 | Method and apparatus for underfilling electronic components using vacuum assist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/151,038 USD466140S1 (en) | 2001-10-31 | 2001-10-31 | Tool for dispensing adhesives and sealants |
Publications (1)
Publication Number | Publication Date |
---|---|
USD466140S1 true USD466140S1 (en) | 2002-11-26 |
Family
ID=27661661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/151,038 Expired - Lifetime USD466140S1 (en) | 2001-07-09 | 2001-10-31 | Tool for dispensing adhesives and sealants |
Country Status (1)
Country | Link |
---|---|
US (1) | USD466140S1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040241262A1 (en) * | 2001-07-09 | 2004-12-02 | Brett Huey | Method and apparatus for underfilling electronic components using vacuum assist |
US8956923B2 (en) | 2012-06-18 | 2015-02-17 | Samsung Electronics Co., Ltd. | Methods of fabricating semiconductor devices and underfill equipment for the same |
USD824968S1 (en) * | 2016-10-30 | 2018-08-07 | Nordson Corporation | Hot melt dispenser |
-
2001
- 2001-10-31 US US29/151,038 patent/USD466140S1/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040241262A1 (en) * | 2001-07-09 | 2004-12-02 | Brett Huey | Method and apparatus for underfilling electronic components using vacuum assist |
US8956923B2 (en) | 2012-06-18 | 2015-02-17 | Samsung Electronics Co., Ltd. | Methods of fabricating semiconductor devices and underfill equipment for the same |
USD824968S1 (en) * | 2016-10-30 | 2018-08-07 | Nordson Corporation | Hot melt dispenser |
USD851694S1 (en) | 2016-10-30 | 2019-06-18 | Nordson Corporation | Hot melt dispenser |
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