USD453744S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD453744S1 USD453744S1 US29/141,773 US14177301F USD453744S US D453744 S1 USD453744 S1 US D453744S1 US 14177301 F US14177301 F US 14177301F US D453744 S USD453744 S US D453744S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- ornamental design
- elevational view
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a heat sink of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a heat sink, as shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/141,773 USD453744S1 (en) | 2001-05-11 | 2001-05-11 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/141,773 USD453744S1 (en) | 2001-05-11 | 2001-05-11 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD453744S1 true USD453744S1 (en) | 2002-02-19 |
Family
ID=22497176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/141,773 Expired - Lifetime USD453744S1 (en) | 2001-05-11 | 2001-05-11 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD453744S1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD492265S1 (en) | 2003-04-24 | 2004-06-29 | Datech Technology Co., Ltd. | Thermal efficient heat sink for electronic devices |
| USD496338S1 (en) | 2003-03-10 | 2004-09-21 | Asia Vital Components Co., Ltd. | Double-winged radiator for central processing unit |
| USD530682S1 (en) * | 2005-08-04 | 2006-10-24 | Molex Incorporated | Heat sink fins |
| USD533145S1 (en) * | 2005-08-04 | 2006-12-05 | Molex Incorporated | Heat sink |
| USD551633S1 (en) * | 2005-08-04 | 2007-09-25 | Molex Incorporated | Heat sink fins |
| USD567771S1 (en) * | 2006-12-23 | 2008-04-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| USD747278S1 (en) * | 2014-09-19 | 2016-01-12 | General Electric Company | Heat sink |
| USD1080566S1 (en) * | 2022-02-23 | 2025-06-24 | Kingston Digital, Inc. | Heat sink for memory module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5358032A (en) | 1992-02-05 | 1994-10-25 | Hitachi, Ltd. | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted |
| USD400188S (en) | 1997-05-22 | 1998-10-27 | Hon Hai Precision Ind. Co., Ltd. | Heat sink |
| US6241006B1 (en) | 2000-03-09 | 2001-06-05 | John Wun-Chang Shih | Heat sink for CPU |
-
2001
- 2001-05-11 US US29/141,773 patent/USD453744S1/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5358032A (en) | 1992-02-05 | 1994-10-25 | Hitachi, Ltd. | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted |
| USD400188S (en) | 1997-05-22 | 1998-10-27 | Hon Hai Precision Ind. Co., Ltd. | Heat sink |
| US6241006B1 (en) | 2000-03-09 | 2001-06-05 | John Wun-Chang Shih | Heat sink for CPU |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD496338S1 (en) | 2003-03-10 | 2004-09-21 | Asia Vital Components Co., Ltd. | Double-winged radiator for central processing unit |
| USD492265S1 (en) | 2003-04-24 | 2004-06-29 | Datech Technology Co., Ltd. | Thermal efficient heat sink for electronic devices |
| USD530682S1 (en) * | 2005-08-04 | 2006-10-24 | Molex Incorporated | Heat sink fins |
| USD533145S1 (en) * | 2005-08-04 | 2006-12-05 | Molex Incorporated | Heat sink |
| USD551633S1 (en) * | 2005-08-04 | 2007-09-25 | Molex Incorporated | Heat sink fins |
| USD567771S1 (en) * | 2006-12-23 | 2008-04-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| USD747278S1 (en) * | 2014-09-19 | 2016-01-12 | General Electric Company | Heat sink |
| USD786807S1 (en) * | 2014-09-19 | 2017-05-16 | General Electric Company | Heat sink |
| USD1080566S1 (en) * | 2022-02-23 | 2025-06-24 | Kingston Digital, Inc. | Heat sink for memory module |
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