USD438515S1 - Portion of heat sink - Google Patents

Portion of heat sink Download PDF

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Publication number
USD438515S1
USD438515S1 US29/119,825 US11982500F USD438515S US D438515 S1 USD438515 S1 US D438515S1 US 11982500 F US11982500 F US 11982500F US D438515 S USD438515 S US D438515S
Authority
US
United States
Prior art keywords
heat sink
view
elevational view
symmetrical
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/119,825
Inventor
Hisashi Yokoyama
Takeshi Ikai
Yasuhiko Kato
Toshihiko Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IKAI, TAKESHI, MIYAKE, TOSHIHIKO, KATO, YASUHIKO, YOKOYAMA, HISASHI
Application granted granted Critical
Publication of USD438515S1 publication Critical patent/USD438515S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a portion of heat sink showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being symmetrical with that shown;
FIG. 3 is a right side elevational view thereof, the left side being symmetrical with that shown;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is an enlarged cross-sectional view thereof, taken along line 6—6 of FIG. 2.
The broken-line disclosure in the views is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a portion of heat sink, as shown and described.
US29/119,825 1999-09-20 2000-03-09 Portion of heat sink Expired - Lifetime USD438515S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11-25323 1999-09-20
JP2532399 1999-09-20

Publications (1)

Publication Number Publication Date
USD438515S1 true USD438515S1 (en) 2001-03-06

Family

ID=12162778

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/119,825 Expired - Lifetime USD438515S1 (en) 1999-09-20 2000-03-09 Portion of heat sink

Country Status (1)

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US (1) USD438515S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9470372B2 (en) 2008-11-26 2016-10-18 Deloren E. Anderson High intensity replaceable light emitting diode module and array
USD917402S1 (en) * 2017-08-22 2021-04-27 Foxconn Interconnect Technology Limited Protective cap
USD1010803S1 (en) * 2021-10-13 2024-01-09 Johnson Electric Asti S.R.L. Part of a cooling fan module
TWD233717S (en) 2023-11-15 2024-09-21 安索鋼鋁有限公司 臺中市南屯區文昌街186號1樓 (中華民國) Model radiator parts

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715438A (en) 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US5680880A (en) 1994-06-17 1997-10-28 Mitsubishi Denki Kabushiki Kaisha Motor driven type flow rate controlling valve
US5785116A (en) 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5794685A (en) 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
USD428857S (en) 1999-09-03 2000-08-01 Agilent Technologies Cooling device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715438A (en) 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US5680880A (en) 1994-06-17 1997-10-28 Mitsubishi Denki Kabushiki Kaisha Motor driven type flow rate controlling valve
US5718259A (en) 1994-06-17 1998-02-17 Mitsubishi Denki Kabushiki Kaisha Motor driven type flow rate controlling valve
US5785116A (en) 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5794685A (en) 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
USD428857S (en) 1999-09-03 2000-08-01 Agilent Technologies Cooling device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9470372B2 (en) 2008-11-26 2016-10-18 Deloren E. Anderson High intensity replaceable light emitting diode module and array
US10925139B2 (en) 2008-11-26 2021-02-16 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US11178744B2 (en) 2008-11-26 2021-11-16 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US11924943B2 (en) 2008-11-26 2024-03-05 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US12219678B2 (en) 2008-11-26 2025-02-04 In 2 Developments Llc High intensity replaceable light emitting diode module and array
USD917402S1 (en) * 2017-08-22 2021-04-27 Foxconn Interconnect Technology Limited Protective cap
USD1010803S1 (en) * 2021-10-13 2024-01-09 Johnson Electric Asti S.R.L. Part of a cooling fan module
TWD233717S (en) 2023-11-15 2024-09-21 安索鋼鋁有限公司 臺中市南屯區文昌街186號1樓 (中華民國) Model radiator parts

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