USD400665S - Heat dissipation fan - Google Patents
Heat dissipation fan Download PDFInfo
- Publication number
- USD400665S USD400665S US29/077,728 US7772897F USD400665S US D400665 S USD400665 S US D400665S US 7772897 F US7772897 F US 7772897F US D400665 S USD400665 S US D400665S
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- dissipation fan
- fan
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 3
Images
Description
FIG. 1 is a perspective view of the heat dissipation fan showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIg. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIg. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a heat dissipation fan, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW86307696 | 1997-09-03 | ||
| TW86307696 | 1997-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD400665S true USD400665S (en) | 1998-11-03 |
Family
ID=71612378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/077,728 Expired - Lifetime USD400665S (en) | 1997-09-03 | 1997-10-07 | Heat dissipation fan |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD400665S (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD425030S (en) * | 1999-03-11 | 2000-05-16 | Hsieh Hsin-Mao | Cooling fan of a heat sink assembly |
| USD450378S1 (en) | 1999-12-21 | 2001-11-13 | Nidec Copal Corporation | Fan motor |
| USD489122S1 (en) | 2002-01-10 | 2004-04-27 | Kaz, Inc. | Electric heater |
| USD509896S1 (en) * | 2004-04-01 | 2005-09-20 | Delta Electronics Inc. | Fan |
| USD509895S1 (en) * | 2004-04-01 | 2005-09-20 | Delta Electronics Inc. | Fan |
| USD1042778S1 (en) * | 2023-04-14 | 2024-09-17 | Acer Incorporated | Heat dissipation module |
| USD1051864S1 (en) * | 2022-02-08 | 2024-11-19 | Acer Incorporated | Heat dissipation module |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3408139C2 (en) | 1984-03-06 | 1989-06-08 | Schroff Gmbh, 7541 Straubenhardt, De | |
| US5079438A (en) | 1989-01-30 | 1992-01-07 | Heung Lap Yan | Circuit module fan assembly |
| US5288203A (en) | 1992-10-23 | 1994-02-22 | Thomas Daniel L | Low profile fan body with heat transfer characteristics |
| US5494098A (en) | 1994-06-17 | 1996-02-27 | Wakefield Engineering, Inc. | Fan driven heat sink |
| US5566749A (en) | 1994-04-12 | 1996-10-22 | Thermalloy, Inc. | Stamped and formed heat sink |
| US5603374A (en) | 1996-04-05 | 1997-02-18 | Malico Inc. | Heat sink assembly for an integrated circuit |
| US5678627A (en) | 1996-01-03 | 1997-10-21 | Lee; Richard | CPU heat sink mounting structure |
| US5689404A (en) | 1995-03-17 | 1997-11-18 | Fujitsu, Ltd. | Heat sink having air movement device positioned among tins and between heating elements |
| US5690468A (en) | 1996-06-19 | 1997-11-25 | Hong; Chen Fu-In | Fan assembly for an integrated circuit |
-
1997
- 1997-10-07 US US29/077,728 patent/USD400665S/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3408139C2 (en) | 1984-03-06 | 1989-06-08 | Schroff Gmbh, 7541 Straubenhardt, De | |
| US5079438A (en) | 1989-01-30 | 1992-01-07 | Heung Lap Yan | Circuit module fan assembly |
| US5288203A (en) | 1992-10-23 | 1994-02-22 | Thomas Daniel L | Low profile fan body with heat transfer characteristics |
| US5566749A (en) | 1994-04-12 | 1996-10-22 | Thermalloy, Inc. | Stamped and formed heat sink |
| US5494098A (en) | 1994-06-17 | 1996-02-27 | Wakefield Engineering, Inc. | Fan driven heat sink |
| US5689404A (en) | 1995-03-17 | 1997-11-18 | Fujitsu, Ltd. | Heat sink having air movement device positioned among tins and between heating elements |
| US5678627A (en) | 1996-01-03 | 1997-10-21 | Lee; Richard | CPU heat sink mounting structure |
| US5603374A (en) | 1996-04-05 | 1997-02-18 | Malico Inc. | Heat sink assembly for an integrated circuit |
| US5690468A (en) | 1996-06-19 | 1997-11-25 | Hong; Chen Fu-In | Fan assembly for an integrated circuit |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD425030S (en) * | 1999-03-11 | 2000-05-16 | Hsieh Hsin-Mao | Cooling fan of a heat sink assembly |
| USD450378S1 (en) | 1999-12-21 | 2001-11-13 | Nidec Copal Corporation | Fan motor |
| USD489122S1 (en) | 2002-01-10 | 2004-04-27 | Kaz, Inc. | Electric heater |
| USD509896S1 (en) * | 2004-04-01 | 2005-09-20 | Delta Electronics Inc. | Fan |
| USD509895S1 (en) * | 2004-04-01 | 2005-09-20 | Delta Electronics Inc. | Fan |
| USD1051864S1 (en) * | 2022-02-08 | 2024-11-19 | Acer Incorporated | Heat dissipation module |
| USD1042778S1 (en) * | 2023-04-14 | 2024-09-17 | Acer Incorporated | Heat dissipation module |
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