USD373572S - Heatsink-outfitted speed conroller housing - Google Patents

Heatsink-outfitted speed conroller housing Download PDF

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Publication number
USD373572S
USD373572S US29/048,402 US4840295F USD373572S US D373572 S USD373572 S US D373572S US 4840295 F US4840295 F US 4840295F US D373572 S USD373572 S US D373572S
Authority
US
United States
Prior art keywords
outfitted
heatsink
housing
conroller
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/048,402
Inventor
Kevin R. Orton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/048,402 priority Critical patent/USD373572S/en
Application granted granted Critical
Publication of USD373572S publication Critical patent/USD373572S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 of the drawings is a front, top, and left side three-dimensional view of a heatsink-outfitted speed conroller housing constructed according to the invention;
FIG. 2 is a top view of the housing;
FIG. 3 is a front view;
FIG. 4 is a left side view;
FIG. 5 is a right side view;
FIG. 6 is a rear view; and,
FIG. 7 is a bottom view.

Claims (1)

  1. The ornamental design for a heatsink-outfitted speed controller housing, as shown.
US29/048,402 1995-12-27 1995-12-27 Heatsink-outfitted speed conroller housing Expired - Lifetime USD373572S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/048,402 USD373572S (en) 1995-12-27 1995-12-27 Heatsink-outfitted speed conroller housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/048,402 USD373572S (en) 1995-12-27 1995-12-27 Heatsink-outfitted speed conroller housing

Publications (1)

Publication Number Publication Date
USD373572S true USD373572S (en) 1996-09-10

Family

ID=71110157

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/048,402 Expired - Lifetime USD373572S (en) 1995-12-27 1995-12-27 Heatsink-outfitted speed conroller housing

Country Status (1)

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US (1) USD373572S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD431816S (en) * 1999-11-10 2000-10-10 Motorola, Inc. Linear power amplifier enclosure
USD446204S1 (en) 1999-10-12 2001-08-07 Powerfactor Research Portion of an audio amplifier
USD449288S1 (en) 2000-07-06 2001-10-16 Sony Corporation Amplifier
USD475354S1 (en) 2001-12-21 2003-06-03 Tung-Yuan Wang Heat pipe of radiator of computer
USD960148S1 (en) * 2018-11-05 2022-08-09 Siemens Aktiengesellschaft Computer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4000509A (en) 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
USD316705S (en) 1989-01-13 1991-05-07 Product R&D Corporation Combined heat sink and radiator for electronic equipment
US5175613A (en) 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5349899A (en) 1992-11-26 1994-09-27 Kanehiro Co., Ltd. Natural thawing pan
USD368253S (en) 1993-07-19 1996-03-26 Rockford Corporation Heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4000509A (en) 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
USD316705S (en) 1989-01-13 1991-05-07 Product R&D Corporation Combined heat sink and radiator for electronic equipment
US5175613A (en) 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5349899A (en) 1992-11-26 1994-09-27 Kanehiro Co., Ltd. Natural thawing pan
USD368253S (en) 1993-07-19 1996-03-26 Rockford Corporation Heat sink

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD446204S1 (en) 1999-10-12 2001-08-07 Powerfactor Research Portion of an audio amplifier
USD431816S (en) * 1999-11-10 2000-10-10 Motorola, Inc. Linear power amplifier enclosure
USD449288S1 (en) 2000-07-06 2001-10-16 Sony Corporation Amplifier
USD475354S1 (en) 2001-12-21 2003-06-03 Tung-Yuan Wang Heat pipe of radiator of computer
USD960148S1 (en) * 2018-11-05 2022-08-09 Siemens Aktiengesellschaft Computer

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