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USD368903S - IC module - Google Patents

IC module Download PDF

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Publication number
USD368903S
USD368903S US29036254 US03625495F USD368903S US D368903 S USD368903 S US D368903S US 29036254 US29036254 US 29036254 US 03625495 F US03625495 F US 03625495F US D368903 S USD368903 S US D368903S
Authority
US
Grant status
Grant
Patent type
Design
Prior art keywords
view
fig
elevational
module
side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29036254
Inventor
Jun Ohmori
Hiroshi Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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Description

FIG. 1 is a perspective view of the front, bottom and right side elevational view of an IC module, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof, the bottom plan view is identical; and,

FIG. 6 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for an IC module, as shown and described.
US29036254 1994-06-30 1995-03-16 IC module Expired - Lifetime USD368903S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19412/94 1994-06-30

Publications (1)

Publication Number Publication Date
USD368903S true USD368903S (en) 1996-04-16

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060091568A1 (en) * 2004-10-29 2006-05-04 Renesas Technology Corp. Semiconductor device and method for manufacturing same
US7549244B2 (en) 2000-12-08 2009-06-23 Discover Financial Services Llc Credit card with reduced points of contact
USD786878S1 (en) * 2015-12-04 2017-05-16 Capital One Services, Llc Payment card chip
USD814474S1 (en) 2017-04-03 2018-04-03 Capital One Services, Llc Payment card chip

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Official Gazette, design patent D328599, p. 1377, Aug. 11, 1992.
Official Gazette, design patent D331922, p. 2439, Dec. 22, 1992.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7549244B2 (en) 2000-12-08 2009-06-23 Discover Financial Services Llc Credit card with reduced points of contact
US20060091568A1 (en) * 2004-10-29 2006-05-04 Renesas Technology Corp. Semiconductor device and method for manufacturing same
US20070257346A1 (en) * 2004-10-29 2007-11-08 Yoshiyuki Tanigawa Semiconductor device and method for manufacturing same
US7656014B2 (en) 2004-10-29 2010-02-02 Renesas Technology Corp. Semiconductor device and method for manufacturing same
USD786878S1 (en) * 2015-12-04 2017-05-16 Capital One Services, Llc Payment card chip
USD814474S1 (en) 2017-04-03 2018-04-03 Capital One Services, Llc Payment card chip

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