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Heat sink clip for surface-mount integrated circuit

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Publication number
USD339110S
USD339110S US07754133 US75413391F USD339110S US D339110 S USD339110 S US D339110S US 07754133 US07754133 US 07754133 US 75413391 F US75413391 F US 75413391F US D339110 S USD339110 S US D339110S
Authority
US
Grant status
Grant
Patent type
Design
Prior art keywords
view
fig
sink
heat
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07754133
Inventor
Carl A. Steen, Jr.
Robert B. Widmayer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Solutions Inc
Filing date
Publication date
Grant date

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Description

FIG. 1 is a front, top, and right side perspective view showing our new design for a heat sink clip for surface-mount integrated circuit;

FIG. 2 is a left elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a front, top, and right side perspective view showing an alternate embodiment for a heat sink clip for surface mount integrated circuit, the front, top, and left side perspective view being a mirror image.

Claims (1)

  1. The ornamental design for a heat sink clip for surface-mount integrated circuit, as shown and described.
US07754133 1991-09-03 Heat sink clip for surface-mount integrated circuit Expired - Lifetime USD339110S (en)

Publications (1)

Publication Number Publication Date
USD339110S true USD339110S (en) 1993-09-07

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617685B1 (en) * 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
US7233497B2 (en) 2004-10-06 2007-06-19 Hewlett-Packard Development Company, L.P. Surface mount heat sink
USD756187S1 (en) * 2014-07-11 2016-05-17 Pressmaster Ab Adjustable crimping guide die

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617685B1 (en) * 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
US7233497B2 (en) 2004-10-06 2007-06-19 Hewlett-Packard Development Company, L.P. Surface mount heat sink
USD756187S1 (en) * 2014-07-11 2016-05-17 Pressmaster Ab Adjustable crimping guide die

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