USD323173S - Instrument for transferring boats for thermal treatment of semiconductor wafers - Google Patents

Instrument for transferring boats for thermal treatment of semiconductor wafers Download PDF

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Publication number
USD323173S
USD323173S US07/301,996 US30199689F USD323173S US D323173 S USD323173 S US D323173S US 30199689 F US30199689 F US 30199689F US D323173 S USD323173 S US D323173S
Authority
US
United States
Prior art keywords
instrument
thermal treatment
semiconductor wafers
boats
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/301,996
Inventor
Katsumi Ishii
Mitsuo Katoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Sagami Ltd
Original Assignee
Tokyo Electron Sagami Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Sagami Ltd filed Critical Tokyo Electron Sagami Ltd
Assigned to TEL SAGAMI LIMITED reassignment TEL SAGAMI LIMITED ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: ISHII, KATSUMI, KATOH, MITSUO
Application granted granted Critical
Publication of USD323173S publication Critical patent/USD323173S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a left side elevational view;
FIG. 3 is a front elevational view, the rear elevational view being a mirror image;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and
FIG. 6 is a right side elevational view thereof.

Claims (1)

  1. The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown and described.
US07/301,996 1988-07-25 1989-01-25 Instrument for transferring boats for thermal treatment of semiconductor wafers Expired - Lifetime USD323173S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-29831 1988-07-25
JP2983188 1988-07-25

Publications (1)

Publication Number Publication Date
USD323173S true USD323173S (en) 1992-01-14

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ID=70471607

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/301,996 Expired - Lifetime USD323173S (en) 1988-07-25 1989-01-25 Instrument for transferring boats for thermal treatment of semiconductor wafers

Country Status (1)

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US (1) USD323173S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD927579S1 (en) * 2019-04-01 2021-08-10 Fanuc Corporation Scanning machine
USD1003327S1 (en) * 2021-12-13 2023-10-31 Hiwin Technologies Corp. Wafer aligner

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961877A (en) 1974-09-11 1976-06-08 Fluoroware, Inc. Reinforced wafer basket
US4041278A (en) 1975-05-19 1977-08-09 General Electric Company Heating apparatus for temperature gradient zone melting

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961877A (en) 1974-09-11 1976-06-08 Fluoroware, Inc. Reinforced wafer basket
US3961877B1 (en) 1974-09-11 1987-11-03
US4041278A (en) 1975-05-19 1977-08-09 General Electric Company Heating apparatus for temperature gradient zone melting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD927579S1 (en) * 2019-04-01 2021-08-10 Fanuc Corporation Scanning machine
USD1003327S1 (en) * 2021-12-13 2023-10-31 Hiwin Technologies Corp. Wafer aligner

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