USD288557S - Semiconductor housing - Google Patents

Semiconductor housing Download PDF

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Publication number
USD288557S
USD288557S US06649081 US64908184F USD288557S US D288557 S USD288557 S US D288557S US 06649081 US06649081 US 06649081 US 64908184 F US64908184 F US 64908184F US D288557 S USD288557 S US D288557S
Authority
US
Grant status
Grant
Patent type
Design
Prior art keywords
fig
view
reduced
scale
side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06649081
Inventor
Jerry M. Du Bois
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Motorola Solutions Inc
Filing date
Publication date
Grant date

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Description

FIG. 1 is a right side, top and front perspective view of a semiconductor housing showing my new design;

FIG. 2 is a top plan view thereof on a reduced scale;

FIG. 3 is a bottom plan view thereof on a reduced scale;

FIG. 4 is a left side elevational view thereof on a reduced scale;

FIG. 5 is a right side elevational view thereof on a reduced scale;

FIG. 6 is a front elevational view thereof on a reduced scale;

FIG. 7 is a rear elevational view thereof on a reduced scale;

FIG. 8 is a top plan view of second embodiment of my new design, the second embodiment being identical to the first except for the number of leads on the right hand side;

FIG. 9 is a bottom plan view thereof;

FIG. 10 is a top plan view of a third embodiment of my new design, the third design being identical to the first embodiment except for the shape of the two leads on the left hand side;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a right side, top and front perspective view of a fourth embodiment of my new design;

FIG. 13 is a top plan view thereof on a reduced scale;

FIG. 14 is a front elevational view thereof on a reduced scale;

FIG. 15 is a left side elevational view thereof on a reduced scale;

FIG. 16 is a right side, top and front perspective view of a fifth embodiment of my new design, the fifth embodiment being identical to the first embodiment except for the flat top surface;

FIG. 17 is a right side, top and front perspective view of a sixth embodiment of my new design;

FIG. 18 is a top plan view thereof on a reduced scale;

FIG. 19 is a bottom plan view thereof on a reduced scale;

FIG. 20 is a left side elevational view thereof on a reduced scale;

FIG. 21 is a right side elevational view thereof on a reduced scale.

Claims (1)

  1. The ornamental design for a semiconductor housing, as shown and described.
US06649081 1984-09-10 Semiconductor housing Expired - Lifetime USD288557S (en)

Publications (1)

Publication Number Publication Date
USD288557S true USD288557S (en) 1987-03-03

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, vol. 21, #1, 6-1978, pp. 99-100, Circuit Chip Support Assembly, Coombs & Larnerd.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module

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