USD266076S - Heat releasing plate for mounting semiconductor components - Google Patents

Heat releasing plate for mounting semiconductor components Download PDF

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Publication number
USD266076S
USD266076S US06/154,977 US15497780F USD266076S US D266076 S USD266076 S US D266076S US 15497780 F US15497780 F US 15497780F US D266076 S USD266076 S US D266076S
Authority
US
United States
Prior art keywords
semiconductor components
heat releasing
mounting semiconductor
releasing plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/154,977
Inventor
Yoshihiko Asanuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Altemira Co Ltd
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Application granted granted Critical
Publication of USD266076S publication Critical patent/USD266076S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof; and
FIG. 6 is a sectional view taken on line 6--6 of FIG. 2.

Claims (1)

  1. The ornamental design for a heat releasing plate for mounting semiconductor components, as shown and described.
US06/154,977 1980-04-01 1980-05-30 Heat releasing plate for mounting semiconductor components Expired - Lifetime USD266076S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW69300617 1980-04-01
TW6930617 1980-04-01

Publications (1)

Publication Number Publication Date
USD266076S true USD266076S (en) 1982-09-07

Family

ID=69844190

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/154,977 Expired - Lifetime USD266076S (en) 1980-04-01 1980-05-30 Heat releasing plate for mounting semiconductor components

Country Status (1)

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US (1) USD266076S (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2949283A (en) 1956-05-11 1960-08-16 Millard F Smith Apparatus for heat transfer
US3163207A (en) 1961-07-26 1964-12-29 Robert T Schultz Heat dissipating mount for electric components
US3180404A (en) 1959-12-02 1965-04-27 United Aircraft Prod Cooling electronic heat producing elements and the like
US3187812A (en) 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2949283A (en) 1956-05-11 1960-08-16 Millard F Smith Apparatus for heat transfer
US3180404A (en) 1959-12-02 1965-04-27 United Aircraft Prod Cooling electronic heat producing elements and the like
US3163207A (en) 1961-07-26 1964-12-29 Robert T Schultz Heat dissipating mount for electric components
US3187812A (en) 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry

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