USD1024062S1 - Electronic module housing - Google Patents

Electronic module housing Download PDF

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Publication number
USD1024062S1
USD1024062S1 US29/796,507 US202129796507F USD1024062S US D1024062 S1 USD1024062 S1 US D1024062S1 US 202129796507 F US202129796507 F US 202129796507F US D1024062 S USD1024062 S US D1024062S
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electronic module
module housing
view
elevation view
housing
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US29/796,507
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Timothy Alan Suda
Tobias Merten
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Aptiv Technologies AG
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Aptiv Technologies AG
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Priority to US29/796,507 priority Critical patent/USD1024062S1/en
Assigned to APTIV TECHNOLOGIES LIMITED reassignment APTIV TECHNOLOGIES LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RICHTER-BROCKMANN, Tobias, SUDA, TIMOTHY ALAN
Assigned to APTIV TECHNOLOGIES LIMITED reassignment APTIV TECHNOLOGIES LIMITED CORRECTIVE ASSIGNMENT TO CORRECT THE LAST INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 056661 FRAME: 0904. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: MERTEN, TOBIAS, SUDA, TIMOTHY ALAN
Assigned to APTIV TECHNOLOGIES (2) S.À R.L. reassignment APTIV TECHNOLOGIES (2) S.À R.L. ENTITY CONVERSION Assignors: APTIV TECHNOLOGIES LIMITED
Assigned to APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L. reassignment APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L. MERGER Assignors: APTIV TECHNOLOGIES (2) S.À R.L.
Assigned to Aptiv Technologies AG reassignment Aptiv Technologies AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
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Description

FIG. 1 is a front, right side perspective view of an electronic module housing showing the design;
FIG. 2 is a top plan view of the electronic module housing of FIG. 1 ;
FIG. 3 is a front elevation view of the electronic module housing of FIG. 1 ;
FIG. 4 is a bottom view of the electronic module housing of FIG. 1 ;
FIG. 5 is a rear elevation view of the electronic module housing of FIG. 1 ;
FIG. 6 is a left side elevation view of the electronic module housing of FIG. 1 ; and,
FIG. 7 is a right side elevation view of the electronic module housing of FIG. 1 .
The broken lines shown represent unclaimed subject matter and form no part of the claimed design. The portion of the article that is not illustrated in the Figures is not claimed. The relatively light and thin shade lines show contour and not surface decoration.

Claims (1)

    CLAIM
  1. We claim the ornamental design for an electronic module housing, as shown and described.
US29/796,507 2021-06-24 2021-06-24 Electronic module housing Active USD1024062S1 (en)

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US29/796,507 USD1024062S1 (en) 2021-06-24 2021-06-24 Electronic module housing

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US29/796,507 USD1024062S1 (en) 2021-06-24 2021-06-24 Electronic module housing

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US29/796,507 Active USD1024062S1 (en) 2021-06-24 2021-06-24 Electronic module housing

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