BACKGROUND
In optical communications networks, optical transceiver modules are used to transmit and receive optical signals over optical fibers. As illustrated in
FIG. 1, a transmitter optical subassembly (TOSA)
10 is commonly housed within such an optical transceiver module (not shown). The TOSA
10 includes a laser diode that is driven with electrical signals representing data to be transmitted. In response to the electrical signals, the laser produces amplitude modulated optical signals that represent the data. The optical signals are emitted from an emitting end or
receptacle end 12 of TOSA
10. The optical signals can be transmitted over an optical fiber (not shown) that is mated with
receptacle end 12 of TOSA
10. The TOSA
10 can also include a photodiode that monitors the output of the laser diode to aid feedback control of the laser diode.
The end of TOSA
10 opposite receptacle end 12 commonly includes a transistor outline (TO) package or TO-can
14. (For purposes of clarity, TO-can
14 is not shown in its entirety but rather is shown housed within an outer portion or barrel of TOSA
10.) A TO-
can 14 provides an economical way to hermetically package the laser diode (not shown) and the monitoring photodiode (not shown). The laser diode and photodiode can be formed in respective semiconductor dies that are attached to a substrate of a submount assembly inside TO can
14. Other components such as discrete electrical components and optical elements are typically also attached to the submount assembly substrate inside TO-can
14. The TO-can
14 commonly includes a cylindrical cap and a
header 16, to which the cylindrical metal cap is hermetically attached. After the laser diode die and other components have been attached to the substrate, the leads of the die are wire bonded to conductors formed in the submount assembly substrate. These conductors are then wire bonded to corresponding
electrical contact pins 18 that extend through
header 16 to the exterior of TOSA
10.
As illustrated in
FIG. 2, a printed
circuit board assembly 20, which can also be housed along with TOSA
10 within the optical transceiver housing (not shown), processes electrical signals that are communicated to and from TOSA
10. Printed
circuit board assembly 20 can include one or more
integrated circuit packages 22 and other
electronic devices 23, such as discrete circuit elements that can include resistors, capacitors, transistors, etc. (not shown), mounted on a printed
circuit board 24. A
flexible circuit 26 can convey the electrical signals between TOSA
10 and printed
circuit board assembly 20. More specifically, a first end of
flexible circuit 26 can be attached to
header 16 by placing it flat against
header 16 such that
pins 18 extend through holes in
flexible circuit 26, and soldering
pins 18 to conductive pads surrounding the holes. A second end of
flexible circuit 26 can be attached to printed
circuit board 24 by soldering
conductive fingers 28 of
flexible circuit 26 to corresponding pads on printed
circuit board 24.
Flexible circuit 26 includes
conductive traces 30 that extend from the pads surrounding the holes at the first end of
flexible circuit 26 to corresponding ones of
conductive fingers 28 at the second end of
flexible circuit 26. Elements of the processing circuitry of printed
circuit board assembly 20 receive input signals from an external system (not shown) and generate signals for biasing and otherwise driving the laser diode. Some of
conductive traces 30 convey the generated signals to TOSA
10, where they are provided to the laser diode via some of
pins 18. Signals produced by the monitoring photodiode in TOSA
10 are provided by others of
pins 18 to others of
conductive traces 30, which convey the produced signals to printed
circuit board assembly 20. Other elements of the processing circuitry of printed
circuit board assembly 20 receive these signals produced by the photodiode and process them by, for example, detecting a current. As a result of processing the photodiode signals, the processing circuitry of printed
circuit board assembly 20 can adjust the signals generated for driving the laser diode, in a feedback control manner. Although the processing circuitry is essentially entirely located on printed
circuit board assembly 20 in this type of transceiver, in at least one instance a small inductor has been mounted on the
flexible circuit 26.
Although the above-described transmitter configuration in which a TOSA is coupled to processing circuitry on a printed circuit board via a flexible circuit is common, other configurations are known. For example, in another transmitter configuration the processing circuitry and the laser are co-packaged within a module.
SUMMARY
Embodiments of the present invention relate to an optical transmitter that includes a transmitter optical subassembly (TOSA) having a receptacle end and a package end, a flexible circuit, and one or more active electronic devices mounted on the flexible circuit. The package end contains at least one opto-electronic device, such as laser, and has two or more TOSA electrical contacts. A first end of the flexible circuit is attached to the TOSA electrical contacts. A second end of the flexible circuit is attachable to a circuit board. Some of the conductive traces of the flexible circuit couple the one or more electronic devices that are mounted on the flexible circuit with corresponding ones of the TOSA electrical contacts. Others of the conductive traces of the flexible circuit couple the one or more electronic devices that are mounted on the flexible circuit with the circuit board. The one or more electronic devices process signals communicated between the circuit board and the laser or other opto-electronic device in the TOSA.
Other systems, methods, features, and advantages will be or become apparent to one with skill in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the specification, and be protected by the accompanying claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present invention.
FIG. 1 is a perspective view of a transmitter optical subassembly (TOSA), in accordance with the prior art.
FIG. 2 is a perspective view of an optical transmitter in which the TOSA of FIG. 1 is coupled to a circuit board by a flexible circuit.
FIG. 3 is a perspective view of an optical transmitter, in accordance with an exemplary embodiment of the invention.
FIG. 4 is a side elevation view of the optical transmitter of FIG. 3
FIG. 5 is a block diagram of the optical transmitter of FIG. 3.
DETAILED DESCRIPTION
As illustrated in
FIGS. 3-5, in an illustrative or exemplary embodiment of the invention, a transmitter optical subassembly (TOSA)
32 includes a transistor outline (TO) package or TO-can
34 at the end of TOSA
32 opposite the
receptacle end 35 from which optical signals are emitted. The TO-can
34 includes a
header 36 and
electrical contact pins 38 that extend through
header 36 to the exterior of TOSA
32. The TO-can
34 and its
header 36 can be of a conventional type. For example, TO-can
34 and its
header 36 can conform to a well-known standard such as TO-46, TO-56, TO-38, etc. As the structure and function of TO-can
34 are well understood in the art, these aspects are not described herein in further detail. It should be understood, however, that TO-can
34 of TOSA
32 includes a
laser 39 and a
monitor photodiode 40, as illustrated in
FIG. 5. Although in the exemplary embodiment TO-can
34 includes both
laser 39 and
monitor photodiode 40, in other embodiments such a TO-can can include only one such opto-electronic device or can include other types of opto-electronic devices.
A
flexible circuit 42 interconnects TOSA
32 with a printed
circuit board assembly 44. More specifically, a first end of
flexible circuit 42 is attached to
header 36 by placing it flat against
header 36 such that
electrical contact pins 38 extend through holes in
flexible circuit 36, and soldering
pins 38 to conductive pads on the surface of
flexible circuit 36 surrounding the holes. A second end of
flexible circuit 36 can be attached to a printed
circuit board 46 of printed
circuit board assembly 44 by soldering
conductive fingers 48 at a second end of
flexible circuit 42 to corresponding pads on printed
circuit board 46.
Flexible circuit 42 includes
conductive traces 50 that extend from the pads surrounding the holes at the first end of
flexible circuit 42 to corresponding ones of
conductive fingers 48 at the second end of
flexible circuit 26.
Electronic devices 52, which can include active devices such as surface-mount integrated circuit devices and passive devices such discrete circuit elements (e.g., resistors, capacitors, transistors, etc.), are mounted on
flexible circuit 42.
Electronic devices 52 can be mounted on a portion of
flexible circuit 42 that lies parallel with the surface of
header 36 and thus remains substantially flat. Note that the first end of
flexible circuit 42 rests against the surface of
header 36 and is thus maintained in a flat state, but farther from the first end
flexible circuit 42 begins to bend or flex toward the surface of printed
circuit board 46. Note that the
optical axis 53 along which light is emitted from TOSA
32 is normal to the first end of
flexible circuit 42. Mounting
electronic devices 52 near the first end of
flexible circuit 42, i.e., on the portion that is substantially flat or parallel with the surface of
header 36, can minimize stress on
electronic devices 52 and their corresponding electrical connections with
flexible circuit 42. In other embodiments (not shown), a stiffener can be attached to the back surface of
flexible circuit 42 to help maintain the portion of
flexible circuit 42 on which
electronic devices 52 are mounted in a substantially flat state.
As illustrated in
FIG. 5,
electronic devices 52 can define some or all of the processing circuitry involved in controlling
laser 39. More specifically,
electronic devices 52 can include
laser driver circuitry 54 and photodiode
current sensor circuitry 56. Some of
conductive traces 50 of
flexible circuit 42 connect
laser driver circuitry 54 to some of electrical contact pins
38, which in turn are connected to
laser 39 by conductive paths internal to TO-
can 34. Others of
conductive traces 50 connect photodiode
current sensor circuitry 56 to others of electrical contact pins
38, which in turn are connected to monitor
photodiode 40 by conductive paths internal to TO-
can 34. Thus,
conductive traces 50 electrically
interconnect circuit board 46,
electronic devices 52, and electrical contact pins
38, and
electronic devices process 52 signals communicated between
circuit board 46 and the opto-electronic devices (i.e.,
laser 39 and monitor photodiode
40). For purposes of clarity, not all of these interconnections are shown in
FIG. 3. Not only portions of some of
conductive traces 50 not shown for purposes of clarity, but there can be additional
conductive traces 50 on the back or reverse side of
flexible circuit 42 or on an intermediate layer of
flexible circuit 42 between the front and back layers.
In operation, two or more of
conductive traces 50 convey electrical signals from
circuit board 46 to the one or more
electronic devices 52 that define
laser driver circuitry 54. The one or more
electronic devices 52 that define
laser driver circuitry 54 process the electrical signals into laser driving signals. As such driver circuitry is well understood in the art it is not described in further detail herein. Two or more others of
conductive traces 50 convey the laser driving signals to corresponding ones of electrical contact pins
38. The laser driving signals are conveyed from electrical contact pins
38 to
laser 39 by conductive paths internal to TO-can
34 in the conventional manner.
Laser 39 emits optical signals in response to and corresponding to the driving signals. The optical signals are emitted from
receptacle end 35 of
TOSA 32. The relatively short distance between
laser 39 and the one or more
electronic devices 52 that produce the laser driver signals helps to minimize impedance mismatch and thus promote good performance at high frequencies. Note that although
laser 39 is not shown in
FIGS. 3-4,
laser 39 is immediately behind
header 36 and thus substantially adjacent to the one or more
electronic devices 52 that produce the laser driver signals. Also note that in a conventional TOSA
10 (
FIG. 1), the electronic devices that produce the laser driver signals are not packaged inside TO-can
14 but rather are mounted on printed
circuit board assembly 20 for a number of reasons, including that the electronic devices can emit enough heat to be detrimental to TO-can
14 and that a typical conventional TO-can
14 lacks a sufficient number of contact pins. Thus, in the embodiment illustrated in
FIGS. 3-4,
electronic devices 52 are mounted sufficiently far from
laser 39 to inhibit heat transfer to TO-can
34 yet close enough to
laser 39 to help minimize impedance mismatch and thus promote good performance at high frequencies.
Monitor photodiode 40 monitors the output of
laser 39 inside TO-can
34 in the conventional manner, producing photodiode feedback signals. The laser driving signals are conveyed to some of electrical contact pins
38 by conductive paths internal to TO-
can 34. Two or more others of
conductive traces 50 convey the photodiode feedback signals from these ones of electrical contact pins
38 to the one or more
electronic devices 52 that define photodiode
current sensor circuitry 56. Photodiode
current sensor circuitry 56 processes the photodiode feedback signals by producing sensing signals that correspond to the output (current) produced by
monitor photodiode 40. Photodiode
current sensor circuitry 56 can provide the sensing signals to
laser driver circuitry 54 through some of
conductive traces 50 as feedback for controlling
laser 39. Alternatively, or in addition, still other
conductive traces 50 can convey the photodiode sensing signals from photodiode
current sensor circuitry 56 to
circuit board 46.
Although in the above-described
embodiment TOSA 32 includes a transistor outline package or TO-
can 34, in other embodiments a TOSA can include any other suitable type of package in which the laser or other opto-electronic device is housed. For example, in other embodiments a TOSA can include a type of package known as a XMD. A TOSA having an XMD package is similar to the above-described
TOSA 32 except that the flexible circuit extends away from the header in a direction parallel to the optical axis of the TOSA rather than perpendicular or normal to the optical axis (i.e., parallel to the TO-can header) as in the above-described embodiment.
One or more illustrative or exemplary embodiments of the invention have been described above. However, it is to be understood that the invention is defined by the appended claims and is not limited to the specific embodiments described.