US8611755B2 - Optical transmitter with hybridly integrated driver - Google Patents
Optical transmitter with hybridly integrated driver Download PDFInfo
- Publication number
- US8611755B2 US8611755B2 US13/015,311 US201113015311A US8611755B2 US 8611755 B2 US8611755 B2 US 8611755B2 US 201113015311 A US201113015311 A US 201113015311A US 8611755 B2 US8611755 B2 US 8611755B2
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- US
- United States
- Prior art keywords
- tosa
- flexible circuit
- header
- electronic device
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 42
- 238000012545 processing Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 14
- 230000005693 optoelectronics Effects 0.000 claims description 11
- 238000005476 soldering Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
- H04B10/504—Laser transmitters using direct modulation
Definitions
- optical transceiver modules are used to transmit and receive optical signals over optical fibers.
- a transmitter optical subassembly (TOSA) 10 is commonly housed within such an optical transceiver module (not shown).
- the TOSA 10 includes a laser diode that is driven with electrical signals representing data to be transmitted. In response to the electrical signals, the laser produces amplitude modulated optical signals that represent the data.
- the optical signals are emitted from an emitting end or receptacle end 12 of TOSA 10 .
- the optical signals can be transmitted over an optical fiber (not shown) that is mated with receptacle end 12 of TOSA 10 .
- the TOSA 10 can also include a photodiode that monitors the output of the laser diode to aid feedback control of the laser diode.
- TO-can 14 The end of TOSA 10 opposite receptacle end 12 commonly includes a transistor outline (TO) package or TO-can 14 .
- TO-can 14 is not shown in its entirety but rather is shown housed within an outer portion or barrel of TOSA 10 .
- a TO-can 14 provides an economical way to hermetically package the laser diode (not shown) and the monitoring photodiode (not shown).
- the laser diode and photodiode can be formed in respective semiconductor dies that are attached to a substrate of a submount assembly inside TO can 14 .
- Other components such as discrete electrical components and optical elements are typically also attached to the submount assembly substrate inside TO-can 14 .
- the TO-can 14 commonly includes a cylindrical cap and a header 16 , to which the cylindrical metal cap is hermetically attached. After the laser diode die and other components have been attached to the substrate, the leads of the die are wire bonded to conductors formed in the submount assembly substrate. These conductors are then wire bonded to corresponding electrical contact pins 18 that extend through header 16 to the exterior of TOSA 10 .
- a printed circuit board assembly 20 which can also be housed along with TOSA 10 within the optical transceiver housing (not shown), processes electrical signals that are communicated to and from TOSA 10 .
- Printed circuit board assembly 20 can include one or more integrated circuit packages 22 and other electronic devices 23 , such as discrete circuit elements that can include resistors, capacitors, transistors, etc. (not shown), mounted on a printed circuit board 24 .
- a flexible circuit 26 can convey the electrical signals between TOSA 10 and printed circuit board assembly 20 . More specifically, a first end of flexible circuit 26 can be attached to header 16 by placing it flat against header 16 such that pins 18 extend through holes in flexible circuit 26 , and soldering pins 18 to conductive pads surrounding the holes.
- a second end of flexible circuit 26 can be attached to printed circuit board 24 by soldering conductive fingers 28 of flexible circuit 26 to corresponding pads on printed circuit board 24 .
- Flexible circuit 26 includes conductive traces 30 that extend from the pads surrounding the holes at the first end of flexible circuit 26 to corresponding ones of conductive fingers 28 at the second end of flexible circuit 26 .
- Elements of the processing circuitry of printed circuit board assembly 20 receive input signals from an external system (not shown) and generate signals for biasing and otherwise driving the laser diode. Some of conductive traces 30 convey the generated signals to TOSA 10 , where they are provided to the laser diode via some of pins 18 .
- Signals produced by the monitoring photodiode in TOSA 10 are provided by others of pins 18 to others of conductive traces 30 , which convey the produced signals to printed circuit board assembly 20 .
- Other elements of the processing circuitry of printed circuit board assembly 20 receive these signals produced by the photodiode and process them by, for example, detecting a current.
- the processing circuitry of printed circuit board assembly 20 can adjust the signals generated for driving the laser diode, in a feedback control manner.
- the processing circuitry is essentially entirely located on printed circuit board assembly 20 in this type of transceiver, in at least one instance a small inductor has been mounted on the flexible circuit 26 .
- Embodiments of the present invention relate to an optical transmitter that includes a transmitter optical subassembly (TOSA) having a receptacle end and a package end, a flexible circuit, and one or more active electronic devices mounted on the flexible circuit.
- the package end contains at least one opto-electronic device, such as laser, and has two or more TOSA electrical contacts.
- a first end of the flexible circuit is attached to the TOSA electrical contacts.
- a second end of the flexible circuit is attachable to a circuit board.
- Some of the conductive traces of the flexible circuit couple the one or more electronic devices that are mounted on the flexible circuit with corresponding ones of the TOSA electrical contacts.
- Others of the conductive traces of the flexible circuit couple the one or more electronic devices that are mounted on the flexible circuit with the circuit board.
- the one or more electronic devices process signals communicated between the circuit board and the laser or other opto-electronic device in the TOSA.
- FIG. 1 is a perspective view of a transmitter optical subassembly (TOSA), in accordance with the prior art.
- TOSA transmitter optical subassembly
- FIG. 2 is a perspective view of an optical transmitter in which the TOSA of FIG. 1 is coupled to a circuit board by a flexible circuit.
- FIG. 3 is a perspective view of an optical transmitter, in accordance with an exemplary embodiment of the invention.
- FIG. 4 is a side elevation view of the optical transmitter of FIG. 3
- FIG. 5 is a block diagram of the optical transmitter of FIG. 3 .
- a transmitter optical subassembly (TOSA) 32 includes a transistor outline (TO) package or TO-can 34 at the end of TOSA 32 opposite the receptacle end 35 from which optical signals are emitted.
- the TO-can 34 includes a header 36 and electrical contact pins 38 that extend through header 36 to the exterior of TOSA 32 .
- the TO-can 34 and its header 36 can be of a conventional type.
- TO-can 34 and its header 36 can conform to a well-known standard such as TO-46, TO-56, TO-38, etc. As the structure and function of TO-can 34 are well understood in the art, these aspects are not described herein in further detail.
- TO-can 34 of TOSA 32 includes a laser 39 and a monitor photodiode 40 , as illustrated in FIG. 5 .
- TO-can 34 includes both laser 39 and monitor photodiode 40
- such a TO-can can include only one such opto-electronic device or can include other types of opto-electronic devices.
- a flexible circuit 42 interconnects TOSA 32 with a printed circuit board assembly 44 . More specifically, a first end of flexible circuit 42 is attached to header 36 by placing it flat against header 36 such that electrical contact pins 38 extend through holes in flexible circuit 36 , and soldering pins 38 to conductive pads on the surface of flexible circuit 36 surrounding the holes. A second end of flexible circuit 36 can be attached to a printed circuit board 46 of printed circuit board assembly 44 by soldering conductive fingers 48 at a second end of flexible circuit 42 to corresponding pads on printed circuit board 46 . Flexible circuit 42 includes conductive traces 50 that extend from the pads surrounding the holes at the first end of flexible circuit 42 to corresponding ones of conductive fingers 48 at the second end of flexible circuit 26 .
- Electronic devices 52 which can include active devices such as surface-mount integrated circuit devices and passive devices such discrete circuit elements (e.g., resistors, capacitors, transistors, etc.), are mounted on flexible circuit 42 .
- Electronic devices 52 can be mounted on a portion of flexible circuit 42 that lies parallel with the surface of header 36 and thus remains substantially flat. Note that the first end of flexible circuit 42 rests against the surface of header 36 and is thus maintained in a flat state, but farther from the first end flexible circuit 42 begins to bend or flex toward the surface of printed circuit board 46 . Note that the optical axis 53 along which light is emitted from TOSA 32 is normal to the first end of flexible circuit 42 .
- Mounting electronic devices 52 near the first end of flexible circuit 42 can minimize stress on electronic devices 52 and their corresponding electrical connections with flexible circuit 42 .
- a stiffener can be attached to the back surface of flexible circuit 42 to help maintain the portion of flexible circuit 42 on which electronic devices 52 are mounted in a substantially flat state.
- electronic devices 52 can define some or all of the processing circuitry involved in controlling laser 39 . More specifically, electronic devices 52 can include laser driver circuitry 54 and photodiode current sensor circuitry 56 . Some of conductive traces 50 of flexible circuit 42 connect laser driver circuitry 54 to some of electrical contact pins 38 , which in turn are connected to laser 39 by conductive paths internal to TO-can 34 . Others of conductive traces 50 connect photodiode current sensor circuitry 56 to others of electrical contact pins 38 , which in turn are connected to monitor photodiode 40 by conductive paths internal to TO-can 34 .
- conductive traces 50 electrically interconnect circuit board 46 , electronic devices 52 , and electrical contact pins 38 , and electronic devices process 52 signals communicated between circuit board 46 and the opto-electronic devices (i.e., laser 39 and monitor photodiode 40 ).
- the opto-electronic devices i.e., laser 39 and monitor photodiode 40
- FIG. 3 not all of these interconnections are shown in FIG. 3 .
- Not only portions of some of conductive traces 50 not shown for purposes of clarity, but there can be additional conductive traces 50 on the back or reverse side of flexible circuit 42 or on an intermediate layer of flexible circuit 42 between the front and back layers.
- two or more of conductive traces 50 convey electrical signals from circuit board 46 to the one or more electronic devices 52 that define laser driver circuitry 54 .
- the one or more electronic devices 52 that define laser driver circuitry 54 process the electrical signals into laser driving signals.
- driver circuitry is well understood in the art it is not described in further detail herein.
- Two or more others of conductive traces 50 convey the laser driving signals to corresponding ones of electrical contact pins 38 .
- the laser driving signals are conveyed from electrical contact pins 38 to laser 39 by conductive paths internal to TO-can 34 in the conventional manner.
- Laser 39 emits optical signals in response to and corresponding to the driving signals.
- the optical signals are emitted from receptacle end 35 of TOSA 32 .
- laser 39 is not shown in FIGS. 3-4 , laser 39 is immediately behind header 36 and thus substantially adjacent to the one or more electronic devices 52 that produce the laser driver signals.
- the electronic devices that produce the laser driver signals are not packaged inside TO-can 14 but rather are mounted on printed circuit board assembly 20 for a number of reasons, including that the electronic devices can emit enough heat to be detrimental to TO-can 14 and that a typical conventional TO-can 14 lacks a sufficient number of contact pins.
- electronic devices 52 are mounted sufficiently far from laser 39 to inhibit heat transfer to TO-can 34 yet close enough to laser 39 to help minimize impedance mismatch and thus promote good performance at high frequencies.
- Monitor photodiode 40 monitors the output of laser 39 inside TO-can 34 in the conventional manner, producing photodiode feedback signals.
- the laser driving signals are conveyed to some of electrical contact pins 38 by conductive paths internal to TO-can 34 .
- Two or more others of conductive traces 50 convey the photodiode feedback signals from these ones of electrical contact pins 38 to the one or more electronic devices 52 that define photodiode current sensor circuitry 56 .
- Photodiode current sensor circuitry 56 processes the photodiode feedback signals by producing sensing signals that correspond to the output (current) produced by monitor photodiode 40 .
- Photodiode current sensor circuitry 56 can provide the sensing signals to laser driver circuitry 54 through some of conductive traces 50 as feedback for controlling laser 39 .
- still other conductive traces 50 can convey the photodiode sensing signals from photodiode current sensor circuitry 56 to circuit board 46 .
- TOSA 32 includes a transistor outline package or TO-can 34
- a TOSA can include any other suitable type of package in which the laser or other opto-electronic device is housed.
- a TOSA can include a type of package known as a XMD.
- a TOSA having an XMD package is similar to the above-described TOSA 32 except that the flexible circuit extends away from the header in a direction parallel to the optical axis of the TOSA rather than perpendicular or normal to the optical axis (i.e., parallel to the TO-can header) as in the above-described embodiment.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Semiconductor Lasers (AREA)
- Optical Head (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/015,311 US8611755B2 (en) | 2011-01-27 | 2011-01-27 | Optical transmitter with hybridly integrated driver |
DE102011090108A DE102011090108A1 (en) | 2011-01-27 | 2011-12-29 | Optical transmitter with hybrid integrated driver |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/015,311 US8611755B2 (en) | 2011-01-27 | 2011-01-27 | Optical transmitter with hybridly integrated driver |
Publications (2)
Publication Number | Publication Date |
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US20120195601A1 US20120195601A1 (en) | 2012-08-02 |
US8611755B2 true US8611755B2 (en) | 2013-12-17 |
Family
ID=46511502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/015,311 Active 2031-11-02 US8611755B2 (en) | 2011-01-27 | 2011-01-27 | Optical transmitter with hybridly integrated driver |
Country Status (2)
Country | Link |
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US (1) | US8611755B2 (en) |
DE (1) | DE102011090108A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140370724A1 (en) * | 2012-04-18 | 2014-12-18 | Hewlett-Packard Development Company, L.P. | Flexible circuit cable with floating contact |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9252882B2 (en) * | 2013-07-05 | 2016-02-02 | Ezconn Corporation | Optical fiber module |
CN105137546B (en) * | 2015-09-17 | 2017-01-04 | 中国电子科技集团公司第八研究所 | active optical cable connector assembly |
CN108333694B (en) * | 2018-02-11 | 2020-08-14 | 青岛海信宽带多媒体技术有限公司 | Optical secondary module and optical module |
US10754111B1 (en) * | 2019-04-22 | 2020-08-25 | The Boeing Company | Method for modifying small form factor pluggable transceiver for avionics applications |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5204806A (en) * | 1986-12-27 | 1993-04-20 | Canon Kabushiki Kaisha | Flexible printed circuit board |
US5774614A (en) | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
US6665191B2 (en) * | 2001-09-10 | 2003-12-16 | Cardiac Pacemakers, Inc. | Multi-folded printed wiring construction for an implantable medical device |
US6863453B2 (en) | 2003-01-28 | 2005-03-08 | Emcore Corporation | Method and apparatus for parallel optical transceiver module assembly |
US20060032665A1 (en) * | 2004-07-09 | 2006-02-16 | Ice Donald A | Single layer flex circuit |
US20060062526A1 (en) * | 2004-09-17 | 2006-03-23 | Fujitsu Limited | Optical module |
US7066659B2 (en) | 2002-02-14 | 2006-06-27 | Finisar Corporation | Small form factor transceiver with externally modulated laser |
US7176436B2 (en) | 2003-12-11 | 2007-02-13 | Intel Corporation | Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header |
US20070053392A1 (en) | 2005-08-25 | 2007-03-08 | Akihiro Moto | Optical transmitting module including laser diode mounted on driver circuit |
US7215557B2 (en) * | 2003-08-27 | 2007-05-08 | Visteon Global Technologies, Inc. | Assembly comprising multiple microelectronic modules |
US7275937B2 (en) * | 2004-04-30 | 2007-10-02 | Finisar Corporation | Optoelectronic module with components mounted on a flexible circuit |
US7311240B2 (en) * | 2004-04-30 | 2007-12-25 | Finisar Corporation | Electrical circuits with button plated contacts and assembly methods |
US7322754B2 (en) * | 2004-02-11 | 2008-01-29 | Jds Uniphase Corporation | Compact optical sub-assembly |
US7439449B1 (en) * | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US7446261B2 (en) * | 2001-09-06 | 2008-11-04 | Finisar Corporation | Flexible circuit boards with tooling cutouts for optoelectronic modules |
US20090023398A1 (en) * | 2004-08-20 | 2009-01-22 | Koninklijke Philips Electronics N.V. | Wireless Terminal, Wireless Module and Method of Manufacturing such a Terminal |
US7496251B2 (en) | 2003-09-24 | 2009-02-24 | International Business Machines Corporation | Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines |
US7526207B2 (en) * | 2002-10-18 | 2009-04-28 | Finisar Corporation | Flexible circuit design for improved laser bias connections to optical subassemblies |
US20100080567A1 (en) | 2008-09-30 | 2010-04-01 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Parallel optical transceiver module having a balanced laser driver arrangement |
US7945169B2 (en) * | 2006-10-04 | 2011-05-17 | Sumitomo Electric Industries, Ltd. | Optical transceiver with a plurality of optical subassemblies electrically connected by integrated FPC board with a substrate |
US7970283B2 (en) * | 2005-03-07 | 2011-06-28 | Finisar Corporation | High speed SFP transceiver |
US8057109B2 (en) * | 2008-05-20 | 2011-11-15 | Finisar Corporation | Transceiver module with dual printed circuit boards |
US8195295B2 (en) * | 2008-03-20 | 2012-06-05 | Greatbatch Ltd. | Shielded three-terminal flat-through EMI/energy dissipating filter |
-
2011
- 2011-01-27 US US13/015,311 patent/US8611755B2/en active Active
- 2011-12-29 DE DE102011090108A patent/DE102011090108A1/en not_active Withdrawn
Patent Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5204806A (en) * | 1986-12-27 | 1993-04-20 | Canon Kabushiki Kaisha | Flexible printed circuit board |
US5774614A (en) | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
US7446261B2 (en) * | 2001-09-06 | 2008-11-04 | Finisar Corporation | Flexible circuit boards with tooling cutouts for optoelectronic modules |
US6665191B2 (en) * | 2001-09-10 | 2003-12-16 | Cardiac Pacemakers, Inc. | Multi-folded printed wiring construction for an implantable medical device |
US7439449B1 (en) * | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US7066659B2 (en) | 2002-02-14 | 2006-06-27 | Finisar Corporation | Small form factor transceiver with externally modulated laser |
US7526207B2 (en) * | 2002-10-18 | 2009-04-28 | Finisar Corporation | Flexible circuit design for improved laser bias connections to optical subassemblies |
US6863453B2 (en) | 2003-01-28 | 2005-03-08 | Emcore Corporation | Method and apparatus for parallel optical transceiver module assembly |
US7215557B2 (en) * | 2003-08-27 | 2007-05-08 | Visteon Global Technologies, Inc. | Assembly comprising multiple microelectronic modules |
US7496251B2 (en) | 2003-09-24 | 2009-02-24 | International Business Machines Corporation | Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines |
US7176436B2 (en) | 2003-12-11 | 2007-02-13 | Intel Corporation | Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header |
US7322754B2 (en) * | 2004-02-11 | 2008-01-29 | Jds Uniphase Corporation | Compact optical sub-assembly |
US7275937B2 (en) * | 2004-04-30 | 2007-10-02 | Finisar Corporation | Optoelectronic module with components mounted on a flexible circuit |
US7311240B2 (en) * | 2004-04-30 | 2007-12-25 | Finisar Corporation | Electrical circuits with button plated contacts and assembly methods |
US20060032665A1 (en) * | 2004-07-09 | 2006-02-16 | Ice Donald A | Single layer flex circuit |
US20090023398A1 (en) * | 2004-08-20 | 2009-01-22 | Koninklijke Philips Electronics N.V. | Wireless Terminal, Wireless Module and Method of Manufacturing such a Terminal |
US20060062526A1 (en) * | 2004-09-17 | 2006-03-23 | Fujitsu Limited | Optical module |
US7970283B2 (en) * | 2005-03-07 | 2011-06-28 | Finisar Corporation | High speed SFP transceiver |
US20070053392A1 (en) | 2005-08-25 | 2007-03-08 | Akihiro Moto | Optical transmitting module including laser diode mounted on driver circuit |
US7945169B2 (en) * | 2006-10-04 | 2011-05-17 | Sumitomo Electric Industries, Ltd. | Optical transceiver with a plurality of optical subassemblies electrically connected by integrated FPC board with a substrate |
US8195295B2 (en) * | 2008-03-20 | 2012-06-05 | Greatbatch Ltd. | Shielded three-terminal flat-through EMI/energy dissipating filter |
US8057109B2 (en) * | 2008-05-20 | 2011-11-15 | Finisar Corporation | Transceiver module with dual printed circuit boards |
US20100080567A1 (en) | 2008-09-30 | 2010-04-01 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Parallel optical transceiver module having a balanced laser driver arrangement |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140370724A1 (en) * | 2012-04-18 | 2014-12-18 | Hewlett-Packard Development Company, L.P. | Flexible circuit cable with floating contact |
Also Published As
Publication number | Publication date |
---|---|
US20120195601A1 (en) | 2012-08-02 |
DE102011090108A1 (en) | 2012-08-02 |
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