US8509039B1 - Thermally-assisted recording (TAR) disk with low thermal-conductivity underlayer - Google Patents
Thermally-assisted recording (TAR) disk with low thermal-conductivity underlayer Download PDFInfo
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- US8509039B1 US8509039B1 US13/535,499 US201213535499A US8509039B1 US 8509039 B1 US8509039 B1 US 8509039B1 US 201213535499 A US201213535499 A US 201213535499A US 8509039 B1 US8509039 B1 US 8509039B1
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- 229910005335 FePt Inorganic materials 0.000 claims abstract description 44
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 38
- 239000000956 alloy Substances 0.000 claims abstract description 38
- 229910018979 CoPt Inorganic materials 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 229910002066 substitutional alloy Inorganic materials 0.000 claims abstract description 5
- 230000005291 magnetic effect Effects 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- -1 FeAlSi Inorganic materials 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 229910002056 binary alloy Inorganic materials 0.000 claims description 4
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910019236 CoFeB Inorganic materials 0.000 claims description 2
- 229910005435 FeTaN Inorganic materials 0.000 claims description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 241000849798 Nita Species 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 15
- 229910017052 cobalt Inorganic materials 0.000 abstract description 3
- 239000010941 cobalt Substances 0.000 abstract description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract description 3
- 238000006467 substitution reaction Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 103
- 239000010408 film Substances 0.000 description 9
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 7
- 235000002639 sodium chloride Nutrition 0.000 description 7
- 239000011780 sodium chloride Substances 0.000 description 7
- 229910003162 MgO-NiO Inorganic materials 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 230000005415 magnetization Effects 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910052593 corundum Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000684 Cobalt-chrome Inorganic materials 0.000 description 1
- 229910017961 MgNi Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 230000005290 antiferromagnetic effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010952 cobalt-chrome Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
- G11B5/65—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
- G11B5/658—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition containing oxygen, e.g. molecular oxygen or magnetic oxide
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
- G11B5/7369—Two or more non-magnetic underlayers, e.g. seed layers or barrier layers
- G11B5/737—Physical structure of underlayer, e.g. texture
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
- G11B5/743—Patterned record carriers, wherein the magnetic recording layer is patterned into magnetic isolated data islands, e.g. discrete tracks
- G11B5/746—Bit Patterned record carriers, wherein each magnetic isolated data island corresponds to a bit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
- G11B2005/0005—Arrangements, methods or circuits
- G11B2005/0021—Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
Definitions
- This invention relates generally to a thermally-assisted recording (TAR) disk drive, in which data are written while the magnetic recording layer on the disk is at an elevated temperature, and more specifically to an improved TAR disk.
- TAR thermally-assisted recording
- thermally-assisted recording also called heat-assisted magnetic recording (HAMR)
- HAMR heat-assisted magnetic recording
- high-K u magnetic recording material is heated locally during writing to lower the coercivity enough for writing to occur, but where the coercivity/anisotropy is high enough for thermal stability of the recorded bits at the ambient temperature of the disk drive (i.e., the normal operating or “room” temperature of approximately 15-30° C.).
- the magnetic recording material is heated to near or above its Curie temperature.
- the recorded data is then read back at ambient temperature by a conventional magnetoresistive read head.
- TAR disk drives have been proposed for both conventional continuous media, wherein the magnetic recording material is a continuous layer on the disk, and for bit-patterned media (BPM), wherein the magnetic recording material is patterned into discrete data islands or “bits”.
- One type of proposed TAR disk drive uses a “small-area” heater to direct heat to just the area of the data track where data is to be written by the write head.
- the most common type of small-area TAR disk drive uses a laser source and an optical waveguide with a near-field transducer (NFT).
- NFT near-field transducer refers to “near-field optics”, wherein the passage of light is through an element with subwavelength features and the light is coupled to a second element, such as a substrate like a magnetic recording medium, located a subwavelength distance from the first element.
- the NFT is typically located at the air-bearing surface (ABS) of the air-bearing slider that also supports the read/write head and rides or “flies” above the disk surface.
- ABS air-bearing surface
- One type of proposed high-K u TAR media with perpendicular magnetic anisotropy is an alloy of FePt or CoPt alloy chemically-ordered in the L1 0 phase.
- the chemically-ordered FePt alloy in its bulk form, is known as a face-centered tetragonal (FCT) L1 0 -ordered phase material (also called a CuAu material).
- FCT face-centered tetragonal
- the c-axis of the L1 0 phase is the easy axis of magnetization and is oriented perpendicular to the disk substrate.
- the FePt and CoPt alloys require deposition at high temperature or subsequent high-temperature annealing to achieve the desired chemical ordering to the L1 0 phase.
- An insulating crystalline MgO layer is typically located below the FePt layer to enhance the growth of the FePt material and to confine the heat from the NFT to the FePt.
- a problem associated with a TAR disk is optimization of the amount of heat to the FePt recording layer. If the thermal conductivity of the MgO insulating layer is too high the heat from the NFT will be distributed too rapidly, which will require more laser power to heat the FePt material. If the thermal conductivity of the MgO insulating layer is too low the heat from the NFT will be confined to the recording layer and will spread laterally through the recording layer. This is undesirable because the lateral spreading of the heat may cause recorded data in adjacent data tracks to be overwritten. Thus there is a trade-off in the design of a TAR disk to optimize the properties of the insulating layer and optional heat sink layer to both minimize the amount of heat required and to prevent lateral spreading of the heat through the recording layer.
- the invention relates to a TAR disk with an improved insulating layer beneath the chemically-ordered FePt (or CoPt) alloy recording layer.
- the insulating layer is a solid substitution crystalline alloy MgXO, where the element X is selected from nickel (Ni) and cobalt (Co).
- the MgXO crystalline alloy has a significantly lower thermal conductivity than the prior art MgO crystalline alloy.
- the composition of the MgXO crystalline solid substitutional alloy is of the form (Mg (100-y) X y )O where y is between 10 and 90, and more preferably between 20 and 80.
- the thermal conductivity of the MgXO layer is selected to have one-half the thermal conductivity of MgO (i.e., essentially twice as insulating), then approximately the same amount of laser power would be required to heat the FePt layer sufficient for writing as would be required to heat the FePt layer with a MgO layer twice as thick. Because the MgXO crystalline lattice should substantially match the crystalline lattice of MgO to assure proper growth of the FePt, it is important that the element X added to the solid substitutional crystalline alloy not significantly alter the lattice parameter.
- the TAR disk of the invention may also include an optional layer of crystalline “pure” MgO in addition to the MgXO layer.
- This insulating MgO layer may be located between the MgXO layer and the FePt recording layer and in contact with the recording layer, or between an underlayer and the MgXO layer.
- the optional MgO layer may be used to improve the growth of the material of the layer above it, either the FePt recording layer or the MgXO layer.
- the relative thickness of the MgO and MgXO layers may be selected to optimize the thermal conductivity of the two layers.
- FIG. 1 is a top view of a thermally-assisted recording (TAR) disk drive as proposed in the prior art.
- TAR thermally-assisted recording
- FIG. 2 depicts a sectional view, not drawn to scale because of the difficulty in showing the very small features, of an air-bearing slider for use in TAR disk drive and a portion of a bit-patterned-media (BPM) TAR disk according to the prior art.
- BPM bit-patterned-media
- FIG. 3 is a cross-section of a TAR disk according to the invention.
- FIG. 4 is a graph of thermal conductivity of the bulk solid solution system of MgO—NiO as a function of volume percent NiO.
- FIG. 5 is a cross-section of an alternative embodiment of the TAR disk according to the invention.
- FIG. 1 is a top view of a thermally-assisted recording (TAR) disk drive 100 as proposed in the prior art.
- the TAR disk drive 100 is depicted with a disk 200 with magnetic recording layer 31 patterned into discrete data islands 30 of magnetizable material arranged in radially-spaced circular tracks 118 , with only a few islands 30 and representative tracks 118 near the inner and outer diameters of disk 200 being shown.
- the TAR disk drive may instead use disks with a conventional continuous magnetic recording layer 31 of magnetizable material.
- the drive 100 has a housing or base 112 that supports an actuator 130 and a drive motor for rotating the magnetic recording disk 200 .
- the actuator 130 may be a voice coil motor (VCM) rotary actuator that has a rigid arm 131 and rotates about pivot 132 as shown by arrow 133 .
- a head-suspension assembly includes a suspension 135 that has one end attached to the end of actuator arm 131 and a head carrier, such as an air-bearing slider 120 , attached to the other end of suspension 135 .
- the suspension 135 permits the slider 120 to be maintained very close to the surface of disk 200 and enables it to “pitch” and “roll” on the air-bearing generated by the disk 200 as it rotates in the direction of arrow 20 .
- the slider 120 supports the TAR head (not shown), which includes a magnetoresistive read head, an inductive write head, the near-field transducer (NFT), optical waveguide and optionally the laser.
- the TAR head (not shown), which includes a magnetoresistive read head, an inductive write head, the near-field transducer (NFT), optical waveguide and optionally the laser.
- the slider 120 is typically formed of a composite material, such as a composite of alumina/titanium-carbide (Al 2 O 3 /TiC). Only one disk surface with associated slider and read/write head is shown in FIG. 1 , but there are typically multiple disks stacked on a hub that is rotated by a spindle motor, with a separate slider and TAR head associated with each surface of each disk.
- FIG. 2 depicts a sectional view, not drawn to scale because of the difficulty in showing the very small features, of air-bearing slider 120 for use in TAR disk drive 100 and a portion of a BPM TAR disk 200 .
- the air-bearing slider 120 has an air-bearing surface (ABS) that faces the disk 200 and supports the write head 50 (with yoke 54 and write pole 52 ), read head 60 , and magnetically permeable read head shields S 1 and S 2 .
- the slider 120 also supports a laser 70 , mirror 71 , optical channel or waveguide 72 and NFT 74 , which has its output at the ABS.
- While the slider 120 is depicted as supporting a mirror 71 for directing the laser radiation from laser 70 into waveguide 72 , it is known to use a grating coupler coupled to the waveguide, as described for example in US 20090310459 A1. In another approach, the emitted laser light from a laser diode is directly coupled to the waveguide 72 .
- the BPM recording layer 31 includes discrete data islands 30 separated by nonmagnetic regions 32 .
- the recording layer 31 is high-K u material, typically an alloy of FePt or CoPt alloy chemically-ordered in the L1 0 phase.
- An insulating layer 19 typically a layer of MgO, which has a cubic “rock-salt” crystalline structure, is located below the recording layer 31 to help control the heat flow so that heat is not distributed too rapidly and to also enhance the crystalline formation of the FePt material.
- An underlayer 21 is located between the disk substrate and the insulating layer 19 .
- the underlayer 21 may include a seed layer for the MgO layer 19 , an optional heat sink layer and an optional soft underlayer (SUL).
- the write pole 52 When write-current is directed through coil 56 , the write pole 52 directs magnetic flux to the data islands 30 , as represented by arrow 80 directed to one of the data islands 30 .
- the dashed line 17 with arrows shows the flux return path back to the return pole 54 .
- the NFT 74 directs near-field radiation, as represented by wavy arrow 82 , to the data islands 30 as the TAR disk 200 moves in the direction 20 relative to the slider 120 .
- NFTs typically use a low-loss metal (e.g., Au, Ag, Al or Cu) shaped in such a way to concentrate surface charge motion at a surface feature shaped as a primary apex or tip. Oscillating tip charge creates an intense near-field pattern.
- the metal structure can create resonant charge motion, called surface plasmons or local plasmons, to further increase intensity.
- the electromagnetic field of the oscillating tip charge then gives rise to optical output in the near field, which is directed to the data islands on the disk.
- the electric charge oscillations in the NFT heat the data islands 30 at the same time the data islands are exposed to the write field from the write pole 52 . This raises the temperature of the magnetic recording material in the data islands to near or above its Curie temperature to thereby lower the coercivity of the material and enable the magnetization of the data islands to be switched by the write field.
- One of the problems associated with a TAR disk like disk 200 is optimization of the amount of heat to the recording layer 31 . If the thermal conductivity of insulating layer 19 is too high the heat from the NFT 74 will be distributed too rapidly, which will require more laser power to heat the recording layer 31 . If the thermal conductivity of insulating layer 19 is too low the heat from the NFT 74 will be confined to the recording layer 31 and will spread laterally through the recording layer 31 . This is undesirable, especially with continuous media, because the lateral spreading of the heat may cause recorded data in adjacent data tracks to be overwritten. Thus there is a trade-off in the design of a TAR disk to optimize the properties of the insulating layer and optional heat sink layer to both minimize the amount of heat required and to prevent lateral spreading of the heat through the recording layer.
- FIG. 3 is a cross section of a TAR disk 300 according to the invention.
- the hard disk substrate 301 is preferably any commercially available glass substrate, but may also be a conventional aluminum alloy with a NiP surface coating, or an alternative substrate, such as silicon or silicon-carbide.
- An insulating layer 319 is located below the recording layer 331 and an underlayer 321 is located between the substrate 301 and insulating layer 319 .
- a protective overcoat (OC) 340 is deposited on the recording layer 331 , preferably to a thickness between about 2-5 nm.
- the OC 340 may be sputter-deposited amorphous carbon, like diamond-like carbon (DLC), which may also be hydrogenated and/or nitrogenated.
- DLC diamond-like carbon
- Other materials that may be used for the OC 340 include carbides such as silicon carbides and boron carbides; nitrides such as silicon nitrides (SiN x ), titanium nitrides, and boron nitrides; metal oxides, such as TiO 2 , ZrO 2 , Al 2 O 3 , Cr 2 O 3 , Ta2O 5 and ZrO 2 —Y 2 O 3 ; and mixtures of these materials.
- carbides such as silicon carbides and boron carbides
- nitrides such as silicon nitrides (SiN x ), titanium nitrides, and boron nitrides
- metal oxides such as TiO 2 , ZrO 2 , Al 2 O 3 , Cr 2 O 3 , Ta2O 5 and ZrO 2 —Y 2 O 3 ; and mixtures of these materials.
- the recording layer 331 is a chemically-ordered FePt alloy (or CoPt alloy) with perpendicular magnetic anisotropy.
- the FePt layer is typically between about 3-10 nm thick.
- Chemically-ordered alloys of FePt (and CoPt) ordered in L1 0 are known for their high magneto-crystalline anisotropy and magnetization, properties that are desirable for high-density magnetic recording materials.
- the chemically-ordered FePt alloy in its bulk form, is known as a face-centered tetragonal (FCT) L1 0 -ordered phase material (also called a CuAu material).
- the c-axis of the L1 0 phase is the easy axis of magnetization and is oriented perpendicular to the disk substrate.
- the chemically-ordered FePt alloy may be the generally equiatomic binary FePt alloy, but may also be a pseudo-binary alloy based on the FePt L1 0 phase, e.g., (Fe(y)Pt(100-y))—Z, where y is between about 45 and 55 atomic percent and the element Z may be Ni, Au, Cu, Pd or Ag and is present in the range of between about 0% to about 20% atomic percent.
- the pseudo-binary alloy in general has similarly high anisotropy as the binary alloy FePt, it allows additional control over the magnetic and other properties of the recording layer.
- the addition of Cu reduces the Curie temperature by about 100-150 K.
- the method will be described for media with a FePt recording layer, the method is also fully applicable to media with a CoPt (or a pseudo-binary CoPt—Z alloy based on the CoPt L 10 phase) recording layer.
- the recording layer 331 may also optionally include one or more segregants, such as one or more of SiO 2 , C, B, BN and a silicon nitride (SiNx) that form between the FePt (or CoPt) grains to reduce the grain size.
- the FePt recording layer 331 may sputter deposited onto the insulating layer 319 while the disk substrate 301 is maintained at an elevated temperature greater than about 300° C. At this temperature the FePt alloy becomes fully chemically ordered and a subsequent high-temperature annealing is not required.
- the FePt may be sputter deposited from a single composite target having generally equal atomic amounts of Fe and Pt or co-sputtered from separate targets.
- sequential alternating layers of Fe and Pt can be deposited while the substrate is heated by sputter depositing from separate Fe and Pt targets, using a shutter to alternately cover the Fe and Pt targets, with each Fe and Pt layer having a thickness in the range of about 0.15 nm to 0.25 nm to achieve a total thickness of about 3 to 10 nm for layer 331 .
- the FePt may be deposited as described above but with the substrate at room temperature, followed by high temperature annealing to achieve the chemical ordering.
- the insulating layer 319 below recording layer 331 is a solid substitution crystalline alloy MgXO, where the element X is selected from nickel (Ni) and cobalt (Co), with a thickness between about 5-15 nm.
- the MgXO crystalline alloy has a significantly lower thermal conductivity than the prior art MgO crystalline alloy.
- FIG. 4 (reproduced from Introduction to Ceramics, 2 nd Edition , W. David Kingery, 1976) shows the thermal conductivity of the bulk solid solution system of MgO—NiO as a function of volume percent NiO.
- the thermal conductivity of thin (in the range of approximately 2-20 nm) MgO films is generally the same as the thermal conductivity of bulk MgO at 1000° C.
- the thermal conductivity of thin MgO—NiO films is generally the same as the thermal conductivity of bulk MgO—NiO at 1000° C., which is shown in FIG. 4 .
- the thermal conductivity of MgO can be significantly reduced if Ni forms between 10 and 90 percent of the total of Ni and Mg, and preferably between 20 and 80 percent.
- the thermal conductivity of a thin MgO—NiO film will be about one-fourth for about 60 volume percent NiO (corresponding to 30 atomic percent Ni and 20 atomic percent Mg in the MgNiO, or Mg 20 Ni 30 O 50 ), and about one-half for about 20 volume percent NiO (Mg 40 Ni 10 O 50 ).
- the composition of the MgXO crystalline solid substitutional alloy is of the form (Mg (100-y) X y )O where y is between 10 and 90, and more preferably between 20 and 80.
- the thermal conductivity of the MgXO layer is selected to have one-half the thermal conductivity of MgO (i.e., essentially twice as insulating), then approximately the same amount of laser power would be required to heat the FePt layer sufficient for writing as would be required to heat the FePt layer with a MgO layer twice as thick. Also, modeling results show that for an insulating crystalline layer of 9 nm thickness beneath the FePt layer, a 17% reduction in laser power can be achieved if the insulating layer is (MgNi)O instead of MgO. Also, the thickness and specific composition of the (Mg (100-y) X y )O material can be selected to achieve the desired level of thermal conductivity.
- MgXO crystalline lattice should substantially match the crystalline lattice of MgO to assure proper growth of the FePt, it is important that the element X added to the solid substitutional crystalline alloy not significantly alter the lattice parameter.
- NiO and CoO have a rock-salt crystalline structure with lattice parameters that substantially match that of MgO.
- the lattice parameters of MgO, NiO and CoO are 4.21 ⁇ , 4.18 ⁇ and 4.26 ⁇ , respectively.
- the most stable oxide structure for both Ni and Co is the rock-salt crystalline structure, i.e., NiO and CoO, respectively.
- the stable oxide for each of these elements is a structure other than the rock-salt crystalline structure, for example SiO 2 and B 2 O 3 which are amorphous, Al 2 O 3 and Cr 2 O 3 which form a corundum trigonal structure, and TiO 2 , MoO 2 and RuO 2 which form a rutile tetragonal structure.
- the underlayer 321 includes a seed layer 321 a below and in contact with the insulating MgXO layer 319 to enhance the crystalline growth of the MgXO material.
- the preferred seed layer 321 a material is a NiTa alloy with a thickness in the range of about 5-100 nm. NiW may also function as a suitable seed layer.
- the underlayer 321 may also include an optional heat sink layer 321 b .
- Heat sink layer 321 b may be formed of a material that is a good thermal conductor, like Cu, Au, Ag or other suitable metals or metal alloys. Heat sink layer 321 b may be necessary to facilitate the transfer of heat away from recording layer 331 to prevent spreading of heat to regions of the recording layer adjacent to where data is desired to be written, thus preventing overwriting of data in adjacent data tracks.
- the underlayer 321 may also include an optional soft underlayer (SUL) 321 c of magnetically permeable material that serves as a flux return path for the magnetic flux from the write pole, as depicted by dashed line 17 in FIG. 2 .
- the SUL 321 c may be formed of magnetically permeable materials such as alloys of CoNiFe, FeCoB, CoCuFe, NiFe, FeAlSi, FeTaN, FeN, FeTaC, CoTaZr, CoFeTaZr, CoFeB, and CoZrNb.
- the SUL 321 c may also be a laminated or multilayered SUL formed of multiple soft magnetic films separated by nonmagnetic films, such as electrically conductive films of Al or CoCr.
- the SUL 321 c may also be a laminated or multilayered SUL formed of multiple soft magnetic films separated by interlayer films that mediate an antiferromagnetic coupling, such as Ru, Ir, or Cr or alloys thereof.
- the SUL 321 c may have a thickness in the range of about 5 to 50 nm.
- the TAR disk of the invention may also include an optional layer of crystalline “pure” MgO in addition to the MgXO layer.
- This insulating MgO layer 320 may be located between the MgXO layer 319 and the recording layer 331 and in contact with the recording layer 331 , as shown in FIG. 5 , or between underlayer 321 and MgXO layer 319 .
- the MgO layer may be used to improve the growth of the material of the layer above it, either the FePt recording layer or the MgXO layer.
- the relative thickness of the MgO and MgXO layers may be selected to optimize the thermal conductivity of the two layers.
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