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Method for making an electronic label and electronic label obtained by said method

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US7815122B2
US7815122B2 US10594089 US59408904A US7815122B2 US 7815122 B2 US7815122 B2 US 7815122B2 US 10594089 US10594089 US 10594089 US 59408904 A US59408904 A US 59408904A US 7815122 B2 US7815122 B2 US 7815122B2
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contact
strips
wire
chip
welding
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US20070194130A1 (en )
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Pierre-Alain Bauer
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Eric Bauer
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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06Coil winding
    • H01F41/076Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49149Assembling terminal to base by metal fusion bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49158Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916Simultaneous circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49162Manufacturing circuit on or in base by using wire as conductive path
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor
    • Y10T29/49179Assembling terminal to elongated conductor by metal fusion bonding

Abstract

A method of making an electronic label including a chip (1) provided with two contact strips (2, 3) onto which a conducting wire (4) is welded in a single operation. The segment of conducting wire (4) forming the antenna is then cut between the two contact strips (2, 3) of chip (1). The group of chip and antenna thus realized may then be encapsulated between two sheets of a fibrous or plastic material.

Description

Object of the present invention is a method of making an electronic label, as well as an electronic label obtained by realizing the method. Another object of the invention is a welding electrode allowing the method of making an electronic label according to the invention to be realized. The invention more particularly is concerned with the steps of a manufacturing process by which an electronic label can be produced that basically consists of a fibrous support such as paper and/or textile for instance, or of a plastic support, holding an electronic chip provided with two contact strips as well as an antenna consisting of a conducting wire.

Electronic labels are passive devices, or perhaps active devices, that can exchange data with an adequate reader also fitted with an antenna. With passive devices, data exchange between the reader and the electronic label occurs via electromagnetic coupling. When the label is close to the reader, the radiation field emitted by the reader's antenna allows the energy to be furnished that is required for the function of the electronic chip in the label.

Numerous applications are apt to use this technology, the management of a stock of articles provided with such labels, or the identification of objects bearing electronic labels being cited as nonlimiting examples. These electronic labels are marked out as an advantageous replacement of the bar codes or other ID markers on the most diverse objects, so as to optimise stock management that will then become automatic, or any other processing of the data supplied by these articles.

One of the particular difficulties encountered in the manufacture of such labels resides in fixing the antenna on the contact strips of the chip integrated into the label. This operation is in fact made difficult by the very small size of the chips used in such labels.

Known technologies for instance involve fixing the ends of the antenna with conductive glue on each of the two contact strips of the chip. Other technologies involve screen printing to integrate the antenna into a plastic sheet and then laminating this sheet onto the support of the label receiving the chip. These known technologies have certain disadvantages, of which for the use of conductive glues, one may cite the fact that the glue ought to be applied in a highly precise fashion to very small surface areas. For this reason one cannot avoid a flowing of the glue provoking short circuits making the label useless.

The laminating technologies in turn are difficult and costly in their realization.

It is the aim of the present invention to propose a method of making one or a number of electronic labels that is simple to realize, and allows electronic labels to be made more rapidly and more advantageously.

This aim is attained by a method of making that is distinguished by the characteristics cited in claims 1 and 3.

Another aim of the invention consists in offering a tool, and more particularly a welding electrode or welding head, that allows the method of making to be realized, and is distinguished by the characteristics cited in claim 7.

The aims, objects, and characteristics of the invention will become more apparent from a reading of the following description made while referring to the appended drawings in which:

FIG. 1 illustrates an electronic chip used to realize a label according to the invention.

FIG. 2 shows the operation of pulling a conducting wire, to be connected to the chip.

FIG. 3 illustrates more particularly the welding electrode prior to the welding operation that allows the method of the invention to be realized.

FIG. 4 illustrates the chip during the operation of welding of the conducting wire forming the antenna.

FIG. 5 illustrates in a schematic way a version of the manufacture of an electronic label according to the invention where two segments of conducting wire are used to realize the antenna.

Reference is made to FIG. 1 schematically illustrating a chip 1 provided with two contact strips 2, 3. The contact strips (2, 3) consist of a raised point of gold or tin, for instance, generally called a ‘gold bumper’ or ‘solder bumper’ according to sanctioned Anglo-Saxon terminology. The chips 1 used to realize the electronic labels according to the invention can be passive UHF chips, that is, chips lacking a power source that are powered by electromagnetic coupling thanks to a reader (not shown) that is provided with an antenna. The voltage induced in the label's antenna will be rectified and serves to power the chip. The chips available commercially typically will work at a distance of about four meters, and can be processed at the rate of about 400 articles per second.

An example of passive chips that can be used to realize the electronic labels according to the invention are those distributed under reference number EM4222 of the Swiss company EM Microelectronic-Marin SA.

The dimensions of such chips are of the order of 700 microns by 900 microns, while the gap between the contact strips 2 and 3 is of the order of 400 microns. The diameter of the contact strips is of the order of 80 microns.

It is understood that the method of making that is object of the invention may immediately be applied to realizing electronic labels using other chips, such as active chips or high-frequency chips, for example, when a conductor serving as an antenna must be connected with the chip's contact strips.

In the following description, the manufacturing steps are described in terms of a manual manufacture of an electronic label. It is obvious that all these steps may be automated in part or in full, by known means beyond the scope of the present application, and which for this reason will not be described in detail.

In FIG. 1 a chip 1 adapted for realizing an electronic label laid out on a flat support piece is schematically represented. The bottom face of chip 1 that has no contact strips is in contact with the top face of the support piece.

An open dipole antenna must be connected to the contact strips 2, 3 of chip 1 in order to realize the electronic label. The antenna consists of a conducting wire 4, a copper wire for instance having a diameter between 50 and 100 microns.

In FIG. 2, a conducting wire 4 is taken from a reel and brought in front of the two contact strips 2, 3 of chip 1. The wire 4 is cut at its two ends A and B once it has attained the length desired for antenna formation.

The next step of the method of making consists of welding the conducting wire 4 to the two contact strips 2, 3. This is realized with a welding electrode 5 having an active portion exhibiting an end provided with a recess 6 in its center. The width of recess 6 essentially corresponds to the distance between the two contact strips 2, 3, its depth to at least the height of the contact strips 2, 3. By way of example, such a welding electrode or welding head is schematically represented in FIG. 3 in its position just prior to the welding operation.

In FIG. 4 the welding head is pressed against the conducting wire. Under the effects of heat and pressure, the wire 4 is welded in a single operation to both contact strips 2, 3. The part of the conducting wire 4 between the two contact strips 2, 3 will deform under the effect of the heat. Moreover, the pressure exerted by the welding head 5 on wire 4 tends to accentuate this deformation, by adding to the material between the two contact strips 2, 3. Trials have shown that the conducting wire 4 undergoes a slight deformation forming a circular arc in the direction of recess 6 of the welding electrode.

The following step consists in cutting the conducting wire between the two connecting strips 2, 3 with the aid of an appropriate cutting tool, so as to eliminate the short circuit formed while welding the wire 4 onto the contact strips 2, 3.

To be noted that the welding operation, by virtue of the shape of electrode 5 comprising a recess 6, allows the wire 4 to be welded in a single operation to both contact strips 2, 3, which is an advantage with respect to operating speed. Actually, in other processes each end of the conducting wire is welded separately, which requires two distinct welding operations and attending loss of time. By virtue of the particular configuration of the welding head, and more particularly the recess 6 present in its center, one obtains a deformation of the conducting wire 4 after the welding operation that facilitates the cutting operation. Actually the segment of wire 4 between the contact strips 2, 3 exhibits the configuration of a circular arc facing outward, which diminishes the risk of damaging the chip during the operation of cutting the wire.

In a variant of the process illustrated in part in FIG. 5, wire 4 is cut to the appropriate length in advance, and at least a portion of each of the two segments of wire 4 is brought in front of one of the two contact strips 2, 3. In this variant the welding operation is again unique, and allows the antenna to be formed in a single operation during which the two segments of the conducting wire 4 are welded to the strips 2, 3 with the aid of welding electrode 5.

The last step required to realize the electronic label consists of enveloping the assembly constituted by chip 1 provided with its antenna 4, between two layers of an appropriate material. To do this one may apply any known technology, cold or hot laminating of two sheets of a fibrous material (textile or paper) or of plastic, cold or hot gluing, or any other means to enclose chip 1 provided with its antenna 4 between two sheets of an ad hoc material.

In a variant, the electronic label merely consists of chip 1 provided with its antenna, to be directly integrated into diverse objects such as clothing for instance. In this case it is not necessary to enclose the chip with its antenna between two sheets of a fibrous material.

In another variant, the conducting wire 4 intended to form the antenna of the label is surrounded by a textile fiber sheathing. In this case a short length of wire must be stripped before being welded to the contact strips 2, 3 of chip 1.

The electronic labels obtained by this method are manufactured rapidly, partly by virtue of the unique welding operation. They also offer great reliability, inasmuch as the risk of short-circuiting of the two contact strips is reduced relative to other manufacturing technologies.

Claims (19)

1. Method of making an electronic label comprising an electronic chip (1) provided with two contact strips (2, 3) and an antenna formed from conducting wire (4), comprising:
placing the chip (1) on a support piece so that the contact strips (2, 3) of said chip are situated on the side opposite to that in contact with the support piece;
taking conducting wire (4) from a reel and placing it on the support such that at least one portion is positioned facing the two contact strips of the chip (1); and
welding the conducting wire (4) in a single welding operation onto the two contact strips (2, 3) to form the antenna of the electronic label,
wherein the welding of the conducting wire or wires (4) onto the contact strips (2, 3) is done with a welding electrode (5) having an active portion with an end, and at the end of its active portion a recess (6), such that the recess (6) has a width that essentially corresponds to the gap between the two contact strips (2, 3) enabling the welding electrode (5) to weld the antenna to the contact strip but not welding the wire in the gap between the contact strips.
2. Method of making an electronic label according to claim 1, further comprising cutting a portion of the conducting wire (4) forming the antenna situated between the two contact strips (2, 3) above chip (1).
3. Method of making an electronic label comprising an electronic chip (1) provided with two contact strips (2, 3) and an antenna formed of conducting wire (4) comprising:
cutting the conducting wire (4) into two segments, at least one portion of each of the two segments of the conducting wire is positioned facing a contact strip (2, 3) of the chip (1);
welding the two segment portions in a single welding operation onto the two contact strips (2, 3) of chip (1) to form the antenna of the electronic label,
wherein the welding of the conducting wire or wires (4) onto the contact strips (2, 3) is done with a welding electrode (5) having an active portion with an end, and at the end of its active portion a recess (6), such that the recess (6) has a width that essentially corresponds to the gap between the two contact strips (2, 3) enabling the welding electrode (5) to weld the antenna to the contact strip but not welding the wire in the gap between the contact strips.
4. Method of making an electronic label according to claim 1, further comprising integrating the chip (1) provided with its antenna (4) between two sheets of a fibrous or plastic material.
5. Electronic label comprising a chip (1) and an antenna consisting of a conducting wire (4) welded onto the contact strips (2, 3) of chip (1), characterized in that it is made by the method of claim 1.
6. Method of making an electronic label according to claim 1, wherein the single welding operation simultaneously welds the conducting wire (4) to the two contact strips (2, 3) of the chip (1).
7. Method of making an electronic label according to claim 1, wherein the recess (6) of the welding electrode (5) has a depth essentially corresponding to a height of the two contact strips (2, 3) of the chip (1).
8. Method of making an electronic label according to claim 1, further comprising cutting a portion of the conducting wire (4) forming the antenna situated between the two contact strips (2, 3) into two segments before the step of welding.
9. Method of making an electronic label according to claim 8, wherein after the step of welding the two segments of the conducting wire (4) between the contact strips (2, 3) exhibit the configuration of a circular arc facing outward from the chip (1).
10. Electronic label comprising a chip (1) and an antenna consisting of a conducting wire (4) welded onto the contact strips (2, 3) of chip (1), characterized in that it is made by the method of claim 3.
11. Method of making an electronic label according to claim 3, further comprising integrating the chip (1) provided with its antenna (4) between two sheets of a fibrous or plastic material.
12. Welding electrode (5) for realizing the method of claim 3, wherein the recess (6) of the welding electrode (5) has a depth essentially corresponding to a height of the two contact strips (2, 3) of the chip (1).
13. Method of making an electronic label according to claim 3, wherein the single welding operation simultaneously welds the two segment portions to the two contact strips (2, 3) of the chip (1).
14. Method of making an electronic label according to claim 3, wherein after the step of welding the two segments of the conducting wire (4) between the contact strips (2, 3) exhibit the configuration of a circular arc facing outward from the chip (1).
15. Method of making an electronic label comprising an electronic chip (1) provided with two contact strips (2, 3) and an antenna formed from conducting wire (4), comprising:
placing the chip (1) on a support piece so that the contact strips (2, 3) of said chip are situated on the side opposite to that in contact with the support piece;
taking conducting wire (4) from a reel and placing it on the support such that at least one portion is positioned facing the two contact strips of the chip (1); and
welding the conducting wire (4) in a single welding operation onto the two contact strips (2, 3) to form the antenna of the electronic label,
wherein the welding of the conducting wire or wires (4) onto the contact strips (2, 3) is done with a welding electrode (5) having an active portion with an end, and at the end of its active portion a recess (6), such that the recess (6) has dimensions that essentially correspond to the spaced between the two contact strips (2, 3) enabling electrode to weld the antenna to the contact strip but not welding the wire between the contact strips disposed in the recess (6).
16. Method of making an electronic label according to claim 15, wherein the single welding operation simultaneously welds the conducting wire (4) to the two contact strips (2, 3) of the chip (1).
17. Method of making an electronic label according to claim 15, wherein the recess (6) of the welding electrode (5) has a depth essentially corresponding to a height of the two contact strips (2, 3) of the chip (1).
18. Method of making an electronic label according to claim 15, further comprising cutting a portion of the conducting wire (4) forming the antenna situated between the two contact strips (2, 3) into two segments before the step of welding.
19. Method of making an electronic label according to claim 18, wherein after the step of welding the two segments of the conducting wire (4) between the contact strips (2, 3) exhibit the configuration of a circular arc facing outward from the chip (1).
US10594089 2004-03-25 2004-03-25 Method for making an electronic label and electronic label obtained by said method Active 2026-07-19 US7815122B2 (en)

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US20150231729A1 (en) * 2014-02-14 2015-08-20 GM Global Technology Operations LLC Electrode for resistance spot welding of dissimilar metals

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1738303B1 (en) * 2004-03-25 2008-09-17 Bauer, Eric Method for making an electronic label
CN102133686B (en) * 2011-01-24 2013-12-18 东莞市锐祥智能卡科技有限公司 Wire soldering method and device for dual interface cards
CN103632186B (en) * 2012-08-23 2017-01-25 东莞市锐祥智能卡科技有限公司 Welding dual interface card chip package and method and apparatus

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Also Published As

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EP1738303A1 (en) 2007-01-03 application
DE602004016690D1 (en) 2008-10-30 grant
WO2005093645A1 (en) 2005-10-06 application
US20070194130A1 (en) 2007-08-23 application

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