US7667950B2 - Multilayer capacitor and electronic device - Google Patents

Multilayer capacitor and electronic device

Info

Publication number
US7667950B2
US7667950B2 US11882018 US88201807A US7667950B2 US 7667950 B2 US7667950 B2 US 7667950B2 US 11882018 US11882018 US 11882018 US 88201807 A US88201807 A US 88201807A US 7667950 B2 US7667950 B2 US 7667950B2
Authority
US
Grant status
Grant
Patent type
Prior art keywords
internal
capacitor
electrode
electrodes
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US11882018
Other versions
US20080174934A1 (en )
Inventor
Masaaki Togashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Abstract

A multilayer capacitor has a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between, a first terminal electrode provided on one end side of the laminate body, and a second terminal electrode provided on the other end side of the laminate body. The first internal electrode has a first lead portion connected to the first terminal electrode. The second internal electrode has a second lead portion connected to the second terminal electrode. The first internal electrode consists of plural types of first internal electrodes and the plural types of first internal electrodes have their respective first lead portions at different positions. Distances between the first lead portions of the respective types of the first internal electrodes and the second lead portion are different from each other.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a multilayer capacitor consisting of a lamination of dielectrics and internal electrodes, and an electronic device incorporating the same.

2. Related Background Art

A conventionally known multilayer capacitor is, for example, the one as described in Japanese Patent Application Laid-Open No. 5-166671, in which a large-capacitance capacitor and a low-capacitance capacitor are integrally arranged in parallel to form an integral capacitor body and in which an input electrode and an output electrode are provided on the integral capacitor body.

SUMMARY OF THE INVENTION

It is, however, not easy to achieve a desired resonance frequency and impedance, by integrally arranging a plurality of capacitors with different capacitances as in the above-described conventional technology. Therefore, it is difficult to realize a low impedance characteristic across a wide band.

An object of the present invention is to provide a multilayer capacitor and electronic device capable of certainly realizing low impedance across a wide band.

A multilayer capacitor according to the present invention is a multilayer capacitor comprising: a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between; a first terminal electrode provided on one end side of the laminate body; and a second terminal electrode provided on another end side of the laminate body; wherein the first internal electrode has a first lead portion connected to the first terminal electrode; wherein the second internal electrode has a second lead portion connected to the second terminal electrode; wherein the first internal electrode comprises plural types of first internal electrodes and the plural types of first internal electrodes have their respective first lead portions at different positions; wherein distances between the first lead portions of the respective types of the first internal electrodes and the second lead portion are different from each other. Each distance between the first lead portion and the second lead portion herein refers to the shortest distance in a straight line between a connection point of the first lead portion with the first terminal electrode and a connection point of the second lead portion with the second terminal electrode.

Since the multilayer capacitor of this configuration comprises the plural types of first internal electrodes, there are a plurality of capacitor portions each composed of the first internal electrode, the second internal electrode, and the dielectric layer. Incidentally, in order to control the resonance frequency of the capacitor, it is generally necessary to adjust the equivalent series inductance (ESL) or the capacitance of the capacitor. At this time, as the distance decreases between the first lead portion of the first internal electrode and the second lead portion of the second internal electrode, the equivalent series inductance of the capacitor becomes lower and, as a result, the resonance frequency of the capacitor becomes higher. In the multilayer capacitor of the present invention, the first lead portions of the respective types of the first internal electrodes have the different distances from the second lead portion of the second internal electrode, the capacitor portions corresponding to the respective types of first internal electrodes have their respective equivalent series inductances different from each other, and, as a result, the capacitor portions come to have their respective resonance frequencies different from each other. Accordingly, the multilayer capacitor has a plurality of resonance frequencies. This allows us to certainly obtain the multilayer capacitor with low impedance across a wide band. In this connection, since the number of resonance frequencies of the multilayer capacitor increases with increase in the number of types of first internal electrodes, it is feasible to achieve the low impedance across a wider band.

Preferably, the second internal electrode comprises plural types of second internal electrodes, and the plural types of second internal electrodes have their respective second lead portions at different positions; distances between the first lead portions of the respective types of the first internal electrodes and the second lead portions of the respective types of the second internal electrodes are different from each other. In this case, since the number of resonance frequencies of the multilayer capacitor increases with increase in the types of first internal electrodes and second internal electrodes, it is feasible to certainly realize the low impedance across a wider band.

Preferably, at least one type among the plural types of first internal electrodes is divided into a plurality of internal electrodes in a single layer of the laminate body; each of the divided internal electrodes has the first lead portion; areas of the respective divided internal electrodes are different from each other. In this case, a plurality of capacitor portions are formed corresponding to the plurality of divided internal electrodes, and it is thus feasible to increase the number of resonance frequencies of the multilayer capacitor, without increase in the number of layers of first internal electrodes, and to achieve the low impedance across a wider band.

The plural types of first internal electrodes may be formed in a single layer of the laminate body. In this case, the multilayer capacitor can have a plurality of resonance frequencies, while minimizing the number of layers of first internal electrodes. This permits achievement of low impedance across a wide band, while achieving miniaturization of the multilayer capacitor.

In this configuration, preferably, the plural types of first internal electrodes have their respective areas different from each other. When the respective types of first internal electrodes have their respective areas different from each other as in this configuration, the capacitor portions corresponding to the respective types of first internal electrodes come to have different equivalent series inductances and different capacitances. Therefore, it becomes feasible to control the resonance frequencies of the respective capacitor portions more minutely.

The present invention also provides an electronic device comprising a circuit board, and a multilayer capacitor mounted on the circuit board, wherein the multilayer capacitor comprises a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between, a first terminal electrode provided on one end side of the laminate body, and a second terminal electrode provided on another end side of the laminate body; wherein the first internal electrode has a first lead portion connected to the first terminal electrode; wherein the second internal electrode has a second lead portion connected to the second terminal electrode; wherein the first internal electrode comprises plural types of first internal electrodes and the plural types of first internal electrodes have their respective first lead portions at different positions; wherein distances between the first lead portions of the respective types of first internal electrodes and the second lead portion are different from each other; wherein the multilayer capacitor is mounted on the circuit board so that the first and second internal electrodes stay vertical to the circuit board.

In the electronic device of this configuration, the multilayer capacitor comprises the plural types of first internal electrodes, whereby there are a plurality of capacitor portions each composed of the first internal electrode, second internal electrode, and dielectric layer. At this time, the first lead portions of the respective types of first internal electrodes have the different distances from the second lead portions of the second internal electrodes, and thus the respective capacitor portions corresponding to the respective types of first internal electrodes come to have their respective equivalent series inductances different from each other. As a result, the capacitor portions come to have different resonance frequencies. Therefore, the multilayer capacitor has a plurality of resonance frequencies. This allows us to certainly obtain the multilayer capacitor with low impedance across a wide band.

In a state in which the multilayer capacitor is mounted on the circuit board, an electric current flows from the circuit board through the first terminal electrode to the first lead portions of the first internal electrodes, or an electric current flows from the circuit board through the second terminal electrode to the second lead portion of the second internal electrode. At this time, since the first and second internal electrodes stay vertical to the circuit board, the flow path of electric current can be kept short from the circuit board to the first internal electrode or the second internal electrode in each layer. This enables reduction in the equivalent series inductance of the multilayer capacitor.

The present invention surely realizes the low impedance across a wide band in the multilayer capacitor.

The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not to be considered as limiting the present invention.

Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a multilayer capacitor according to a first embodiment.

FIG. 2 is an exploded perspective view of a laminate body shown in FIG. 1.

FIG. 3 is a sectional view showing internal electrode layers shown in FIG. 2.

FIG. 4 is a graph showing a frequency-impedance characteristic of the multilayer capacitor shown in FIG. 1.

FIG. 5 is a perspective view showing a state in which the multilayer capacitor shown in FIG. 1 is mounted on a circuit board.

FIG. 6 is a sectional view showing internal electrode layers in a multilayer capacitor according to a second embodiment.

FIG. 7 is a sectional view showing internal electrode layers in a multilayer capacitor according to a third embodiment.

FIG. 8 is a graph showing a frequency-impedance characteristic of the multilayer capacitor shown in FIG. 7.

FIG. 9 is a sectional view showing internal electrode layers in a multilayer capacitor according to a fourth embodiment.

FIG. 10 is a sectional view showing internal electrode layers in a multilayer capacitor according to a fifth embodiment.

FIG. 11 is a graph showing a frequency-impedance characteristic of the multilayer capacitor shown in FIG. 10.

FIG. 12 is a sectional view showing internal electrode layers in a multilayer capacitor according to a sixth embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The preferred embodiments of the multilayer capacitor and electronic device according to the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing the multilayer capacitor according to the first embodiment. In the same drawing, the multilayer capacitor 1 of the present embodiment has a laminate body 2 of a rectangular parallelepiped shape (which encompasses a nearly rectangular parallelepiped shape as well as a perfect rectangular parallelepiped shape), a terminal electrode 3 disposed on one longitudinal end side of this laminate body 2, and a terminal electrode 4 disposed on the other longitudinal end side of the laminate body 2.

The terminal electrode 3 is provided so as to cover one end face of the laminate body 2 and one-end-face-side portions in the four side faces of the laminate body 2, and the terminal electrode 4 is provided so as to cover the other end face of the laminate body 2 and other-end-face-side portions in the four side faces of the laminate body 2. The terminal electrodes 3, 4 are made, for example, by forming a Ni-plated layer and a Sn-plated layer in order on a baked electrode layer of Cu, Ag, or the like.

FIG. 2 is an exploded perspective view of the laminate body 2. In the same drawings, the laminate body 2 has a structure in which plural types (four types herein) of internal electrodes (internal electrode layers) 5-8 of different shapes are alternately laminated from the top in each of plural groups with a dielectric layer 9 in between. A dielectric layer 9 is laid in the uppermost part and in the lowermost part of the laminate body 2. The internal electrodes 5-8 are made, for example, of Ni, a Ni alloy, or the like. The dielectric layers 9 are made, for example, of a dielectric material such as a BaTiO3-based ceramic.

As shown in FIGS. 2 and 3, an internal electrode 5 has a lead portion 10 led to one end face 2 a of the laminate body 2 and connected to the terminal electrode 3. An internal electrode 6 has a lead portion 11 led to the other end face 2 b of the laminate body 2 and connected to the terminal electrode 4. An internal electrode 7 has a pair of lead portions 12 respectively led to the opposing side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 3. These lead portions 12 are led to mutually corresponding positions in the side faces 2 c, 2 d. An internal electrode 8 has a pair of lead portions 13 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 4. These lead portions 13 are led to mutually corresponding positions in the side faces 2 c, 2 d. Overlap regions through the dielectric layer 9 in the internal electrodes 5-8 are of a rectangular shape.

For producing the multilayer capacitor 1 in this configuration, a ceramic paste (dielectric paste) containing ceramic powder of a BaTiO3-based ceramic, an organic binder, and a solvent is first applied onto PET film, for example, by the doctor blade method, to prepare a plurality of green sheets of a rectangular shape which are supposed to become the aforementioned dielectric layers 9. Subsequently, the green sheets are dried, and thereafter electrode patterns to become the aforementioned internal electrodes 5-8 are formed on the upper surfaces of the green sheets, for example, by the screen printing method. Then the green sheets with the electrode patterns and the simple green sheets are laminated in a predetermined order to form a green laminate body. Subsequently, the green laminate body is subjected to press working and then to debindering and firing, thereby obtaining the aforementioned laminate body 2. Finally, the terminal electrodes 3, 4 are formed on the laminate body 2, for example, by the paste dipping method and electroplating method. The above completes the aforementioned multilayer capacitor 1.

In the multilayer capacitor 1 produced in this manner, there are capacitor C1 and capacitor C2 formed. The capacitor C1 is composed of the internal electrodes 5, 6 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C2 is composed of the internal electrodes 7, 8 of the mutually opposite polarities, and the dielectric layer 9 present between them.

Now, where the equivalent series inductance (ESL) of the capacitor is represented by “L” and the capacitance by “C,” the resonance frequency “fr” of the capacitor is expressed by an equation below.

fr = 1 2 π LC

Therefore, the resonance frequency fr of the capacitor can be changed by altering values of the equivalent series inductance L and the capacitance C of the capacitor. At this time, since the equivalent series inductance L becomes lower with decrease in the distance between the lead portions of the two internal electrodes of the opposite polarities, the resonance frequency fr becomes higher.

In the multilayer capacitor 1 of the present embodiment, the lead portion 10 of the internal electrode 5 is led to the end face 2 a of the laminate body 2 and the lead portions 12 of the internal electrode 7 with the same polarity as the internal electrode 5 are led to the side faces 2 c, 2 d of the laminate body 2; therefore, the forming positions of the lead portions 10, 12 are naturally different from each other. The lead portion 11 of the internal electrode 6 is led to the end face 2 b of the laminate body 2 and the lead portions 13 of the internal electrode 8 with the same polarity as the internal electrode 6 are led to the side faces 2 c, 2 d of the laminate body 2; therefore, the forming positions of the lead portions 11, 13 are naturally different from each other.

A distance d1 between the lead portions 10, 11 in the capacitor C1 is longer than a distance d2 between the lead portions 12, 13 in the capacitor C2. Specifically, the distance d1 between the lead portions 10, 11 refers to the shortest distance in a straight line between a connection point of the lead portion 10 with the terminal electrode 3 and a connection point of the lead portion 11 with the terminal electrode 4. The distance d2 between the lead portions 12, 13 refers to the shortest distance in a straight line between a connection point of the lead portion 12 with the terminal electrode 3 and a connection point of the lead portion 13 with the terminal electrode 4.

For this reason, the equivalent series inductance (ESL) of the capacitor C2 becomes lower than the ESL of the capacitor C1, and thus the resonance frequency of the capacitor C2 becomes higher than the resonance frequency of the capacitor C1 from the aforementioned equation.

Specifically, the frequency-impedance characteristic of the multilayer capacitor 1 is as shown in FIG. 4. In the graph shown in FIG. 4, the horizontal axis indicates frequency, and the vertical axis impedance. In the graph a finely dashed line indicates a characteristic of the capacitor C1 alone (resonance frequency fr1) and a coarsely dashed line a characteristic of the capacitor C2 alone (resonance frequency fr2). Therefore, the frequency-impedance characteristic of the multilayer capacitor 1 is one passing a resonance point of impedance with the capacitor C1 alone and a resonance point of impedance with the capacitor C2 alone (cf. a solid line in the graph). Namely, the multilayer capacitor 1 has two resonance frequencies fr1, fr2.

Therefore, the multilayer capacitor 1 of the present embodiment has the low impedance across a wide frequency band including the resonance frequencies fr1, fr2, without need for the special structure in which two capacitors with different capacitances are integrally formed. This allows the multilayer capacitor 1 with the low impedance characteristic across the wide frequency band to be relatively easily realized in terms of the structure and production.

FIG. 5 is a perspective view showing an electronic device incorporating the above-described multilayer capacitor 1. In the same drawing, the electronic device 14 has a circuit board 15, and the multilayer capacitor 1 mounted on this circuit board 15. The circuit board 15 is provided with electrode patterns 16, 17 electrically connected to the terminal electrodes 3, 4, respectively, of the multilayer capacitor 1. The multilayer capacitor 1 is mounted on the circuit board 15 so that the internal electrodes 5-8 stay perpendicular (or vertical) to the circuit board 15.

In the electronic device 14 of this configuration, for example, supposing the terminal electrode 3 of the multilayer capacitor 1 is a positive (+) electrode and the terminal electrode 4 a negative (−) electrode, an electric current flows from the electrode pattern 16 of the circuit board 15 through the terminal electrode 3 to the internal electrodes 5, 7.

Incidentally, if the multilayer capacitor 1 is mounted on the circuit board 15 so that the internal electrodes 5-8 stay in an ordinary horizontal state relative to the circuit board 15, the flow path of electric current from the electrode pattern 16 to the internal electrodes 5-8 will become longer with increase in the heights of the internal electrodes 5-8 from the circuit board 15. For this reason, it leads to an increase in the ESL of the multilayer capacitor 1.

In contrast to it, the internal electrodes 5-8 stay vertical to the circuit board 15 in the present embodiment, and thus the lengths of flow paths of electric current from the electrode pattern 16 to the internal electrodes 5, 7 are identical to each other irrespective of the positions of the internal electrodes 5, 7. In addition, the lead portions 12 of the internal electrodes 7 are led to the side faces of the laminate body 2, and thus the electric current flows from the terminal electrode 3 through the lead portions 12 on the circuit board 15 side to the internal electrodes 7. This decreases roundabout flow of the electric current from the terminal electrode 3 into the internal electrodes 7. This results in decreasing the ESL of the multilayer capacitor 1.

FIG. 6 is a sectional view showing the internal electrode layers in the multilayer capacitor according to the second embodiment. In the drawing, identical or equivalent elements to those in the first embodiment will be denoted by the same reference symbols, without redundant description.

In the same drawing, the laminate body 2 of the multilayer capacitor of the present embodiment has a structure in which internal electrodes 6-8 similar to those in the first embodiment are alternately laminated from the top in each of plural groups with a dielectric layer 9 in between.

In the multilayer capacitor of this configuration, there are capacitor C1 and capacitor C2 formed. The capacitor C1 is composed of the internal electrodes 6, 7 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C2 is composed of the internal electrodes 7, 8 of the mutually opposite polarities, and the dielectric layer 9 present between them. Therefore, the two capacitors C1, C2 can be formed while the number of types of internal electrodes is smaller than in the first embodiment.

The distance d1 between the lead portions 11, 12 in the capacitor C1 is longer than the distance d2 between the lead portions 12, 13 in the capacitor C2. For this reason, the ESL of the capacitor C2 is lower than the ESL of the capacitor C1, as in the first embodiment, and the resonance frequency fr2 of the capacitor C2 is higher than the resonance frequency fr1 of the capacitor C1 (cf. FIG. 4 described above). Therefore, the multilayer capacitor has two resonance frequencies fr1, fr2, and thus achieves the low impedance across a wide frequency band.

FIG. 7 is a sectional view showing the internal electrode layers in the multilayer capacitor according to the third embodiment. In the drawing, identical or equivalent elements to those in the first embodiment will be denoted by the same reference symbols, without redundant description.

In the same drawing, the laminate body 2 of the multilayer capacitor of the present embodiment has a structure in which internal electrodes (internal electrode layers) 21-28 are alternately laminated from the bottom in each of plural groups with a dielectric layer 9 in between.

An internal electrode 21 has a lead portion 29 led to the end face 2 a of the laminate body 2 and connected to the terminal electrode 3. An internal electrode 22 has a lead portion 30 led to the end face 2 b of the laminate body 2 and connected to the terminal electrode 4. An internal electrode 23 has a pair of lead portions 31 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 3. An internal electrode 24 has a pair of lead portions 32 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 4. An internal electrode 25 has a pair of lead portions 33 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 3. An internal electrode 26 has a pair of lead portions 34 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 4. An internal electrode 27 has a pair of lead portions 35 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 3. An internal electrode 28 has a pair of lead portions 36 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 4. Overlap regions through the dielectric layer 9 in the internal electrodes 21-28 are of a rectangular shape.

In the multilayer capacitor of this configuration, there are capacitor C1, capacitor C2, capacitor C3, and capacitor C4 formed. The capacitor C1 is composed of the internal electrodes 21, 22 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C2 is composed of the internal electrodes 23, 24 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C3 is composed of the internal electrodes 25, 26 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C4 is composed of the internal electrodes 27, 28 of the mutually opposite polarities, and the dielectric layer 9 present between them.

The forming positions of the lead portions 31, 33, 35 connected to the terminal electrode 3 are shifted along the longitudinal direction of the laminate body 2. The forming positions of the lead portions 32, 34, 36 connected to the terminal electrode 4 are shifted along the longitudinal direction of the laminate body 2. For this reason, the below relation holds among the distance d1 between the lead portions 29, 30 in the capacitor C1, the distance d2 between the lead portions 31, 32 in the capacitor C2, the distance d3 between the lead portions 33, 34 in the capacitor C3, and the distance d4 between the lead portions 35, 36 in the capacitor C4.
d1>d2>d3>d4

Therefore, the below relation holds among the equivalent series inductances (ESLs) L1-L4 of the capacitors C1-C4.
L1>L2>L3>L4

Accordingly, the resonance frequencies fr1-fr4 of the capacitors C1-C4 have the below relation, and the multilayer capacitor thus has the frequency-impedance characteristic as shown in FIG. 8.
fr1<fr2<fr3<fr4

Since the multilayer capacitor has the four resonance frequencies fr1-fr4, the multilayer capacitor can be relatively easily obtained with the low impedance across a wider frequency band than in the first embodiment.

The above-described embodiment used the four types for each of the internal electrodes connected to the terminal electrodes 3, 4, but the types of internal electrodes connected to the terminal electrodes 3, 4 may be three types for each, or five or more types for each.

FIG. 9 is a sectional view showing the internal electrode layers in the multilayer capacitor according to the fourth embodiment. In the drawing, identical or equivalent elements to those in the first and third embodiments are denoted by the same reference symbols, without redundant description.

In the same drawing, the laminate body 2 of the multilayer capacitor of the present embodiment has a structure in which internal electrode layers 41-47 are alternately laminated from the bottom in each of plural groups with a dielectric layer 9 in between.

An internal electrode layer 41 is composed of an internal electrode 22 similar to that in the third embodiment; an internal electrode layer 43 is composed of an internal electrode 24 similar to that in the third embodiment; an internal electrode layer 45 is composed of an internal electrode 26 similar to that in the third embodiment; and an internal electrode layer 47 is composed of an internal electrode 28 similar to that in the third embodiment. Each of internal electrode layers 42, 44, 46 is composed of an internal electrode 48. The internal electrode 48 has a lead portion 49 led to the end face 2 a and the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 3. Overlap regions through the dielectric layer 9 in these internal electrodes are of a rectangular shape.

Since the lead portion 49 of the internal electrode 48 is led in the U-shape to the end face 2 a and side faces 2 c, 2 d of the laminate body 2, it has a width larger than those of the other lead portions. For this reason, for example, in a case where the internal electrodes 48 are used as positive (+) electrodes, an electric current effectively flows from the wide region of the terminal electrode 3 into the internal electrodes 48, which can contribute to the reduction in the ESL of the multilayer capacitor.

In the multilayer capacitor of this configuration, there are capacitor C1, capacitor C2, capacitor C3, and capacitor C4 formed. The capacitor C1 is composed of the internal electrodes 48, 22 (internal electrode layers 42, 41) of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C2 is composed of the internal electrodes 48, 24 (internal electrode layers 42, 43) of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C3 is composed of the internal electrodes 48, 26 (internal electrode layers 44, 45) of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C4 is composed of the internal electrodes 48, 28 (internal electrode layers 46, 47) of the mutually opposite polarities, and the dielectric layer 9 present between them.

At this time, the below relation holds among the distance d1 between the lead portions 49, 30 in the capacitor C1, the distance d2 between the lead portions 49, 32 in the capacitor C2, the distance d3 between the lead portions 49, 34 in the capacitor C3, and the distance d4 between the lead portions 49, 36 in the capacitor C4.
d1>d2>d3>d4

Namely, the multilayer capacitor has the four resonance frequencies fr1-fr4, as in the third embodiment, and thus can achieve the low impedance across a sufficiently wide frequency band.

The above-described embodiment used the four types of internal electrodes connected to the terminal electrode 4, but the types of internal electrodes connected to the terminal electrode 4 may be three types, or five or more types, of course.

FIG. 10 is a sectional view showing the internal electrode layers in the multilayer capacitor according to the fifth embodiment. In the drawing, identical or equivalent elements to those in the first embodiment will be denoted by the same reference symbols, without redundant description.

In the same drawing, the laminate body 2 of the multilayer capacitor of the present embodiment has a structure in which internal electrode layers 51-53 are alternately laminated from the bottom in each of plural groups with a dielectric layer 9 in between.

An internal electrode layer 51 is composed of an internal electrode 6 similar to that in the first embodiment, and an internal electrode layer 52 is composed of an internal electrode 7 similar to that in the first embodiment. An internal electrode layer 53 is composed of internal electrodes 54, 55.

The internal electrode 54 has a lead portion 56 led to the side face 2 d of the laminate body 2 and connected to the terminal electrode 4. The internal electrode 55 has a lead portion 57 led to the side face 2 c of the laminate body 2 and connected to the terminal electrode 4. The lead portion 57 is formed at the position corresponding to the lead portion 56. The internal electrodes 54, 55 are formed substantially in a structure in which an internal electrode 8 similar to that in the first embodiment is divided into two regions. The internal electrode 54 has an area larger than the internal electrode 55.

In the multilayer capacitor of this configuration, there are capacitor C1, capacitor C2, and capacitor C3 formed. The capacitor C1 is composed of the internal electrodes 7, 6 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C2 is composed of the internal electrodes 7, 54 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C3 is composed of the internal electrodes 7, 55 of the mutually opposite polarities, and the dielectric layer 9 present between them.

The distance d2 between the lead portions 12, 56 in the capacitor C2 is equal to the distance d3 between the lead portions 12, 57 in the capacitor C3. The distance d1 between the lead portions 11, 12 in the capacitor C1 is larger than the distances d2, d3. For this reason, the ESL of the capacitor C2 is equal to the ESL of the capacitor C3, and the ESL of the capacitor C1 is larger than the ESLs of the capacitors C2, C3.

However, since the area of the internal electrode 54 forming a part of the capacitor C2 is larger than the area of the internal electrode 55 forming a part of the capacitor C3, the capacitance of the capacitor C2 is larger than that of the capacitor C3.

As a result, the resonance frequencies fr1-fr3 of the capacitors C1-C3 have the below relation, and the multilayer capacitor comes to have the frequency-impedance characteristic as shown in FIG. 11.
fr1<fr2<fr3

Since the multilayer capacitor has the three resonance frequencies fr1-fr3 as described above, the low impedance can be achieved across a wide frequency band. Since the internal electrode layer 53 is composed of the internal electrodes 54, 55 with the different areas, the multilayer capacitor with the resonance frequencies fr1-fr3 can be obtained, without increase in the number of internal electrode layers more than necessary.

The above-described embodiment used the structure of the internal electrode layer 53 composed of the two internal electrodes, but it is also possible to adopt a structure consisting of three or more internal electrodes. The internal electrode layer 51 may also be constructed in a structure consisting of a plurality of internal electrodes.

FIG. 12 is a sectional view showing the internal electrode layers in the multilayer capacitor according to the sixth embodiment. In the drawing, identical or equivalent elements to those in the first and fourth embodiments will be denoted by the same reference symbols, without redundant description.

In the same drawing, the laminate body 2 of the multilayer capacitor of the present embodiment has a structure in which internal electrode layers 61, 62 are alternately laminated from the top in each of plural groups with a dielectric layer 9 in between.

An internal electrode layer 61 is composed of an internal electrode 48 similar to that in the fourth embodiment. An internal electrode layer 62 is composed of internal electrodes 63, 64 formed alongside in the longitudinal direction of the laminate body 2. The internal electrode 63 has a pair of lead portions 65 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 4. The internal electrode 64 has a lead portion 66 led to the side faces 2 c, 2 d of the laminate body 2 and connected to the terminal electrode 4. The internal electrode 63 has an area larger than the internal electrode 64.

In the multilayer capacitor of this configuration, there are capacitor C1 and capacitor C2 formed. The capacitor C1 is composed of the internal electrodes 48, 63 of the mutually opposite polarities, and the dielectric layer 9 present between them. The capacitor C2 is composed of the internal electrodes 48, 64 of the mutually opposite polarities, and the dielectric layer 9 present between them.

The distance d2 between the lead portions 49, 66 in the capacitor C2 is larger than the distance d1 between the lead portions 49, 65 in the capacitor C1. For this reason, the ESL of the capacitor C2 is larger than the ESL of the capacitor C1. However, the area of the internal electrode 63 forming a part of the capacitor C1 is larger than the area of the internal electrode 64 forming a part of the capacitor C2, and thus the capacitance of the capacitor C1 is larger than the capacitance of the capacitor C2.

At this time, when influence of the capacitances due to the areas of the internal electrodes 63, 64 is greater than influence of the ESLs due to the distance d1 between the lead portions 49, 65 and the distance d2 between the lead portions 49, 66, the resonance frequency fr1 of the capacitor C1 becomes lower than the resonance frequency fr2 of the capacitor C2, and it results in obtaining the frequency-impedance characteristic as shown in the foregoing FIG. 4.

In the present embodiment as described above, the capacitances of the capacitors C1, C2 are also appropriately adjusted in addition to the adjustment of the ESLs of the capacitors C1, C2, whereby the multilayer capacitor with two adequate resonance frequencies can be surely obtained. This allows us to obtain the multilayer capacitor with low impedance across a wide frequency band. Since the multilayer capacitor with the two resonance frequencies is obtained through the use of only the two types of internal electrode layers 61, 62, it becomes feasible to achieve simplification and miniaturization of the multilayer capacitor.

The above-described embodiment adopted the structure in which the internal electrode layer 62 was composed of the two internal electrodes 63, 64, but it is also possible to adopt a structure consisting of three or more internal electrodes, of course.

The preferred embodiments of the multilayer capacitor according to the present invention were described above, but it is noted that the present invention is by no means limited to the above embodiments. For example, the shapes of the internal electrodes, and the forming positions, shapes, numbers, etc. of the lead portions of the internal electrodes are not limited, particularly, to those in the above embodiments.

From the invention thus described, it will be obvious that the invention may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended for inclusion within the scope of the following claims.

Claims (6)

1. A multilayer capacitor comprising:
a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between;
a first terminal electrode provided on one end side of the laminate body; and
a second terminal electrode provided on another end side of the laminate body;
wherein the first internal electrode has a first lead portion connected to the first terminal electrode;
wherein the second internal electrode has a second lead portion connected to the second terminal electrode;
wherein the first internal electrode comprises plural types of first internal electrodes and the plural types of first internal electrodes have their respective first lead portions at different positions;
wherein distances between the first lead portions of the respective types of the first internal electrodes and the second lead portion are different from each other.
2. The multilayer capacitor according to claim 1,
wherein the second internal electrode comprises plural types of second internal electrodes, and the plural types of second internal electrodes have their respective second lead portions at different positions;
wherein distances between the first lead portions of the respective types of the first internal electrodes and the second lead portions of the respective types of the second internal electrodes are different from each other.
3. The multilayer capacitor according to claim 1,
wherein at least one type among the plural types of first internal electrodes is divided into a plurality of internal electrodes in a single layer of the laminate body;
wherein each of the divided internal electrodes has the first lead portion;
wherein areas of the respective divided internal electrodes are different from each other.
4. The multilayer capacitor according to claim 1,
wherein the plural types of first internal electrodes are formed in a single layer of the laminate body.
5. The multilayer capacitor according to claim 4,
wherein areas of the respective types of first internal electrodes are different from each other.
6. An electronic device comprising a circuit board, and a multilayer capacitor mounted on the circuit board,
wherein the multilayer capacitor comprises a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between, a first terminal electrode provided on one end side of the laminate body, and a second terminal electrode provided on another end side of the laminate body;
wherein the first internal electrode has a first lead portion connected to the first terminal electrode;
wherein the second internal electrode has a second lead portion connected to the second terminal electrode;
wherein the first internal electrode comprises plural types of first internal electrodes and the plural types of first internal electrodes have their respective first lead portions at different positions;
wherein distances between the first lead portions of the respective types of first internal electrodes and the second lead portion are different from each other;
wherein the multilayer capacitor is mounted on the circuit board so that the first and second internal electrodes stay vertical to the circuit board.
US11882018 2006-09-12 2007-07-30 Multilayer capacitor and electronic device Active 2028-09-30 US7667950B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006-246935 2006-09-12
JP2006246935A JP4896642B2 (en) 2006-09-12 2006-09-12 Multilayer capacitor and electronic equipment

Publications (2)

Publication Number Publication Date
US20080174934A1 true US20080174934A1 (en) 2008-07-24
US7667950B2 true US7667950B2 (en) 2010-02-23

Family

ID=39207886

Family Applications (1)

Application Number Title Priority Date Filing Date
US11882018 Active 2028-09-30 US7667950B2 (en) 2006-09-12 2007-07-30 Multilayer capacitor and electronic device

Country Status (4)

Country Link
US (1) US7667950B2 (en)
JP (1) JP4896642B2 (en)
KR (1) KR101386948B1 (en)
CN (1) CN101145448B (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090109596A1 (en) * 2007-10-31 2009-04-30 Tdk Corporation Multilayer capacitor
US20090154055A1 (en) * 2007-12-17 2009-06-18 Murata Manufacturing Co., Ltd. Multilayer capacitor
US20100091429A1 (en) * 2007-06-27 2010-04-15 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component and mounting structure thereof
US20100128413A1 (en) * 2008-11-26 2010-05-27 Murata Manufacturing Co., Ltd. Multilayer capacitor
US20100232086A1 (en) * 2009-03-13 2010-09-16 Tdk Corporation Multilayer capacitor
US20110096464A1 (en) * 2009-10-23 2011-04-28 Tdk Corporation Multilayer capacitor
US20110102969A1 (en) * 2009-11-05 2011-05-05 Tdk Corporation Multilayer capacitor, mounting structure thereof, and method of manufacturing same
US20140160619A1 (en) * 2012-12-12 2014-06-12 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
US9214283B2 (en) 2011-06-13 2015-12-15 Tdk Corporation Multilayer capacitor and method of manufacturing same
US20160027586A1 (en) * 2014-07-28 2016-01-28 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor, method for manufacturing the same, and electronic device using the same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4835686B2 (en) 2008-12-22 2011-12-14 Tdk株式会社 Multilayer capacitor
JP5234521B2 (en) * 2009-08-21 2013-07-10 Tdk株式会社 Electronic components and a method of manufacturing the same
JP5251834B2 (en) * 2009-11-05 2013-07-31 Tdk株式会社 Multilayer capacitor
US9837209B2 (en) * 2012-11-21 2017-12-05 Qualcomm Incorporated Capacitor structure for wideband resonance suppression in power delivery networks
KR101422934B1 (en) 2012-11-29 2014-07-23 삼성전기주식회사 Multi-layered ceramic electronic component
KR101452126B1 (en) * 2013-08-08 2014-10-16 삼성전기주식회사 Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part
US9627142B2 (en) * 2013-09-24 2017-04-18 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board for mounting of the same
US9460855B2 (en) * 2013-10-01 2016-10-04 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
KR20150089141A (en) * 2014-01-27 2015-08-05 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
KR20150089140A (en) * 2014-01-27 2015-08-05 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
KR101630034B1 (en) 2014-04-21 2016-06-13 삼성전기주식회사 Multi layer ceramic capacitor and circuit board for mounting the same
JP2015019083A (en) 2014-08-13 2015-01-29 株式会社村田製作所 Multilayer capacitor and mounting structure of multilayer capacitor
JP2015065455A (en) * 2014-11-13 2015-04-09 株式会社村田製作所 Three-terminal capacitor

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166671A (en) 1991-12-16 1993-07-02 Matsushita Electric Ind Co Ltd Composite capacitor
JPH07226331A (en) 1994-02-15 1995-08-22 Matsushita Electric Ind Co Ltd Laminated ceramic capacitor
JPH11288839A (en) 1998-03-31 1999-10-19 Tdk Corp Laminated chip type electronic component and manufacture thereof
JP2001044074A (en) 1999-07-27 2001-02-16 Tokin Corp Multilayer ceramic capacitor
JP2001185449A (en) 1999-12-27 2001-07-06 Tokin Ceramics Corp Laminated ceramic capacitor
US6327134B1 (en) * 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
US6452781B1 (en) * 2000-10-06 2002-09-17 Tdk Corporation Multilayer electronic device
US6657848B2 (en) * 2000-01-28 2003-12-02 Tdk Corporation Multilayer electronic device and method for producing same
JP2004140183A (en) 2002-10-17 2004-05-13 Murata Mfg Co Ltd Multilayer capacitor
JP2004296940A (en) 2003-03-27 2004-10-21 Tdk Corp Laminated capacitor
US6819543B2 (en) * 2002-12-31 2004-11-16 Intel Corporation Multilayer capacitor with multiple plates per layer
JP2005079237A (en) 2003-08-29 2005-03-24 Tdk Corp Multilayer capacitor
US6934145B2 (en) * 2000-07-06 2005-08-23 Phycomp Holding B.V. Ceramic multilayer capacitor array
JP2005243912A (en) 2004-02-26 2005-09-08 Tdk Corp Multilayer capacitor
JP2005347314A (en) 2004-05-31 2005-12-15 Tdk Corp Laminated capacitor
US7046500B2 (en) * 2004-07-20 2006-05-16 Samsung Electro-Mechanics Co., Ltd. Laminated ceramic capacitor
JP2008203259A (en) 2007-02-16 2008-09-04 Dr Johannes Heidenhain Gmbh Rotary encoder and operation of this rotary encoder
US7567427B2 (en) * 2007-10-18 2009-07-28 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035747A (en) 1999-07-21 2001-02-09 Taiyo Yuden Co Ltd Laminated ceramic capacitor
JP3502988B2 (en) 2001-07-16 2004-03-02 Tdk株式会社 Multiterminal multilayer ceramic electronic components

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166671A (en) 1991-12-16 1993-07-02 Matsushita Electric Ind Co Ltd Composite capacitor
JPH07226331A (en) 1994-02-15 1995-08-22 Matsushita Electric Ind Co Ltd Laminated ceramic capacitor
JPH11288839A (en) 1998-03-31 1999-10-19 Tdk Corp Laminated chip type electronic component and manufacture thereof
JP2001044074A (en) 1999-07-27 2001-02-16 Tokin Corp Multilayer ceramic capacitor
US6327134B1 (en) * 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP2001185449A (en) 1999-12-27 2001-07-06 Tokin Ceramics Corp Laminated ceramic capacitor
US6657848B2 (en) * 2000-01-28 2003-12-02 Tdk Corporation Multilayer electronic device and method for producing same
US6934145B2 (en) * 2000-07-06 2005-08-23 Phycomp Holding B.V. Ceramic multilayer capacitor array
US6452781B1 (en) * 2000-10-06 2002-09-17 Tdk Corporation Multilayer electronic device
JP2004140183A (en) 2002-10-17 2004-05-13 Murata Mfg Co Ltd Multilayer capacitor
US6819543B2 (en) * 2002-12-31 2004-11-16 Intel Corporation Multilayer capacitor with multiple plates per layer
JP2004296940A (en) 2003-03-27 2004-10-21 Tdk Corp Laminated capacitor
JP2005079237A (en) 2003-08-29 2005-03-24 Tdk Corp Multilayer capacitor
JP2005243912A (en) 2004-02-26 2005-09-08 Tdk Corp Multilayer capacitor
JP2005347314A (en) 2004-05-31 2005-12-15 Tdk Corp Laminated capacitor
US7046500B2 (en) * 2004-07-20 2006-05-16 Samsung Electro-Mechanics Co., Ltd. Laminated ceramic capacitor
JP2008203259A (en) 2007-02-16 2008-09-04 Dr Johannes Heidenhain Gmbh Rotary encoder and operation of this rotary encoder
US7439734B2 (en) 2007-02-16 2008-10-21 Johannes Heidenhain Gmbh Rotary encoder and method for its operation
US7567427B2 (en) * 2007-10-18 2009-07-28 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100091429A1 (en) * 2007-06-27 2010-04-15 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component and mounting structure thereof
US8130484B2 (en) * 2007-06-27 2012-03-06 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component and mounting structure thereof
US7808768B2 (en) * 2007-10-31 2010-10-05 Tdk Corporation Multilayer capacitor
US20090109596A1 (en) * 2007-10-31 2009-04-30 Tdk Corporation Multilayer capacitor
US20090154055A1 (en) * 2007-12-17 2009-06-18 Murata Manufacturing Co., Ltd. Multilayer capacitor
US8120891B2 (en) * 2007-12-17 2012-02-21 Murata Manufacturing Co., Ltd. Multilayer capacitor having low equivalent series inductance and controlled equivalent series resistance
US20100128413A1 (en) * 2008-11-26 2010-05-27 Murata Manufacturing Co., Ltd. Multilayer capacitor
US8315033B2 (en) * 2008-11-26 2012-11-20 Murata Manufacturing Co., Ltd. Multilayer capacitor having low ESL and easily controllable ESR
US20100232086A1 (en) * 2009-03-13 2010-09-16 Tdk Corporation Multilayer capacitor
US8125760B2 (en) * 2009-03-13 2012-02-28 Tdk Corporation Multilayer capacitor
US20110096464A1 (en) * 2009-10-23 2011-04-28 Tdk Corporation Multilayer capacitor
US8493710B2 (en) * 2009-10-23 2013-07-23 Tdk Corporation Multilayer capacitor with improved adhesiveness between the layers
US20110102969A1 (en) * 2009-11-05 2011-05-05 Tdk Corporation Multilayer capacitor, mounting structure thereof, and method of manufacturing same
US9214283B2 (en) 2011-06-13 2015-12-15 Tdk Corporation Multilayer capacitor and method of manufacturing same
US20140160619A1 (en) * 2012-12-12 2014-06-12 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
US9293259B2 (en) * 2012-12-12 2016-03-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component including electrode lead out portions having different lengths
US20160027586A1 (en) * 2014-07-28 2016-01-28 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor, method for manufacturing the same, and electronic device using the same

Also Published As

Publication number Publication date Type
KR101386948B1 (en) 2014-04-21 grant
US20080174934A1 (en) 2008-07-24 application
CN101145448B (en) 2012-03-28 grant
CN101145448A (en) 2008-03-19 application
KR20080024068A (en) 2008-03-17 application
JP2008071811A (en) 2008-03-27 application
JP4896642B2 (en) 2012-03-14 grant

Similar Documents

Publication Publication Date Title
US20130050893A1 (en) Multilayer ceramic capacitor
US7310217B2 (en) Monolithic capacitor and mounting structure thereof
US20130050897A1 (en) Multilayer ceramic capacitor
US20080253059A1 (en) Land grid feedthrough low esl technology
US7035079B1 (en) Multilayered chip capacitor and multilayer chip capacitor array
US20130050899A1 (en) Multilayer ceramic capacitor
US7446996B2 (en) Feedthrough capacitor array
US7394643B2 (en) Laminated electronic component
US20110102969A1 (en) Multilayer capacitor, mounting structure thereof, and method of manufacturing same
US20130058006A1 (en) Multilayer ceramic capacitor
JP2006203165A (en) Laminated chip capacitor
US20080310076A1 (en) Controlled esr decoupling capacitor
JPH07326536A (en) Ceramic capacitor
US20120162853A1 (en) Multilayer capacitor
US20060203420A1 (en) Multi-terminal type laminated capacitor and manufacturing method thereof
US20080204969A1 (en) Multilayer capacitor
JP2006190774A (en) Laminated ceramic electronic component
US20080158773A1 (en) Multilayer capacitor array
US20060279903A1 (en) Laminated capacitor
US7495884B2 (en) Multilayer capacitor
JP2006203168A (en) Laminated capacitor and packaging structure thereof
US7292430B2 (en) Multi-layer chip capacitor
JP2009021512A (en) Multilayer capacitor
US8107214B2 (en) Multilayer capacitor array having terminal conductor, to which internal electrodes are connected in parallel, connected in series to external electrodes
JP2002299152A (en) Capacitor

Legal Events

Date Code Title Description
AS Assignment

Owner name: TDK CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOGASHI, MASAAKI;REEL/FRAME:019664/0610

Effective date: 20070724

Owner name: TDK CORPORATION,JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOGASHI, MASAAKI;REEL/FRAME:019664/0610

Effective date: 20070724

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8