US7425734B2 - Thin-film transistor array with ring geometry - Google Patents
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- US7425734B2 US7425734B2 US11/190,178 US19017805A US7425734B2 US 7425734 B2 US7425734 B2 US 7425734B2 US 19017805 A US19017805 A US 19017805A US 7425734 B2 US7425734 B2 US 7425734B2
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- 239000010409 thin film Substances 0.000 title claims description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000000875 corresponding Effects 0.000 claims description 14
- 230000037230 mobility Effects 0.000 description 12
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 6
- 239000000969 carrier Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000006011 modification reaction Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004988 Nematic liquid crystal Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000001808 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
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- 230000003252 repetitive Effects 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/125—Active-matrix OLED [AMOLED] displays including organic TFTs [OTFT]
Abstract
An improved transistor array for a display or sensor device is described. The display or sensor device includes a plurality of pixels. Each pixel includes a width and a length. Each pixel is addressed by a transistor. The transistor addressing each pixel has a channel with a channel width. Each channel width is greater than the width or length of the pixel being addressed. By fabricating transistors with extremely long channel widths, lower mobility semiconductor materials can easily be used to fabricate the display device.
Description
This is a divisional of U.S. application Ser. No. 10/734,429 filed Dec. 12, 2003 by the same inventors, and claims priority therefrom. The original U.S. patent application Ser. No. 10/734,429 is hereby incorporated by reference in its entirety. This divisional application is being filed in response to a Restriction Requirement in that prior application.
This invention was made with United States Government support under Cooperative Agreement No. 70NANBOH3033 awarded by the National Institute of Standards and Technology (NIST). The United States Government has certain rights in the invention.
Thin-film transistor array backplanes for applications such as flat-panel display systems and image sensors have become increasingly prevalent. However, the displays and image sensors using such backplanes remain quite complex and expensive. One of the reasons for the high expense is the use of conventional photolithographic and thin-film deposition processes are often used to fabricate the transistor array backplanes.
In order to lower the cost, alternative processes and materials have been explored. One area of research has been using organic and polymeric semiconductors to replace the traditional silicon-based transistors. However, carrier mobility in organic and polymeric semiconductors, especially solution processable semiconductors, is often lower than carrier mobility in amorphous and crystalline silicon structures. The lower carrier mobility results in slower switching speeds and lower drive currents compared to traditional silicon-based semiconductors. Thus the performance of organic and polymeric thin-film transistors are typically below that of thin-film transistors made from more traditional materials such as amorphous silicon.
Thus a structure or method of improving the performance of organic and polymeric semiconductor transistors is needed.
A thin-film transistor array for use as an addressable electronic backplane is described. The array is formed from a repetitive arrangement of unit cells or pixels that includes a thin-film transistor used to drive an overlying media. The pixel includes at least two dimensions, a width and a length. The thin film transistor is shaped such that a transistor channel width exceeds the shorter of either the width or length of the pixel.
An improved transistor array backplane is described. The transistor array backplane can be used to drive media for display applications or sensors for image sensing. FIG. 1 shows drive electronics coupled to a typical display device 104. In the illustrated embodiment, drive electronics include a video driver card 108 in a computer 112. Display device 104 receives signals from video driver card 108 and renders images on a screen for a viewer. Although a video driver card is shown, any circuit used to control a display may be used, including but not limited to a television, DVD player or other display controlling device.
A thin film transistor heterostructure layer 212 is formed over substrate layer 208. The thin film transistor hetrostructure layer (hereinafter TFT layer) includes several transistor components including a semiconductor layer, a dielectric layer, and a second and a third electrode. In one embodiment, the second and third electrodes may be source and drain electrodes. A channel region is disposed between the second and third electrodes. The channel may be of arbitrary shape, but is typically formed to overlap the position of the first electrode in substrate layer 208.
An electric potential on the first electrode controls transistor switching. When an electric potential is applied to the first electrode, the electric field in the first electrode causes a change in transconductance of the semiconductor layer, forming a conductive channel, adjacent to the dielectric layer and first electrode. The conductive channel allows current to flow from the second electrode to the third electrode. When the electric potential is removed from first electrode, the channel is no longer conductive and the transistor is in an “off” state. In another embodiment, the channel layer does not extend the entire length between the second and third electrode. This embodiment is typical for high voltage thin-film transistors.
In the illustrated embodiment, buslines in a data line layer 216 are deposited over the TFT layer. Data lines carry an electrical signal from drive electronics to the transistor source electrodes in TFT layer 212. An encapsulation layer is formed over the data line layer to isolate the TFT layer. A media layer 220 is deposited over the encapsulation layer. In one embodiment, patterned vias etched into the encapsulation layer connect the TFT layer with the media layer. The pixels switched by transistors in TFT layer 208 are defined by the boundaries of the buslines. The media may be made from liquid crystals, electrophorectic inks, amorphous Si, particle dispersed liquid crystals, light-emitting semiconductors, or other materials known in the art. In an array backplane for a display, a voltage output from a transistor determines the state of a pixel causing the pixel to convert to a state that either generates or improves the transmission or reflection of light. In an image sensing array, the transistor switches to determine the voltage input from the sensing media.
As used herein, the pixel is the smallest addressable unit in an array of elements. The shape and dimensions of a pixel may vary, however, in many arrays the spacing of the buslines, e.g. gate lines and the data lines, determines the pixel dimensions. Often, adjacently spaced gate lines and adjacently spaced data lines form the approximate borders of a pixel. However, it is not required that the data line and gate lines bound the pixel; pixel structures that overlap gate and data lines are available.
A detailed description of forming transistor and transistor arrays and using the arrays as addressable backplanes may be found in Technology and Applications of Amorphous Silicon (Editor: R. A. Street, Springer-Verlag, 1999), which is hereby incorporated by reference in its entirety. Although an example display has been described, it should be recognized that other methods and arrangements for forming thin film transistors to drive a display are available. For example, the gate lines may be formed over the TFT layer and the data lines under the TFT layers. The same techniques may also be used to form equivalent structures such as sensors where the pixels detect the incidence of photons rather than reflect or alter the transmission of light. Thus the invention should not be limited to the specific structure previously described.
In transistor 304, current flows from electrode 320 through channel 316 to electrode 324. A voltage applied to electrode 328 controls the current flow. The operation of such transistors is described in Technology and Applications of Amorphous Silicon (Editor: R. A. Street, Springer-Verlag, 1999), which is hereby incorporated by reference.
In a display system, each transistor usually addresses a pixel. Pixel state depends on a voltage applied to the pixel. The media in the pixel, in a first state, either generates, transmits or reflects light. In a second state, the same media in pixel blocks or absorbs light.
In color systems, pixels often include a plurality of sub-pixels. For example, in order to generate color, a pixel may be divided into three sub-pixels. Each sub-pixel may correspond to a basic or primary color and may be individually addressed by a corresponding transistor. When a square pixel is desired each sub-pixel may be rectangular in shape with a three to one aspect ratio such that together, three sub-pixels form a square pixel. Monochromatic systems often do not utilize sub-pixels, instead using a single square pixel in which a width equals a length.
Although square pixels are more common, other sizes and shapes may be used. The actual dimensions and shape of a pixel may vary widely according to the size and resolution of the display, but as previously described, usually the dimensions of each pixel in a display is bounded or confined to the area between adjacent gate lines and adjacent data lines.
As previously described, transistors formed from low mobility semiconductors suffer from slower response times and higher voltages for switching. Increasing the width to length ratio of the channel partially compensates for the lower mobility. In one embodiment, transistors made from organic or polymeric semiconductor having electron mobilities below 0.5 cm2/Volt-second have low switching speeds and low drive current. The drive current of the device is improved by increasing the channel width to length ratios. FIGS. 4-8 show various geometry TFT channel structures that increase the ratio of width to length in a pixel by forming at least one bend or curve in the channel.
Each transistor such as transistor 404 includes a channel 452 separating electrode 450 and electrode 451. In the illustrated embodiment, channel 452 is a closed structure that completely encircles electrode 451. Closed structures that isolate the drain help minimize leakage currents. Channel 452 has a length 460 which is parallel to the direction of current flow and usually the shortest distance from the electrode 450 to the electrode 451. Channel 452 also has a width 456, a dimension perpendicular to the direction of current flow and illustrated by a line 453 running along the center of channel 452 and bisecting length 560. As shown the width substantially exceeds the length. Bends, such as channel bend 464, also help to enable the channel width to exceed linear dimensions (either pixel length or pixel width) of pixel 420. Transistor 404 addresses pixel 420.
Additional increases in the width to length ratio may be achieved by adding bends or curve in the channel structure. Adding multiple bends enables channel width to length ratios in excess of 100. FIG. 6 shows a top view of a geometry having interdigitated electrode-channel-electrode layout that offers higher width to length ratios. As used herein, interdigitated means that channel 604 includes at least two significant bends, such as bends 605, 606 such that channel 604 surrounds on three sides a section 607 of electrode 624 or electrode 628. Region 607 which is surrounded on three sides is referred to as the “digit”.
In FIG. 6 , each transistor such as transistor 600 switches a corresponding pixel 608. In one embodiment, pixel 608 has dimensions of approximately 17×17 unit cells. The width of a channel 620 is typically between 100 and 1000 microns. In the embodiment shown, the approximate width to length may exceed 100, and is often around 120.
Larger area transistors may interfere with the pixel output, particularly in backlit displays, such as conventional twisted nematic liquid crystal displays. In such display designs, image quality can sometimes be improved by increasing the aperture size of the pixel. One way to increase aperture size is to use transparent conductor pixel pads that allow light to pass through parts of the transistor and the pixel pads. When opaque gate lines are used, minimizing gate line and source/drain overlap can also help to maximize light transmission through the transistor. Such transparent transistor structures are described in “Optimization of External Coupling and Light Emission in Organic Light-Emitting Devices: Modeling and Experiment”, J. Appl. Phys. Vol. 91, No. 2 pp. 595-604 by Lu and Sturm (2002) which is hereby incorporated by reference.
Many variations are possible on the spiral pattern. For example, FIG. 8 shows an open geometry in which electrode 804 is not completely surrounded by a channel 808.
Although a number of details have been provided in the specification, such details are provided as examples and to facilitate an understanding of the invention and should not be interpreted to limit the invention. Indeed, the details of the invention may be amended to encompass variations, alternatives, modifications, improvements, equivalents, and substantial equivalents of the embodiments and teachings disclosed herein. Thus the scope of the invention should only be limited by the scope of the claims which follow and their equivalents.
The claims, as originally presented and as they may be amended, encompass variations, alternatives, modifications, improvements, equivalents, and substantial equivalents of the embodiments and teachings disclosed herein, including those that are presently unforeseen or unappreciated, and that, for example, may arise from applicants/patentees and others.
Claims (5)
1. A display device comprising:
a plurality of gate lines;
a plurality of data lines;
a plurality of pixels, each pixel having a two dimensions including a corresponding pixel width and a corresponding pixel length; and,
a plurality of thin film transistors, each thin film transistor to address a corresponding pixel, each thin film transistor in the plurality of thin film transistors including a semiconductor in an active region, the semiconductor forming the active region of each thin film transistor having a mobility less than 0.5 cm2/Volt-second, each thin film transistor in the plurality of thin film transistors including a channel with a channel width, each channel width larger than the smallest dimension of the corresponding pixel addressed.
2. The display device of claim 1 wherein the semiconductor is polymeric semiconductor.
3. The display device of claim 1 wherein the semiconductor is an organic semiconductor.
4. The display device of claim 1 further comprising:
an electronic circuit coupled to the plurality of gate lines and the plurality of drain lines, the electronic circuit to individually address each thin film transistor in the plurality of thin film transistors and to individually switch each transistor in the plurality of transistors to display an image.
5. The display device of claim 1 wherein the pixel pad is made from a transparent material to increase the aperture of the pixel.
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US11/190,178 US7425734B2 (en) | 2003-12-12 | 2005-07-25 | Thin-film transistor array with ring geometry |
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US10/734,429 US7358530B2 (en) | 2003-12-12 | 2003-12-12 | Thin-film transistor array with ring geometry |
US11/190,178 US7425734B2 (en) | 2003-12-12 | 2005-07-25 | Thin-film transistor array with ring geometry |
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US7566899B2 (en) * | 2005-12-21 | 2009-07-28 | Palo Alto Research Center Incorporated | Organic thin-film transistor backplane with multi-layer contact structures and data lines |
DE102006047388A1 (en) * | 2006-10-06 | 2008-04-17 | Polyic Gmbh & Co. Kg | Field effect transistor and electrical circuit |
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DE102011085114B4 (en) * | 2011-10-24 | 2016-02-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Thin film transistor |
KR102072803B1 (en) * | 2013-04-12 | 2020-02-04 | 삼성디스플레이 주식회사 | Thin film semiconductor device and organic light emitting display |
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CN104600124A (en) * | 2015-01-21 | 2015-05-06 | 重庆京东方光电科技有限公司 | Thin film transistor structure, manufacturing method thereof, array substrate and mask plate |
EP3070741B1 (en) * | 2015-03-18 | 2020-07-29 | Emberion Oy | An apparatus comprising a sensor arrangemenet and associated fabrication method |
KR20180023155A (en) * | 2016-08-24 | 2018-03-07 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus |
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US20050258428A1 (en) | 2005-11-24 |
US7358530B2 (en) | 2008-04-15 |
US20050127357A1 (en) | 2005-06-16 |
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