US7342085B2 - Synthesis of oligomeric cyanate esters - Google Patents
Synthesis of oligomeric cyanate esters Download PDFInfo
- Publication number
- US7342085B2 US7342085B2 US11/425,836 US42583606A US7342085B2 US 7342085 B2 US7342085 B2 US 7342085B2 US 42583606 A US42583606 A US 42583606A US 7342085 B2 US7342085 B2 US 7342085B2
- Authority
- US
- United States
- Prior art keywords
- substituted
- unsubstituted
- phenyl
- mixture
- mmol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 239000004643 cyanate ester Substances 0.000 title claims abstract description 104
- 230000015572 biosynthetic process Effects 0.000 title description 25
- 238000003786 synthesis reaction Methods 0.000 title description 23
- 150000001913 cyanates Chemical class 0.000 title description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 39
- -1 cyanide compound Chemical class 0.000 claims abstract description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 58
- 125000003118 aryl group Chemical group 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 26
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- ATDGTVJJHBUTRL-UHFFFAOYSA-N cyanogen bromide Chemical compound BrC#N ATDGTVJJHBUTRL-UHFFFAOYSA-N 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- ZKXWKVVCCTZOLD-FDGPNNRMSA-N copper;(z)-4-hydroxypent-3-en-2-one Chemical compound [Cu].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O ZKXWKVVCCTZOLD-FDGPNNRMSA-N 0.000 claims description 4
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- RDMHXWZYVFGYSF-LNTINUHCSA-N (z)-4-hydroxypent-3-en-2-one;manganese Chemical compound [Mn].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RDMHXWZYVFGYSF-LNTINUHCSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- MJSNUBOCVAKFIJ-LNTINUHCSA-N chromium;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Cr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O MJSNUBOCVAKFIJ-LNTINUHCSA-N 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 abstract description 26
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 abstract description 6
- 150000008378 aryl ethers Chemical class 0.000 abstract description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 132
- 239000000203 mixture Substances 0.000 description 110
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 90
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 76
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 48
- 229920005989 resin Polymers 0.000 description 43
- 239000011347 resin Substances 0.000 description 43
- 229910052757 nitrogen Inorganic materials 0.000 description 42
- 238000006243 chemical reaction Methods 0.000 description 39
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 39
- 239000011541 reaction mixture Substances 0.000 description 37
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 36
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 34
- 239000007787 solid Substances 0.000 description 30
- JBAKCAZIROEXGK-LNKPDPKZSA-N copper;(z)-4-hydroxypent-3-en-2-one Chemical compound [Cu].C\C(O)=C\C(C)=O JBAKCAZIROEXGK-LNKPDPKZSA-N 0.000 description 28
- 238000002411 thermogravimetry Methods 0.000 description 27
- 239000002904 solvent Substances 0.000 description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 25
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 25
- 229910000027 potassium carbonate Inorganic materials 0.000 description 24
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 22
- JSRLURSZEMLAFO-UHFFFAOYSA-N 1,3-dibromobenzene Chemical compound BrC1=CC=CC(Br)=C1 JSRLURSZEMLAFO-UHFFFAOYSA-N 0.000 description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 238000010992 reflux Methods 0.000 description 18
- 230000009477 glass transition Effects 0.000 description 16
- 229930185605 Bisphenol Natural products 0.000 description 15
- 239000000741 silica gel Substances 0.000 description 15
- 229910002027 silica gel Inorganic materials 0.000 description 15
- 230000003197 catalytic effect Effects 0.000 description 14
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 14
- 239000000178 monomer Substances 0.000 description 14
- 238000010533 azeotropic distillation Methods 0.000 description 12
- 239000006229 carbon black Substances 0.000 description 12
- 238000004821 distillation Methods 0.000 description 12
- 238000011049 filling Methods 0.000 description 12
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 9
- 239000011651 chromium Substances 0.000 description 9
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- 238000000113 differential scanning calorimetry Methods 0.000 description 7
- 239000007858 starting material Substances 0.000 description 7
- LSQARZALBDFYQZ-UHFFFAOYSA-N 4,4'-difluorobenzophenone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 LSQARZALBDFYQZ-UHFFFAOYSA-N 0.000 description 6
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000005749 Copper compound Substances 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 150000001880 copper compounds Chemical class 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000011780 sodium chloride Substances 0.000 description 4
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 3
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 3
- 229910000024 caesium carbonate Inorganic materials 0.000 description 3
- BFGKITSFLPAWGI-UHFFFAOYSA-N chromium(3+) Chemical compound [Cr+3] BFGKITSFLPAWGI-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 125000004185 ester group Chemical group 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical group C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- BVPXRDIYXRSOCR-UHFFFAOYSA-N C.C.COCOCOCOC1=NC(C)=NC(C)=N1 Chemical compound C.C.COCOCOCOC1=NC(C)=NC(C)=N1 BVPXRDIYXRSOCR-UHFFFAOYSA-N 0.000 description 2
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical group C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 125000006575 electron-withdrawing group Chemical group 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000001757 thermogravimetry curve Methods 0.000 description 2
- GPAPPPVRLPGFEQ-UHFFFAOYSA-N 4,4'-dichlorodiphenyl sulfone Chemical compound C1=CC(Cl)=CC=C1S(=O)(=O)C1=CC=C(Cl)C=C1 GPAPPPVRLPGFEQ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- NSWMMLPGFPQJJK-UHFFFAOYSA-M C.C.C#N.C#N.COC1=NC(OC)=NC(OC)=N1.COCOCOCOC1=NC(C)=NC(C)=N1.N#C[O-].[O-][O-] Chemical compound C.C.C#N.C#N.COC1=NC(OC)=NC(OC)=N1.COCOCOCOC1=NC(C)=NC(C)=N1.N#C[O-].[O-][O-] NSWMMLPGFPQJJK-UHFFFAOYSA-M 0.000 description 1
- RVTXDWLAFRKCKJ-UHFFFAOYSA-N C.C.C.C.CBr=N.N#CBr.N#COCOCOCN=C=O.OCOCOCO Chemical compound C.C.C.C.CBr=N.N#CBr.N#COCOCOCN=C=O.OCOCOCO RVTXDWLAFRKCKJ-UHFFFAOYSA-N 0.000 description 1
- 0 C.C.CC(C)(C1=CC=C(O)C=C1)C1=CC=C(OC2=CC=CC(OC3=CC=C(C(C)(C)C4=CC=C(O)C=C4)C=C3)=C2)C=C1.OC*COCOC*CO Chemical compound C.C.CC(C)(C1=CC=C(O)C=C1)C1=CC=C(OC2=CC=CC(OC3=CC=C(C(C)(C)C4=CC=C(O)C=C4)C=C3)=C2)C=C1.OC*COCOC*CO 0.000 description 1
- BKPBHKMZFWBDMI-UHFFFAOYSA-N COC1=CC(OC2=CC(OC3=CC(OC4=NC(C)=NC(C)=N4)=CC=C3)=CC=C2)=CC=C1.COC1=CC=C(C(C)(C)C2=CC=C(OC3=CC(OC4=CC=C(C(C)(C)C5=CC=C(OC6=NC(C)=NC(C)=N6)C=C5)C=C4)=CC=C3)C=C2)C=C1.COC1=CC=C(C2=CC=C(OC3=CC(OC4=CC=C(C5=CC=C(OC6=NC(C)=NC(C)=N6)C=C5)C=C4)=CC=C3)C=C2)C=C1 Chemical compound COC1=CC(OC2=CC(OC3=CC(OC4=NC(C)=NC(C)=N4)=CC=C3)=CC=C2)=CC=C1.COC1=CC=C(C(C)(C)C2=CC=C(OC3=CC(OC4=CC=C(C(C)(C)C5=CC=C(OC6=NC(C)=NC(C)=N6)C=C5)C=C4)=CC=C3)C=C2)C=C1.COC1=CC=C(C2=CC=C(OC3=CC(OC4=CC=C(C5=CC=C(OC6=NC(C)=NC(C)=N6)C=C5)C=C4)=CC=C3)C=C2)C=C1 BKPBHKMZFWBDMI-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000009734 composite fabrication Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000006006 cyclotrimerization reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- MMIPFLVOWGHZQD-UHFFFAOYSA-N manganese(3+) Chemical compound [Mn+3] MMIPFLVOWGHZQD-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005597 polymer membrane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
Definitions
- the invention relates generally to cyanate esters and thermosets made therefrom.
- Cyanate ester (CE) resins have received considerable attention due to their importance as a thermosetting resin for use in the electronics, aerospace, and adhesive industries. Cyanate ester resins have found extensive use in applications where low-dielectric and high thermal stability materials are needed. Such applications include printed circuit boards and radomes. More recently, CE resins have been proposed for use as the matrix in structural composites for aircrafts. In aerospace applications, it may be desirable for the matrix material to show high temperature stability, low flammability, high strength, and toughness.
- CEs can have the processability of epoxies with the heat and fire resistance of phenolic resins. They can have their own unique properties such as good strength, low dielectric constants, radar transparency, low water absorption, and superior metal adhesion. These properties can make them useful for high performance applications.
- Current CE resins have the required flammability but are too brittle for use alone as matrix materials for structural applications.
- modifiers such as thermoplastics and elastomers have been blended with the CE resins, which have had a negative impact on the flammability.
- a variety of CE monomers have been synthesized containing polystyrene, substituted phenols and allyl-functionalized moieties. These CE monomers cure alone or by the aid of a catalytic amount of a metal salt into a triazine network.
- the invention comprises an oligomer comprising the formula: HO—Ar 3 —R—Ar 2 O—Ar 1 —O—Ar 3 —R—Ar 2 n OH.
- Ar 1 , Ar 2 , and Ar 3 are independently selected divalent aromatic radicals selected from the group consisting of a substituted or unsubstituted aromatic ring, substituted or unsubstituted fused aromatic rings, and a substituted or unsubstituted aromatic ring assembly without intervening groups.
- R is a substituted or unsubstituted divalent organic or sulfone group.
- the variable n is a positive integer.
- the invention further comprises a process comprising the steps of: providing a dihydroxyaromatic, providing a dihaloaromatic, and reacting the dihydroxyaromatic compound with the dihaloaromatic compound in the presence of a copper compound and a base other than cesium carbonate.
- the invention further comprises a cyanate ester comprising the formula: NCO—Ar 2 O—Ar 1 —O—Ar 2 n OCN
- Ar 1 and Ar 2 are independently selected divalent aromatic radicals selected from the group consisting of a substituted or unsubstituted aromatic ring, substituted or unsubstituted fused aromatic rings, a substituted or unsubstituted aromatic ring assembly with or without intervening groups, and combinations thereof.
- the variable n is a positive integer.
- the invention further comprises a process comprising the steps of: providing an oligomer comprising the formula: HO—Ar 2 O—Ar 1 —O—Ar 2 n OH, and reacting the oligomer with cyanide compound in the presence of a base to form —OCN end groups on the oligomer.
- Ar 1 , Ar 2 , and n are as defined in the previous paragraph.
- thermoset comprising the formula:
- Ar 1 , Ar 2 , and n are as defined above.
- the invention further comprises a process comprising the steps of: providing the above cyanate ester and curing the cyanate ester to a thermoset.
- FIG. 1 shows a thermogram of the curing of bisphenol A based CE both neat and with 2% Cu (II) compound.
- FIG. 2 shows a thermogram of the curing of resorcinol based CE both neat and with 2% Cu (II) compound.
- This invention is related to the synthesis and polymerization of liquid or low melting oligomeric cyanate ester monomers containing multiple aromatic ether spacers between the reactive ester groups.
- oligomeric aromatic ether containing units with varying spacer length, the rigidity, cross-linking density, glass transition temperature, and mechanical properties of the resulting thermoset may be controlled.
- the CE-based thermosets can show good thermal stability as well as variable glass transition temperatures.
- a synthetic method has been developed that affords CE-based thermosets that can be more flexible and can have enhanced toughness relative to previously developed resins in the field where flexibility has been difficult to achieve in highly aromatic systems.
- liquid monomers of this invention that are curable at temperatures of 50-125° C. can be advantageous from a processing standpoint.
- the liquid precursor resins may be useful in composite fabrication by the various techniques typically used such as infusion molding, prepreg consolidation, and resin transfer molding.
- the CE resins which may be liquid at ambient temperature and have low culling temperatures, may allow for excellent processability into shaped components.
- the CE resins may be polymerized into a thermosetting polymeric matrix with variable glass transition temperatures.
- the cyanate ester monomer which displays superb processability, may be readily polymerized neat or by the aid of a metal catalyst. By changing the initial reactants, thermosets possessing unique glass transition temperatures and physical and mechanical properties can be realized by the proper selection of reagents in the hydroxy terminated oligomer formation reaction.
- thermosets for polymer membranes in fuel cells.
- the resulting polymers have potential for a variety of applications in the aerospace, adhesive, and electronic industries. These materials may address the toughness or brittleness issue associated with current commercially available CE resins.
- the thermosets exhibit similar or enhanced thermal properties and improved processability relative to current systems.
- thermoset The synthesis of the thermoset is performed in three steps. First, an excess of dihydroxyaromatic compound is reacted with a dihaloaromatic compound to form a dihydroxy-terminated aromatic ether oligomer. Second, the aromatic ether oligomer is reacted with a base, followed by reaction with a cyanide compound to make a cyanate ester. Third, the cyanate ester is cured to make a thermoset.
- the dihydroxyaromatic compound is reacted with the dihaloaromatic compound to form the oligomer as shown in formula (1).
- Ar 1 and Ar 2 are independently selected divalent aromatic radicals selected from the group consisting of a substituted or unsubstituted aromatic ring, substituted or unsubstituted fused aromatic rings, a substituted or unsubstituted aromatic ring assembly with or without intervening groups, and combinations thereof.
- Y is a halogen, such as bromine or iodine. The two Ys may be different.
- n is determined by the molar ratio of dihydroxyaromatic compound to dihaloaromatic. For example when the ratio is 2:1, n is 1. When the ratio is 3:2, n is 2. A suitable range for n is 1 to 10, including 2, 3, 4, 5, 6, 7, 8, and 9, however, there is no upper limit to the value of n, even if the oligomer nay be considered a polymer.
- Suitable Ar 1 groups include, but are not limited to, a phenyl, an m-phenyl, a benzophenone residue, a 4,4′-benzophenone residue, and a diphenyl sulfone residue.
- Suitable Ar 2 groups include, but are not limited to, phenyl, an m-phenyl, p-phenyl, o-phenyl, a biphenyl, a 4,4′-biphenyl, a bisphenol residue, a bisphenol A residue, a bisphenol S residue, and a bisphenol A6F residue.
- a residue refers to the divalent radical formed when the hydroxyl hydrogens are removed from the dihydroxyaromatic compound or the halo groups are removed from the dihaloaromatic compound.
- a plurality of dihydroxyaromatics and/or dihaloaromatics may be used to form the oligomer, such that there are more than one embodiment of Ar 1 and/or Ar 2 within an oligomer molecule. Further, when Ar 1 and/or Ar 2 are asymmetrical, they may be found oriented in both directions within one oligomer.
- the oligomer is as shown in formulas (2) or (3).
- Ar 3 is defined the same as Ar 1 and Ar 2 .
- Each X is either H or F.
- none of the Ar groups are aromatic ring assemblies with intervening functional groups.
- An example of a dihydroxyaromatic compound that may be used to make this oligomer is a bisphenol.
- Suitable R groups include, but are not limited to, 2,2-isopropylidene and hexafluoro-2,2-isopropylidene.
- the reaction may be performed according to methods disclosed in Keller et al., U.S. patent application Ser. No. 10/135,012, filed on Apr. 26, 2002 using a copper compound and cesium carbonate. (All referenced patents and publications are incorporated herein by reference.)
- the reaction may be performed in the presence of a copper compound and a base.
- Suitable bases include, but are not limited to, a carbonate, potassium carbonate, sodium bicarbonate, sodium carbonate, a strong base, potassium hydroxide, sodium hydroxide, and lithium hydroxide.
- the substitution of cesium carbonate by potassium carbonate in the hydroxy terminated oligomer formation reaction may be used due to the limited solubility of the cesium versus the potassium-terminated salt of the oligomer in polar aprotic solvents. Homogeneity throughout the reaction can allow for efficient formation of the hydroxy terminated oligomer from the dihydroxyaromatic and dihaloaromatic compound.
- the halo groups of the dihaloaromatic compound need not be activated by an electron-withdrawing group. Electron-withdrawing groups can include, but are not limited to, carbonyl and sulfone.
- Suitable dihydroxyaromatics include, but are not limited to, a phenyl, resorcinol, a bisphenol, bisphenol A, bisphenol S, bisphenol A6F, a dihydroxybenzene, and a dihydroxybiphenyl.
- Suitable copper compounds include, but are not limited to, CuI, CuBr, and CuCl.
- the reaction may also be catalyzed with a chelating agent such as an amine or 1,10-phenanthroline to make the reaction occur faster by solubilizing the copper salt. This catalyst can help to solubilize the copper.
- formula (1) shows an excess of dihydroxyaromatic
- any ratio of reactants may be used. However formula (1) would be followed to produce an oligomer that may be used to make a cyanate ester.
- a halo-terminated oligomer may be made by using an excess of dihaloaromatic compound.
- An aryl-terminated oligomer may also be made by using a combined excess of dihydroxyaromatic and hydroxyaromatic with dihaloaromatic or by using a combined excess of dihaloaromatic and haloaromatic with dihydroxyaromatic.
- a high molecular weight polymer may be made by using a 1:1 ratio of dihydroxyaromatic compound and dihaloaromatic compound.
- the oligomer of formula (1) is reacted with a cyanide compound, such as cyanogen bromide to form a cyanate ester, as shown in formula (4).
- the Ar 1 and Ar 2 groups can be any divalent aromatic groups such as an aromatic ring, fused aromatic rings, an aromatic ring assembly with or without intervening groups, and combinations thereof, with the proviso that when Ar 2 is a bisphenol A residue and when Ar 1 is either a benzophenone residue or a diphenyl sulfone residue then n is from 1 to 5.
- the oligomer may be made by the above process or by any other process, including the use of activating groups on an aromatic group, such that the reaction may proceed without a copper compound.
- the monomer can be synthesized in one reaction pot from the reaction of a metal terminated salt of the oligomer, formed originally in the initial reaction of dihydroxyaromatic compound and dihaloaromatic compound, with BrCN.
- the metal terminated salt of the oligomer may be formed by reaction of the oligomer with a base.
- the reaction can be monitored by infrared spectroscopy, observing the disappearance of the hydroxy stretch at about 3400 cm ⁇ 1 and the appearance of the cyanate ester (—OCN) functionality located at about 2276 and/or 2244 cm ⁇ 1 .
- the cyanate ester having any Ar 1 and Ar 2 groups disclosed above may be cured to a thermoset. This can occur by cross-linking at the cyanate ester groups by cyclotrimerization as shown in formula (5).
- a structure of the thermoset is shown in formula (6). It is to be understood that in formula (6), the repeat unit is always oriented in the same way, that is, the O on the left is always bonded to a triazine ring and not another O. The triazine ring is always bonded to an O and not another triazine ring. It is also to be understood that, while the formula shows complete cross-linking, some cyanate ester groups may remain uncross-linked while still being a thermoset within the scope of the invention.
- thermoset As the value of n increases, the cross-linking density of the resulting thermoset is decreased, the glass transition temperature may be lowered, and the thermoset may be much less brittle than the commercially available materials currently used in circuit board manufacturing.
- the curing may be performed simply by heating the cyanate ester to an appropriate temperature. Curing may occur at a lower temperature when a curing additive, such as a metal acetylacetonate, a transition metal salt, copper (II) acetylacetonate, chromium (III) acetylacetonate, manganese (III) acetylacetonate, 1,3-bis(3-aminophenoxy)benzene, an alcohol, a phenol, or an amine is added to the cyanate ester.
- the curing additive can catalyze the formation of the triazine ring and lower the temperature needed for curing.
- the cyanate ester may also be cured with additional hydroxy terminated oligomer.
- the curing temperature may be reduced by an average of 40-200° C. and the total curing time may be subsequently reduced indicated by a sharpening of the cure peak through DSC analysis.
- the resulting mixture may stay non-viscous until the appropriate curing temperature is reached. Since CEs exhibit little to no out-gassing during the curing process, void-free polymers or composites can be achieved with little effort.
- the high aromatic content of the resulting thermoset may afford a reasonable char yield (40-70%) when pyrolyzed to 1000° C. under inert conditions.
- the rigidity and cross-linking density of the thermoset can be controlled.
- the T g and other physical properties can be directly affected.
- the cyanate ester can be a low melting solid and have a reduced curing temperature in the presence of a curing additive. By the addition of a smaller amount of catalyst, the cross-linking may be slowed in order to provide a longer processing window.
- the incorporation of —CF 3 moieties into the thermoset combined with the already low dielectric material properties for cyanate ester based thermosets should provided a system with a low dielectric constant, potentially useful for radome and electronics applications.
- thermoset exhibited a glass transition temperature at around 94° C. TGA analysis revealed that when heated under nitrogen to 1000° C. the system began to lose weight at around 300° C. with an overall char yield of around 40%.
- the resulting mixture was degassed with nitrogen for 10 mini followed by the addition of copper (I) bromide (540 mg, 3.76 mmol) and CsCO 3 (31.0 g, 95.0 mmol).
- copper (I) bromide 540 mg, 3.76 mmol
- CsCO 3 31.0 g, 95.0 mmol
- the reaction mixture was heated to reflux at 145° C. for 1 hr.
- the water formed in the reaction was removed by azeotropic distillation.
- an additional portion of CsCO 3 (31.0 g, 95.0 mmol) was added.
- the mixture was refluxed for 9-12 hr until no more water was observed being collected in the Dean-Stark trap.
- the remaining toluene was then removed by distillation and the reaction mixture cooled to ambient temperature.
- thermoset exhibited a glass transition temperature at around 83° C. TGA analysis revealed that when heated under nitrogen to 1000° C. the system began to lose weight at around 320° C. with an overall char yield of around 40%.
- thermoset once fully cured, exhibited a glass transition temperature at around 67° C.
- TGA analysis revealed that when heated under nitrogen to 1000° C., the system began to lose weight at around 300° C. with an overall char yield of around 40%.
- Example 7 To the CE oil synthesized in Example 7 was added 2 weight % of m-APB with stirring at 110° C. Once the APB was melted into the sample, it was cooled and used in the DSC and TGA studies. The mixture was cured by heating at 100° C. for 1 hr, 150° C. for 1 hr, 250° C. for 2 hr and 300° C. for 1 hr resulting in a solid film. The DSC thermogram exhibited two exotherms beginning at 60° C. and ending at around 300° C. TGA analysis reveals that when heated under nitrogen to 1000° C., the system began to lose weight at around 300° C. with an overall char yield of around 40%.
- the resulting mixture was degassed with nitrogen for 10 min followed by the addition of copper (I) (420 mg, 2.94 mmol) and CsCO 3 (7.80 g, 23.9 mmol).
- copper (I) 420 mg, 2.94 mmol
- CsCO 3 7.80 g, 23.9 mmol
- the mixture was heated to reflux at 145° C. for 1 hr.
- the water formed in the reaction was removed by azeotropic distillation and at this time an additional portion of CsCO 3 (7.80 g, 23.9 mmol) was added.
- the mixture was refluxed for 9-12 hr until no more water was observed being collected in the Dean-Stark trap.
- the remaining toluene was then removed by distillation and the reaction mixture cooled to ambient temperature.
- Example 15 Self-curing of 2:1 CE resin based on bisphenol A and 1,3-dibromobenzene—The liquid CE monomer formed in Example 15 was placed directly into the DSC pan and cured under nitrogen at the following temperature and time: 275° C. for 2 hr, 300° C. for 4 hr, 325° C. for 4 hr, 350° C. for 2 hr, and 375° C. for 2 hr. In a separate experiment, the system exhibited a curing exotherm as observed from DSC analysis commencing at around 260° C. and ending at around 370° C. (see FIG. 1 ).
- the DSC thermogram of the mixture exhibited an exotherm beginning at 60° C. and ending at around 140° C., showing that the addition of a catalytic amount of Cu (II) acetylacetonate reduced the initial curing temperature by approximately 200° C.
- the thermoset exhibited a glass transition temperature at around 210° C. TGA analysis revealed that when heating under nitrogen to 1000° C. the system began to lose weight at around 400° C. with an overall char yield of around 38%.
- the water formed in the reaction was removed by azeotropic distillation.
- the mixture was refluxed for 9-12 hr until no more water was observed being collected in the Dean-Stark trap.
- the remaining toluene was then removed by distillation and the reaction mixture cooled to ambient temperature.
- Water was added (300 mL) to the reaction mixture. At this point, the mixture was slightly basic and 2 M HCl (200 mL) was added.
- the mixture was then extracted with ether (2 ⁇ 50 mL) and the combined ether layers washed with 2 M HCl (1 ⁇ 100 mL) and water (1 ⁇ 100 mL).
- the hydroxy terminated oligomeric intermediate was extracted into the water layer by addition of 200 mL of 10% NaOH solution.
- the aqueous solution was extracted with ether (2 ⁇ 100 mL) to remove impurities and the water layer made acidic by the addition of 100 mL of 2 M HCl solution.
- the resulting mixture was extracted again with ether (2 ⁇ 100 mL) and the ether layers combined.
- Carbon black (2 g) was added and the ether filtered through a short plug of silica gel to remove any insoluble components.
- the solvent was removed and the oil vacuum dried to yield the analytically pure 2:1 hydroxy terminated oligomer (12.2 g, 96%) as a white solid.
- thermoset exhibited a glass transition temperature at around 190° C. TGA analysis revealed that when heated under nitrogen to 1000° C. the system began to lose weight at around 400° C. with an overall char yield of around 50%.
- thermoset once fully cured, exhibited a glass transition temperature at around 190° C. TGA analysis revealed that when heated under nitrogen to 1000° C. the system began to lose weight at around 400° C. with an overall char yield of around 50%.
- the water formed in the reaction was removed by azeotropic distillation. The mixture was refluxed for 9-12 hr until no more water was observed being collected in the Dean-Stark trap. The remaining toluene was then removed by distillation and the reaction mixture cooled to ambient temperature. The reaction mixture was poured into 300 mL of a 10% NaOH solution. The aqueous solution was extracted with ether (2 ⁇ 100 mL) to remove impurities and the water layer made acidic by the addition of 100 mL of 2 M HCl solution. The resulting mixture was extracted again with ether (2 ⁇ 100 mL) and the ether layers combined. Carbon black (2 g) was added and the ether filtered through a short plug of silica gel to remove any insoluble components. The solvent was removed and the oil vacuum dried to yield the analytically pure 2:1 hydroxy terminated oligomer (23.9 g, 86%) as a yellow crystalline solid.
- thermoset once fully cured, exhibited a glass transition temperature at around 200° C. TGA analysis revealed that when heating under nitrogen to 1000° C. the system began to lose weight at around 400° C. with an overall char yield of around 55%.
- thermoset once fully cured, exhibited a glass transition temperature at around 200° C. TGA analysis revealed that when heated under nitrogen to 1000° C. the system began to lose weight at around 400° C. with an overall char yield of around 55%.
- the resulting mixture was degassed thoroughly with nitrogen for 10 min followed by the addition of copper (I) iodide (330 mg, 1.74 mmol). After filling the Dean-Stark trap with toluene the mixture was heated to reflux at 145° C. for 30 min to 1 hr in order to completely dissolve all the starting materials and remove any residual water contained in the solvent. At this time, the mixture was removed from the heat source. When the temperature reached below 120° C., K 2 CO 3 (4.5 g, 32.6 mmol) was added in one portion and the mixture brought to reflux at 145° C. for 2 to 4 hours. The water formed in the reaction was removed by azeotropic distillation.
- the resulting mixture was degassed thoroughly with nitrogen for 10 min followed by the addition of copper (I) iodide (350 mg, 1.84 mmol). After filling the Dean-Stark trap with toluene, the mixture was heated to reflux at 145° C. for 30 min to 1 hr in order to completely dissolve all the starting materials and remove any residual water contained in the solvent. At this time, the mixture was removed from the heat source. When the temperature reached below 120° C., K 2 CO 3 (4.6 g, 33.3 mmol) was added in one portion and the mixture brought to reflux at 145° C. for 2 to 4 hours. The water formed in the reaction was removed by azeotropic distillation.
- the resulting mixture was degassed thoroughly with nitrogen for 10 ml followed by the addition of copper (I) iodide (400 mg, 2.10 mmol). After filling the Dean-Stark trap with toluene, the mixture was heated to reflux at 145° C. for 30 min to 1 hr in order to completely dissolve all the starting materials and remove any residual water contained in the solvent. At this time, the mixture was removed from the heat source. When the temperature reached below 120° C., K 2 CO 3 (5.6 g, 40.6 mmol) was added in one portion and the mixture brought to reflux at 145° C. for 2 to 4 hours. The water formed in the reaction was removed by azeotropic distillation.
- the resulting mixture was degassed thoroughly with nitrogen for 10 min followed by the addition of copper (I) iodide (200 mg, 1.05 mmol). After filling the Dean-Stark trap with toluene, the mixture was heated to reflux at 145° C. for 30 min to 1 hr in order to completely dissolve all the starting materials and remove any residual water contained in the solvent. At this time, the mixture was removed from the heat source. When the temperature reached below 120° C., K 2 CO 3 (7.0 g, 50.7 mmol) was added in one portion and the mixture brought to reflux at 145° C. for 2 to 4 hours. The water formed in the reaction was removed by azeotropic distillation.
- the resulting mixture was degassed thoroughly with nitrogen for 10 min followed by the addition of copper (I) iodide (200 mg, 1.05 mmol). After filling the Dean-Stark trap with toluene the mixture was heated to reflux at 145° C. for 30 min to 1 hr in order to completely dissolve all the starting materials and remove any residual water contained in the solvent. At this time the mixture was removed from the heat. When the temperature reached below 120° C., K 2 CO 3 (6.60 g, 47.8 mmol) was added in one portion and the mixture brought to reflux at 145° C. for 2 to 4 hours.
- the resulting mixture was degassed thoroughly with nitrogen for 10 min followed by the addition of copper (I) iodide (200 mg, 1.05 mmol). After filling the Dean-Stark trap with toluene the mixture was heated to reflux at 145° C. for 30 ml to 1 hr in order to completely dissolve all the starting materials and remove any residual water contained in the solvent. At this time the mixture was removed from the heat and when the temperature reached below 120° C., K 2 CO 3 (6.60 g, 47.8 mmol) was added in one portion and the mixture brought to reflux at 145° C. for 2 to 4 hours.
- K 2 CO 3 (6.60 g, 47.8 mmol
- the DSC thermogram of the mixture exhibited an exotherm beginning at 75° C. and ending at around 200° C., showing that the addition of a catalytic amount of Cu (II) acetylacetonate reduced the initial curing temperature by approximately 200° C.
- the thermoset exhibited a glass transition temperature at around 185° C. TGA analysis revealed that when heating under nitrogen to 1000° C. the system began to lose weight at around 400° C. with an overall char yield of around 58%.
- the DSC thermogram of the mixture exhibited an exotherm beginning at 170° C. and ending at around 270° C., showing that the addition of a catalytic amount of Cr (III) acetylacetonate reduced the initial curing temperature by approximately 80° C.
- the DSC thermogram of the mixture exhibited an exotherm beginning at 95° C. and ending at around 240° C., showing that the addition of a catalytic amount of Mn (III) acetylacetonate reduced the initial curing temperature by approximately 155° C.
- the mixture was poured onto water (300 mL) and the water extracted with ether (2 ⁇ 200 mL). The solvent was removed in vacuo and the resulting residue mixed with 400 mL of a hexane/methylene chloride mixture (1:1). The mixture was then filtered through a short silica plug to remove the Et 3 N + Br ⁇ salt and the solvent removed in vacuo to yield the 2:1 bisphenol A based CE resin (52.1 g, 95%) as a yellow oil.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyethers (AREA)
Abstract
HO—Ar2 O—Ar1—O—Ar2 nOH.
Description
HO—Ar3—R—Ar2 O—Ar1—O—Ar3—R—Ar2 nOH.
Ar1, Ar2, and Ar3 are independently selected divalent aromatic radicals selected from the group consisting of a substituted or unsubstituted aromatic ring, substituted or unsubstituted fused aromatic rings, and a substituted or unsubstituted aromatic ring assembly without intervening groups. R is a substituted or unsubstituted divalent organic or sulfone group. The variable n is a positive integer.
NCO—Ar2 O—Ar1—O—Ar2 nOCN
Ar1 and Ar2 are independently selected divalent aromatic radicals selected from the group consisting of a substituted or unsubstituted aromatic ring, substituted or unsubstituted fused aromatic rings, a substituted or unsubstituted aromatic ring assembly with or without intervening groups, and combinations thereof. The variable n is a positive integer.
HO—Ar2 O—Ar1—O—Ar2 nOH,
and reacting the oligomer with cyanide compound in the presence of a base to form —OCN end groups on the oligomer. Ar1, Ar2, and n are as defined in the previous paragraph.
HO—Ar2—OH+Y—Ar1—Y→HO—Ar2 O—Ar1—O—Ar2 nOH (1)
This formula shows the result when an excess of dihydroxyaromatic compound is used to make a hydroxy-terminated oligomer. The value of n is determined by the molar ratio of dihydroxyaromatic compound to dihaloaromatic. For example when the ratio is 2:1, n is 1. When the ratio is 3:2, n is 2. A suitable range for n is 1 to 10, including 2, 3, 4, 5, 6, 7, 8, and 9, however, there is no upper limit to the value of n, even if the oligomer nay be considered a polymer.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/425,836 US7342085B2 (en) | 2003-12-15 | 2006-06-22 | Synthesis of oligomeric cyanate esters |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52924003P | 2003-12-15 | 2003-12-15 | |
| US10/825,799 US7087707B2 (en) | 2003-12-15 | 2004-04-14 | Synthesis of oligomeric cyanate esters |
| US11/425,836 US7342085B2 (en) | 2003-12-15 | 2006-06-22 | Synthesis of oligomeric cyanate esters |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/825,799 Division US7087707B2 (en) | 2003-12-15 | 2004-04-14 | Synthesis of oligomeric cyanate esters |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20060235196A1 US20060235196A1 (en) | 2006-10-19 |
| US7342085B2 true US7342085B2 (en) | 2008-03-11 |
Family
ID=34713768
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/825,799 Expired - Fee Related US7087707B2 (en) | 2003-12-15 | 2004-04-14 | Synthesis of oligomeric cyanate esters |
| US11/425,834 Expired - Fee Related US7348395B2 (en) | 2003-12-15 | 2006-06-22 | Synthesis of oligomeric cyanate esters |
| US11/425,836 Expired - Fee Related US7342085B2 (en) | 2003-12-15 | 2006-06-22 | Synthesis of oligomeric cyanate esters |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/825,799 Expired - Fee Related US7087707B2 (en) | 2003-12-15 | 2004-04-14 | Synthesis of oligomeric cyanate esters |
| US11/425,834 Expired - Fee Related US7348395B2 (en) | 2003-12-15 | 2006-06-22 | Synthesis of oligomeric cyanate esters |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US7087707B2 (en) |
| WO (1) | WO2005060382A2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110212292A1 (en) * | 2010-02-26 | 2011-09-01 | Hexcel Corporation | Thermoplastic-Toughened Cyanate Ester Resin Composites With Low Heat Release Properties |
| US20140014874A1 (en) * | 2009-08-11 | 2014-01-16 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Polymeric compositions containing microspheres |
| WO2014021946A1 (en) | 2012-08-02 | 2014-02-06 | The Gov. Of The U.S. Of America As Represented By The Secretary Of The Navy | Synthesis of and curing additives for phthalonitriles |
| US8921510B1 (en) | 2013-10-03 | 2014-12-30 | The United States Of America, As Represented By The Secretary Of The Navy | Phthalonitrile prepolymer intermediate |
| US9085692B1 (en) | 2014-02-25 | 2015-07-21 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Synthesis of oligomeric divinyldialkylsilane containing compositions |
| US9394404B2 (en) | 2014-12-16 | 2016-07-19 | The United States Of America, As Represented By The Secretary Of The Navy | Synthesis and polymerization of oligomeric aliphatic-aromatic based phthalonitriles |
| US9464170B2 (en) | 2014-12-15 | 2016-10-11 | The United States Of America, As Represented By The Secretary Of The Navy | Controlling crosslinking density and processing parameters of phthalonitriles |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080114149A1 (en) * | 2006-11-14 | 2008-05-15 | General Electric Company | Polymers comprising superacidic groups, and uses thereof |
| US7772355B2 (en) * | 2008-01-28 | 2010-08-10 | The United States Of America As Represented By The Secretary Of The Navy | Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds |
| US7723420B2 (en) * | 2008-07-25 | 2010-05-25 | The United States Of America As Represented By The Secretary Of The Navy | Synthesis and polymerization of oligomeric divinyl-terminated aromatic ether-containing resins |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3738962A (en) * | 1971-03-08 | 1973-06-12 | Minnesota Mining & Mfg | Cyanurates of cyanatophenyl-terminated polyarylene ethers |
| US4042567A (en) * | 1974-12-04 | 1977-08-16 | Bayer Aktiengesellschaft | S-Triazine prepolymers and a process for their production |
| JPH0578446A (en) * | 1991-09-18 | 1993-03-30 | Hitachi Ltd | Cured material using fluorine-containing cyanate and laminate using the same cured material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US229198A (en) * | 1880-06-22 | theodor steestwat | ||
| US5352760A (en) | 1993-02-18 | 1994-10-04 | The United States Of America As Represented By The Secretary Of The Navy | Polymerization of oligomeric multiple aromatic ether-containing phthalonitriles |
| US6756470B2 (en) | 2002-04-26 | 2004-06-29 | The United States Of America As Represented By The Secretary Of The Navy | Oligomeric hydroxy arylether phthalonitiles and synthesis thereof |
-
2004
- 2004-04-14 US US10/825,799 patent/US7087707B2/en not_active Expired - Fee Related
- 2004-06-24 WO PCT/US2004/020716 patent/WO2005060382A2/en active Application Filing
-
2006
- 2006-06-22 US US11/425,834 patent/US7348395B2/en not_active Expired - Fee Related
- 2006-06-22 US US11/425,836 patent/US7342085B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3738962A (en) * | 1971-03-08 | 1973-06-12 | Minnesota Mining & Mfg | Cyanurates of cyanatophenyl-terminated polyarylene ethers |
| US4042567A (en) * | 1974-12-04 | 1977-08-16 | Bayer Aktiengesellschaft | S-Triazine prepolymers and a process for their production |
| JPH0578446A (en) * | 1991-09-18 | 1993-03-30 | Hitachi Ltd | Cured material using fluorine-containing cyanate and laminate using the same cured material |
Non-Patent Citations (4)
| Title |
|---|
| Abed et al., "Synthesis and characterization of new phosphorus and other heteroatom containing Aryl cyanate ester-", J. Polym. Sci. A: Polym. Chem., 35(6), 977 (1997). * |
| Abed et al., "Synthesis of novel monomers for cyanate ester matrices", Polymer Preprints, 33(2), 233 (1992). * |
| Chang et al., "Polar interaction in a cyanated poly(ether sulfone)-modified polycyanurate", Polymer, 39(20), 7119(1998). * |
| Srinivasan et al., "Effect of backbone chemistry & functional termination-", Polym. Preprints, 33(2), 325 (1992). * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140014874A1 (en) * | 2009-08-11 | 2014-01-16 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Polymeric compositions containing microspheres |
| US8946321B2 (en) * | 2009-08-11 | 2015-02-03 | The United States Of America, As Represented By The Secretary Of The Navy | Polymeric compositions containing microspheres |
| US20110212292A1 (en) * | 2010-02-26 | 2011-09-01 | Hexcel Corporation | Thermoplastic-Toughened Cyanate Ester Resin Composites With Low Heat Release Properties |
| US8283408B2 (en) | 2010-02-26 | 2012-10-09 | Hexcel Corporation | Thermoplastic-toughened cyanate ester resin composites with low heat release properties |
| US8404777B2 (en) * | 2010-02-26 | 2013-03-26 | Hexcel Corporation | Thermoplastic-toughened cyanate ester resin composites with low heat release properties |
| WO2014021946A1 (en) | 2012-08-02 | 2014-02-06 | The Gov. Of The U.S. Of America As Represented By The Secretary Of The Navy | Synthesis of and curing additives for phthalonitriles |
| US8735532B2 (en) | 2012-08-02 | 2014-05-27 | The United States Of America, As Represented By The Secretary Of The Navy | Synthesis of and curing additives for phthalonitriles |
| EP3831866A1 (en) | 2012-08-02 | 2021-06-09 | The Government of the United States of America as represented by the Secretary of the Navy | Synthesis of and curing additives for phthalonitriles |
| US8921510B1 (en) | 2013-10-03 | 2014-12-30 | The United States Of America, As Represented By The Secretary Of The Navy | Phthalonitrile prepolymer intermediate |
| US9085692B1 (en) | 2014-02-25 | 2015-07-21 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Synthesis of oligomeric divinyldialkylsilane containing compositions |
| US9464170B2 (en) | 2014-12-15 | 2016-10-11 | The United States Of America, As Represented By The Secretary Of The Navy | Controlling crosslinking density and processing parameters of phthalonitriles |
| US9394404B2 (en) | 2014-12-16 | 2016-07-19 | The United States Of America, As Represented By The Secretary Of The Navy | Synthesis and polymerization of oligomeric aliphatic-aromatic based phthalonitriles |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060235195A1 (en) | 2006-10-19 |
| US20060235196A1 (en) | 2006-10-19 |
| US7348395B2 (en) | 2008-03-25 |
| WO2005060382A3 (en) | 2005-08-25 |
| WO2005060382A2 (en) | 2005-07-07 |
| US20060155104A1 (en) | 2006-07-13 |
| US7087707B2 (en) | 2006-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7342085B2 (en) | Synthesis of oligomeric cyanate esters | |
| US8735532B2 (en) | Synthesis of and curing additives for phthalonitriles | |
| US8293865B2 (en) | Phosphorus-containing compounds and their preparation process and use | |
| US9394404B2 (en) | Synthesis and polymerization of oligomeric aliphatic-aromatic based phthalonitriles | |
| JP7505873B2 (en) | Poly(arylene ether) copolymers | |
| US8981036B2 (en) | Synthesis of and curing additives for phthalonitriles | |
| US9920165B2 (en) | Phthalonitriles derived from polyphenols | |
| US8859712B2 (en) | Synthesis of and curing additives for phthalonitriles | |
| EP3443020B1 (en) | Polyisoindolinones, methods of manufacture, and compositions and articles formed therefrom | |
| US4374974A (en) | Method for making polyformals and polyformal products made thereby | |
| EP0192177B1 (en) | Copolymer and process for producing the same | |
| US4847233A (en) | Metal acetylacetonate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols | |
| US4552947A (en) | Heat-resisting aromatic polyester and process for preparing the same | |
| EP1149853B1 (en) | Polycyanoaryl ether and method for production thereof | |
| EP0489827B1 (en) | Process for making cyanato containing phenolic resins | |
| JP3874089B2 (en) | Thermosetting PPE oligomer | |
| JPH07316252A (en) | Method and composition for producing epoxy resin having excellent dielectric properties | |
| WO2015183518A1 (en) | Synthesis of and curing additives for phthalonitriles | |
| CA1218791A (en) | Aromatic polyformals | |
| JP2002012662A (en) | Polycyanoarylether and method for producing the same | |
| Kim | Synthesis and properties of novel thermally stable polymers | |
| JPS62153320A (en) | Aromatic polyether resin and its manufacturing method | |
| JPH01221423A (en) | Aromatic ether ketone polymer and preparation thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KELLER, TEDDY M;LASKOSKI, MATTHEW;REEL/FRAME:017831/0442;SIGNING DATES FROM 20040326 TO 20040331 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| AS | Assignment |
Owner name: NAVY, THE U.S.A. AS REPRESENTED BY THE SECRETARY O Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KELLER, TEDDY M.;LASKOSKI, MATT;REEL/FRAME:020867/0805;SIGNING DATES FROM 20040326 TO 20040331 |
|
| FPAY | Fee payment |
Year of fee payment: 4 |
|
| FPAY | Fee payment |
Year of fee payment: 8 |
|
| FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |





