US6858519B2 - Atomic hydrogen as a surfactant in production of highly strained InGaAs, InGaAsN, InGaAsNSb, and/or GaAsNSb quantum wells - Google Patents
Atomic hydrogen as a surfactant in production of highly strained InGaAs, InGaAsN, InGaAsNSb, and/or GaAsNSb quantum wells Download PDFInfo
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- US6858519B2 US6858519B2 US10/219,425 US21942502A US6858519B2 US 6858519 B2 US6858519 B2 US 6858519B2 US 21942502 A US21942502 A US 21942502A US 6858519 B2 US6858519 B2 US 6858519B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/02—MBE
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3201—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures incorporating bulkstrain effects, e.g. strain compensation, strain related to polarisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/3235—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/962—Quantum dots and lines
Definitions
- This invention relates to vertical cavity surface emitting lasers (VCSEL) and more particularly to VCSELs utilizing combinations of nitrogen (N), aluminum (Al), antimony (Sb), phosphorous (P) and/or indium (In) as a material system and as a means to increase VCSEL device wavelength. More particularly the present invention relates to a VCSEL including atomic hydrogen as a surfactant during molecular beam epitaxy (MBE) processing of InGaAs, InGaAsN, InGaAsNSb and/or GaAsNSb quantum wells.
- MBE molecular beam epitaxy
- Solid-state semiconductor lasers are important devices in applications, such as in optoelectronic communication systems and in high-speed printing systems. Recently, there has been an increased interest in vertical cavity surface emitting lasers (VCSELs), although edge-emitting lasers are currently utilized in the vast majority of applications. A reason for this interest in VCSELs is that edge emitting lasers produce a beam with a large angular divergence, making efficient collection of the emitted beam more difficult. Furthermore, edge emitting lasers cannot be tested until the wafer is cleaved into individual devices, the edges of which form the mirror facets of each laser device.
- VCSELs vertical cavity surface emitting lasers
- a VCSEL emits light normal to the surface of the wafer.
- VCSELs incorporate the mirrors monolithically in their design, they allow for on-wafer testing and the fabrication of one-dimensional or two-dimensional laser arrays.
- VCSELs are typically made by growing several layers on a substrate material.
- VCSELs include a first mirrored stack, formed on the substrate by semiconductor manufacturing techniques, an active region, formed on top of the first mirrored stack, and a second mirrored stack formed on top of the active region.
- a current is forced through the active region, thus driving the VCSEL.
- the active region is comprised of one or more quantum wells sandwiched between two spacer cladding regions. Inside the spacers, the active region is sandwiched by confining layers. The confining layers or regions are used to provide electrical confinement of minority carriers.
- a VCSEL generally may be grown or fabricated that generates light at a desirable, predetermined wavelength. For example, by using InGaAs quantum wells on GaAs substrates, longer wavelength VCSELs (e.g., 1310-nm, 1550-nm) can be produced. The use of InGaAs quantum wells, however, causes strain in the quantum wells. If the quantum wells are grown past their critical thickness, then they relax by creating dislocations, and thus a poor quality active region.
- the thickness of the various layers in the active region while not arbitrary, has some flexibility within the constraints of the design and the process.
- the combined thickness of the spacers, the confining layers, the barriers and the active regions sandwiched by the mirrors are generally configured such that a Fabrey Perot resonator is formed thereby.
- the quantum wells should be positioned so that they are roughly centered at an antinode of the electric field. These two requirements define the spacer thickness in terms of the other layer thicknesses.
- the barrier layer thicknesses between the quantum wells need to be thick enough to adequately define the quantum wells but thin enough that the quantum well positions are not excessively far from the antinode of the electric field.
- the thickness of the barrier layers at the boundaries of the quantum well regions have some flexibility.
- the barrier layers need to be at least thick enough such that the energy levels of each of the quantum wells are nominally the same.
- the barrier layers can be thicker as may be required by material quality issues.
- the confining layers are often one and the same with the spacers or, as is shown in the present invention, can grade stepwise or continuously in the valence and conduction bands toward that of the barriers. Sometimes the confining layers and barrier layers are fabricated from the same compositions, but this is not optimal for carrier confinement and is usually a compromise made for processing reasons.
- the thickness of the quantum well is related by quantum mechanics to the well and barrier compositions, the desired emission wavelength, and the density of states. With a higher density of states, narrower quantum wells can be optimally used.
- the present invention describes enhanced quantum well performance utilizing atomic hydrogen as a surfactant during molecular beam epitaxy (MBE) growth of quantum wells used in semiconductor lasing devices such as VCSELs.
- MBE molecular beam epitaxy
- the VCSEL art needs a means to achieve long wavelength quantum wells normally fabricated on GaAs substrates.
- the present inventor has recognized that it would be advantageous to remedy the foregoing and other deficiencies in conventional devices and to facilitate the production of longer wavelength VCSELs.
- MBE molecular beam epitaxy
- quantum wells are grown using MBE.
- an atomic hydrogen beam from either a thermal or plasma source is impinged on the growing surface.
- the quantum wells grown utilizing this technique are much thicker than are typically allowed by the Mathews Blakely critical thickness.
- This technique can be utilized also for the incorporation of nitrogen because it allows the growth of excellent quality material at lower temperatures. The use of lower temperatures prevents the phase separation of nitrogen compounds, making much higher nitrogen concentrations reasonable with good material quality.
- quantum wells and/or associated barrier layers are grown using atomic hydrogen during MBE growth, including several novel combinations of nitrogen, aluminum, antimony, phosphorous and/or indium placed within or about a typical GaAs substrate to achieve long wavelength VCSEL performance, e.g., within the 1260 to 1650 nm range useful for fiberoptic communication.
- FIG. 1 is an exemplary sectional view of a VCSEL in accordance with an embodiment of the present invention
- FIG. 2 is another exemplary sectional view of a VCSEL in accordance with another embodiment of the present invention.
- FIG. 3 is a block diagram illustrating the growth of an active semiconductor layer of a VCSEL using molecular beam epitaxy techniques
- FIG. 4 is a block diagram illustrating the growth of an active semiconductor layer of a VCSEL using molecular beam epitaxy techniques employing hydrogen as a surfactant;
- FIG. 5 is a block diagram of components used in the growth of active layer of a VCSEL using molecular beam epitaxy techniques.
- FIG. 6 is a block diagram of components used in the growth of active layers of a VCSEL using molecular beam epitaxy techniques in accordance with the present invention.
- VCSELs Fabrication of long wavelength quantum wells on GaAs substrates has proven to be very difficult, but the present invention allows for longer wavelength quantum wells and higher efficiency VCSELs to be feasible.
- One issue experienced in fabricating VCSELs is that long wavelength compounds tend not to be lattice matched to GaAs. This has been alleviated by utilizing nitrogen in the quantum wells, which reduces the energy band and also reduces the lattice constant in contrast to every other band gap reducing element, thereby permitting the inclusion of other elements (e.g., In, Sb), and which reduces the band gap but increases the lattice constant.
- the use of nitrogen can have a negative effect of reducing confinement in the valence band and may tend to result in poorer luminescence material as more nitrogen is added.
- VCSEL vertical cavity surface emitting laser 100
- the VCSEL 100 can be grown by techniques such as molecular beam epitaxy (MBE), or metal-organic chemical vapor deposition or related techniques.
- MBE molecular beam epitaxy
- the VCSEL can preferably be grown on a GaAs substrate 101 due to the robust nature and low cost of the material; however, it should be recognized that semiconductor materials, Ge, for example, could also be used as the substrate.
- the VCSEL 100 can then be formed by disposing layers on the substrate 101 .
- Epitaxial layers can include: a first mirror stack 105 disposed on the substrate 101 , a first cladding region 108 disposed on the first mirror stack 105 , an active region 110 disposed on the first cladding region 108 , a second cladding region 112 disposed on the active region 110 , and a second mirror stack 115 disposed on the second cladding region 112 .
- the active region 110 can further include one or more quantum wells 120 separated from each other by barrier layers 125 , depending on the application for which the VCSEL 100 is designed.
- barrier layers 125 depending on the application for which the VCSEL 100 is designed.
- the number of quantum wells 120 in the VCSEL active region 110 can vary.
- the first mirror stack 105 can be grown by epitaxially depositing mirror pair layers 106 on the substrate 101 .
- a suitable semiconductor material system for the mirror pair layers 106 should be deposited.
- the substrate 101 is GaAs; therefore, a GaAs/AlGaAs material system can be employed.
- the number of mirror pair layers 106 in the first mirror stack 105 can usually range from about 20 to 40, depending on the difference between the refractive indices of the layers. Different refractive indexes are also achievable by altering the aluminum content in the first mirror stack 105 .
- a first cladding region 108 can be constructed from one or more layers epitaxially disposed on the first mirror stack 105 .
- the first cladding region 108 in one embodiment of the invention can be fabricated of a GaAsN material system.
- Nitrogen added to the quantum well 120 reduces the compressive strain of the quantum well 120 .
- the reduction in compressive strain reduces the energy band gap in the quantum well 120 , but even more important, the change in composition reduces it further.
- Band gap energy reduction increases the wavelength of the emitted photon, which can be desirable to achieve longer wavelength VCSELs 100 .
- the more nitrogen that is added to the quantum well 120 the greater the reduction in band gap energy can be; and, thus, longer wavelength VCSELs 100 can be produced.
- the strain in the structure can be reduced, which can increase the thickness of the quantum wells 120 , and the energy gap can be reduced, both of which can increase the wavelength.
- the use of nitrogen in the quantum wells can make the valence band discontinuity nonconfining or type 11 .
- the nonconfining problem can also be reduced.
- Sb replaces a portion of the As (Arsenic) in the quantum well 120 , the type II transition caused by nitrogen can further be avoided, allowing even more nitrogen. Because even more nitrogen is allowable, more indium is allowable. Because nitrogen, indium, and Sb all reduce the band gap energy, the achievable wavelengths extend to wavelengths longer than either the 1310 nm wavelength utilized for data communication or the 1550 nm wavelength used for telecommunication applications.
- the overall strain in the quantum well 120 can become significantly less, allowing more indium to be included prior to obtaining the critical thickness, thus making longer wavelength VCSELs possible.
- the allowable strain in the quantum well region can increase, meaning that even more indium can be utilized in the quantum wells. More indium is allowable without violating the critical thickness, making for an even lower band gap and longer wavelengths.
- utilizing nitrogen in the barrier layers between the quantum wells can also reduce the energy of these barriers in the conduction band, making the energy of the quantum state lower, further increasing the allowable wavelength.
- Utilizing nitrogen in the barrier layers can also be advantageous in avoiding type II behavior in the valence band; because as nitrogen is incorporated in the quantum wells, the conduction band discontinuity increases, and the valence band discontinuity decreases.
- use of AlGaAs or AlGaAsN for the confining structure can further avoid unintentional wells in the valence band at the barrier layer confining layer boundary.
- the use of Sb in the quantum well can reduce the band gap energy further, while avoiding the type II behavior (allowing even more nitrogen). All of these aspects contribute to the ability to create very long wavelength active regions.
- GaN and InN can have large differences in their lattice constants versus GaAs substrates. Due to this lattice mismatch, the quality of the material can be greatly compromised when layers comprising the active region 110 are grown beyond a certain critical thickness. Layers thicker than this critical thickness can possess misfit dislocations, relaxing the strain between the layers, and decreasing the material quality. This can substantially compromise the quality of the VCSEL 100 .
- the band gap energy decrease can be observed as it is when nitrogen is added only to the quantum well 120 .
- the amount of nitrogen needed in the quantum well 120 to achieve a given band gap energy reduction, and therefore a longer wavelength can be reduced.
- the lattice mismatch can, therefore, not generally be as severe as when nitrogen is added to the quantum well 120 alone, thus making the material system easier to fabricate.
- Higher quality VCSELs can be achieved by introducing nitrogen into the barrier regions 125 than when only nitrogen is added to the quantum well 120 .
- Active region 110 can next be epitaxially deposited on the first cladding region 108 .
- the active region 110 can include one or more quantum wells 120 .
- the preferred embodiment uses quantum wells 120 of less than about 50 angstroms.
- nitrogen is introduced into the active region 110 or the cladding region 108 , 112 , the effective electron mass in the regions can increase dramatically. With this increased effective mass there is a large increase in density of the states, the thickness of quantum well 120 needed to produce a given amount of gain in the active region 110 generally decreases. Therefore, the volume of the quantum well 120 can also be decreased, giving less volume in which parasitics can occur.
- a second cladding region 112 can be constructed from one or more layers epitaxially disposed on the active region 110 .
- the second cladding region 112 can be made of a GaAsN material system.
- a second mirror stack 115 can be grown by epitaxially depositing mirror pairs layers 116 on the second cladding region 112 .
- a suitable semiconductor material system for the mirrored pairs 116 should be deposited.
- the substrate 101 is generally formed from GaAs; therefore, a GaAs/AlGaAs material system can be employed.
- the number of mirror pair layers 116 in the stack 115 can usually range from about 20 to 40, depending on the difference between the refractive indices of the layers. Different refractive indexes are achievable by altering the aluminum content in the mirror stack 115 .
- a flattening layer 235 can be grown between the first cladding region 208 , which is grown on the first mirror stack 205 , and quantum well(s) 220 associated with the active region 210 .
- bunching of molecular steps form on the surface of the newly-formed layers. The steps on the layer's surface increase the likelihood that layers adjacent to the substrate 201 can dislocate from the substrate 201 .
- a heavily compressively strained InGaAs flattening layer 235 grown as part of the active region 210 at a thickness sufficient to minimize the straining effects on the quantum well layers (e.g., about 30 angstroms) generally has the effect of flattening the surface to which the active region 210 is disposed.
- the flattening layer 235 can be separated from the quantum well(s) 220 by about 200 angstroms of GaAs. Growing this flattening layer 235 between the first cladding region 208 and quantum wells 225 within the active region 210 can flatten out these molecular steps.
- the surface can be further flattened when the epitaxial layers are grown on “100 or 111 on” orientation substrates.
- the number of molecular steps can increase and the likelihood of bunching of steps increases, thereby increasing the likelihood for dislocation.
- the strain between layers can be further increased through the addition of greater amounts of In or Sb in the active region. This increased In or Sb generally decreases the band gap energy, thereby making it easier to grow VCSELs 200 that emit longer wavelengths.
- the present invention can utilize atomic hydrogen during molecular beam epitaxy (MBE) growth of active semiconductor layers for a VCSEL.
- MBE molecular beam epitaxy
- This invention can also utilize strain compensation with or without nitrogen in the barrier layers to allow more In and/or Sb incorporation in the quantum wells without relaxation and thus achieve longer wavelengths.
- a trade off of the effects on well depth of the Sb and N can also be accomplished so that conduction band wells of at least 0.08 eV and valence band wells of at least 0.04 eV are achievable.
- FIG. 3 a block diagram is shown illustrating an example of the resulting growth of an InGaAs layer 305 using MBE without the benefit of hydrogen.
- the InGaAs layer 305 is shown grown on a GaAs substrate 310 .
- islands 315 tend to form on the surface 307 of the InGaAs 305 layer.
- the islands 315 can be sources of misfit dislocations 317 .
- Increased horizontal displacement caused by a multiple atomic layer step can actually cause the formation of edge dislocations caused by the misfit of the lattices. Without a multistep stackup, dislocation probably would not occur.
- Hydrogen reduces step heights and thus reduces the formation of dislocations. Referring to FIG.
- FIG. 4 a block diagram is shown illustrating an example of the resulting growth of an InGaAs layer 405 using molecular beam epitaxy and the use of atomic hydrogen 403 as a surfactant.
- the InGaAs layer 405 is grown on a GaAs substrate 410 .
- a more uniform (uniformly smooth) surface 407 on the InGaAs layer 405 can be grown where hydrogen 403 is used as a surfactant in the MBE process.
- Misfit dislocations on the VCSEL active layers are preventable using hydrogen during the MBE process, resulting in active semiconductor layers with superior performance that result in providing longer wavelength lasing devices.
- Hydrogen on the surface of the wafer during growth promotes flat growth.
- Hydrogen is generally provided utilizing a source similar to that known in the art for delivery of influential elements during MBE processing.
- atomic hydrogen can be beamed using a plasma source or a thermal cracker, or chemically by cracking hydrogen-containing compounds, such as arsine, so that the hydrogen sits on the surface of the epitaxial layers.
- hydrogen-containing compounds such as arsine
- the use of nitrogen has proven problematic because of its tendency to segregate and the tendency to form three-dimensional structures.
- FIG. 5 a block diagram is shown illustrating some components that are used in a system for the growth of active layers of VCSELs using molecular beam epitaxy.
- a wafer 501 is placed within a controlled environment 505 , wherein the wafer 501 is generally heated to about 450° C.
- Cells 511 - 515 are then used for producing various beams of selected elements, which are further oriented within the environment to promote growth on the substrate surface 503 of the wafer 501 .
- Beam sources from the cells can be, for example, Ga 511 , As 513 , and In 515 effusion cells. It is well known in the art, however, that Al, Sb, and/or N can also be sources used to impinge on the wafer surface during, and to promote, growth of certain semiconductor materials.
- Atomic hydrogen can be obtained from plasma sources or thermal cracker or from cracking of hydrogen-containing compounds, such as arsine or N—H radicals. As discussed in FIG. 4 , hydrogen can substantially improve growth quality during MBE processing.
- a wafer 601 within the controlled environment 605 cell can be beamed with typical sources, such as In 615 , Ga 611 and As 613 .
- cells can provide atomic hydrogen 623 during processing to provide control and promote growth quality.
- a combined source 625 of, for example, nitrogen/hydrogen can generate desired sources and can be provided together with controlled environments 605 as cells for purposes of carrying out the invention.
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US20040161006A1 (en) * | 2003-02-18 | 2004-08-19 | Ying-Lan Chang | Method and apparatus for improving wavelength stability for InGaAsN devices |
US20050142683A1 (en) * | 1998-12-21 | 2005-06-30 | Honeywell International | System for developing a nitrogen-containing active region |
US20070201525A1 (en) * | 2004-10-01 | 2007-08-30 | Finisar Corporation | Vertical cavity surface emitting laser having strain reduced quantum wells |
US20110090930A1 (en) * | 2004-10-01 | 2011-04-21 | Finisar Corporation | Vertical cavity surface emitting laser with undoped top mirror |
US20130203243A1 (en) * | 2010-10-28 | 2013-08-08 | The University Of Utah | Methods for enhancing p-type doping in iii-v semiconductor films |
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US20070153851A1 (en) * | 2005-12-15 | 2007-07-05 | Palo Alto Research Center Incorporated | On-chip integration of passive and active optical components enabled by hydrogenation |
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