BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to semiconductor devices, and more particularly, to a semiconductor device which has a central processing unit (CPU) and peripheral circuits on the same chip, and operates in an EPROM (Erasable and Programmable ROM)/ICE (In-Circuit Emulator) mode. The EPROM/ICE mode is a test mode for evaluating the characteristics and checking operations of the semiconductor chip. In the ROM mode, the semiconductor device operates in accordance with the data stored in an internal ROM.
2. Description of the Related Art
In recent years, in response to increasing demands for smaller and lighter electronic equipment for household appliances, more and more semiconductor devices having high precision analog circuits on one chip are employed in electronic equipment. In the case where a digital circuit and an analog circuit are mounted on the same chip, it is difficult to produce a developmental semiconductor device having an EPROM/ICE circuit, and a mass-production type semiconductor device having a ROM, and to make both semiconductor devices have the same characteristics.
Conventionally, the developmental semiconductor device having the EPROM/ICE mode circuit for characteristic evaluation and operation check has been produced separately from the mass-production type semiconductor device having the ROM. The two semiconductor devices of different types have been developed so that the characteristics of the semiconductor devices are the same. The developmental semiconductor device having the EPROM/ICE mode circuit has been used, instead of the mass-production type semiconductor device, for evaluating characteristics, checking operations, and debugging in software development.
In the case where a digital circuit and a high precision analog circuit are mounted on the same chip, however, it is difficult to produce the developmental semiconductor device having the EPROM/ICE mode circuit and the mass-production type semiconductor device having the ROM so that the two semiconductor devices of different types have the same characteristics. More specifically, in semiconductor devices of the two types used in a battery-powered electronic device, such as camera or portable telephone, the power consumption and noise characteristics of both semiconductor devices are required to be the same. It is even more difficult to produce such two semiconductor devices separately. Also, producing the two semiconductor devices separately causes problems that the manufacturing period of the semiconductor devices are prolonged, and that the production costs of the semiconductor devices become higher.
Furthermore, in a conventional semiconductor device having the EPROM/ICE mode circuit and the ROM on the same chip, data stored in the ROM can be easily read in the EPROM/ICE mode. Therefore, there is always the danger that other people might obtain the ROM data against the owner's will.
SUMMARY OF THE INVENTION
A general object of the present invention is to provide a semiconductor device in which the above disadvantages are eliminated.
A more specific object of the present invention is to provide a semiconductor device which operates in a test mode and a read mode, and is protected so that ROM data is not read in the test mode.
The above objects of the present invention are achieved by a semiconductor device having a test mode and a read mode. This semiconductor device includes a ROM and a control circuit which prevents data stored in the ROM from being outputted to the outside of the semiconductor device in the test mode when a predetermined condition is satisfied.
The above objects of the present invention are also achieved by a semiconductor device which includes: a mode switch circuit which selects between a test mode and a ROM mode in accordance with mode select signals from the outside; a ROM read control circuit which outputs a first signal to enable ROM data reading; and a register which transmits a second signal to the ROM read control circuit so that the ROM read control circuit outputs the first signal.
Since the semiconductor device operates in both the test mode and the ROM mode, there is no need to produce two types of semiconductor device corresponding to the two modes. Thus, the manufacturing period of the semiconductor device can be shortened, and the production costs can be reduced. When the semiconductor device is in the test mode, the ROM data cannot be read out unless a predetermined condition is satisfied. Thus, reading the ROM data against the owner's will can be avoided in the test mode.
The above and other objects and features of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic view of a semiconductor device of the present invention;
FIG. 2 illustrates an example of the structure of a register;
FIG. 3 illustrates an example of the structure of a mode switch circuit;
FIG. 4 shows the relationship between signals inputted into the mode switch circuit and signals outputted from the mode switch circuit;
FIG. 5 shows an example of the structure of a ROM read control circuit;
FIG. 6 is a timing chart showing waveforms of signals in an In-ROM mode; and
FIG. 7 is a timing chart showing waveforms of signals in an EPROM mode.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The following is a description of embodiments of the present invention, with reference to the accompanying drawings.
As shown in FIG. 1, a
semiconductor device 100 comprises a
peripheral circuit 10, a
CPU 20, a
ROM 30, a
decoder 40, an EPROM/ICE interface circuit
50, a
register 60, a
mode switch circuit 70, and a ROM
read control circuit 80. These circuits are connected by
internal buses 12 and
signal lines 13 to
16. Signals passing through the signal lines will be hereinafter denoted by the same reference numerals as the corresponding signal lines.
The
peripheral circuit 10 comprises a register, a RAM (not shown), and other circuit. These circuits in the
peripheral circuit 10 transmit and receive signals via
terminal 11 a to
11 x. The EPROM/ICE interface circuit
50 is an interface circuit for controlling the
semiconductor device 100 in an EPROM/ICE mode by an external ICE tool or EPROM (not shown). The EPROM/ICE interface circuit
50 has
terminals 51 a to
51 x. In an ICE mode, the ICE tool is connected to the
terminals 51 a to
51 x, so that the operation of the
semiconductor device 100 can be controlled by a personal computer or a special device for the
semiconductor device 100. In an EPROM mode, the EPROM is connected to the
terminals 51 a to
51 x, so that the
semiconductor device 100 operates in accordance with instructions written in the EPROM.
The
register 60 is a register, and determines whether data should be read from the
ROM 30 in the EPROM/ICE mode. The
register 60 receives the data via an
internal bus 12. If the
register 60 receives a certain data value in the EPROM/ICE mode, the
register 60 outputs a high-
level signal 15 to the ROM read
control circuit 80, so that the data can be read from the
ROM 30.
FIG. 2 illustrates an example of the structure of the
register 60. As shown in this figure, the
register 60 comprises an
AND circuit 61, a
decoder 62, and an
inverter 63. When a high-
level signal 1 is inputted into each of the input terminals of the
AND circuit 61 from an
internal bus 12 via the
decoder 62, the
register 60 outputs a
high level signal 15 to the ROM read
control circuit 80.
The
mode switch circuit 70 supplies the EPROM/ICE interface circuit
50 and the ROM
read control circuit 80 with mode signals based on signals inputted into
terminals 71 and
72, thereby determining the operation mode of the
semiconductor device 100.
FIG. 3 illustrates an example of the structure of the
mode switch circuit 70. As shown in FIG. 3, the
mode switch circuit 70 comprises AND
circuits 73 to
75, and
inverters 76 and
77. The
terminals 71 and
72 of the
mode switch circuit 70 receive combinations of mode setting signals shown in FIG.
4.
FIG. 4 shows the relationship between the signals inputted into the
mode switch circuit 70 and the signals outputted from the
mode switch circuit 70. If low-
level signals 0 are inputted into the
terminals 71 and
72, for instance, the
AND circuits 73 to
75 output low-
level signals 0. The output signals are then sent to the
CPU 20, the EPROM/ICE interface circuit
50, and the ROM read
control circuit 80, thereby making the
semiconductor device 100 disabled.
If a low-
level signal 0 is inputted into the
terminal 71 and a high-
level signal 1 is inputted into the
terminal 72, the
AND circuits 73 and
74 output low-level signals, and the
AND circuit 75 outputs a high-
level signal 1. The output signals are then sent to the
CPU 20, the EPROM/ICE interface circuit
50, and the ROM read
control circuit 80, thereby putting the
semiconductor device 100 in a ROM mode in which the
semiconductor device 100 operates according to the data contained in the ROM
30 (hereinafter referred to as “In-ROM mode”). In the In-ROM mode, the data can be read from the
ROM 30, regardless of the data value given to the
register 60 from the
internal bus 12.
If a
high level signal 1 is inputted into the terminal
71 and a low-
level signal 0 is inputted into the terminal
72, the
semiconductor device 100 is put in the ICE mode. If high-
level signals 1 are inputted into both
terminals 71 and
72, the
semiconductor device 100 is put in the EPROM mode.
The ROM read
control circuit 80 outputs high-level and low-level signals in accordance with signals sent from the
register 60 and the
mode switch circuit 70. The
output signal 14 from the ROM read
control circuit 80 is sent to the
ROM 30. If the
output signal 14 is at high level, data can be read from the
ROM 30. If the
output signal 14 is at low level, data cannot be read from the
ROM 30.
FIG. 5 illustrates an example of the structure of the ROM read
control circuit 80. As shown in FIG. 5, the ROM read
control circuit 80 comprises EX(Exclusive)-OR
circuits 81 and
82, AND
circuits 84 to
86. The output signals from the AND
circuits 73 to
75 in the
mode switch circuits 70 are inputted into the AND
circuits 84 to
86 in the ROM read
control circuit 80, respectively. The AND
circuits 84 to
86 also receive a
signal 13 from the
CPU 20 and a
signal 16 from the
decoder 40. The
signal 15 from the
register 60, which determines whether the data can be read from the
ROM 30 in the EPROM/ICE mode, is inputted into the AND
circuit 83 in the ROM read
control circuit 80.
It should be understood that the structures of the
register 60, the
mode switch circuit 70, and the ROM read
control circuit 80, are not limited to those shown in FIGS. 2,
3, and
5, but the structures may be modified if necessary.
Next, the operation of the
semiconductor device 100 will be described.
FIG. 6 is a timing chart showing the waveforms of signals in the In-ROM mode. In the In-ROM mode, a low-
level signal 0 and a high-
level signal 1 are inputted into the terminal
71 and
72, and the
mode switch circuit 70 then transmits
low level signals 0 to the AND
circuits 84 and
85, and a high-
level signal 1 to the AND circuit
86 in the ROM read
control circuit 80. Here, the
decoder 40 transmits high-
level signals 16 to the AND
circuits 84,
85, and
86. Accordingly, the EX-OR circuit
81 outputs a low-
level signal 14 when the
signals 13 transmitted from the
CPU 20 to the AND
circuits 84 to
86 are at low level, regardless of the level of the
signals 15 transmitted from the
register 60 to the ROM read
control circuit 80. When the
signals 13 transmitted from the
CPU 20 to the AND
circuits 84 to
86 are at high level, the EX-OR circuit
81 outputs a high-
level signal 14. As the
ROM 30 receives the high-
level signal 14, it becomes possible to read data from the
ROM 30.
FIG. 7 is a timing chart showing the waveforms of signals in the EPROM mode. In the EPROM mode, high-
level signals 1 are inputted into the
terminals 71 and
72, and the
mode switch circuit 70 then transmits a high-
level signal 1 to the AND
circuit 84, and low-
level signals 0 to the AND
circuits 85 and
86 in the ROM read
control circuit 80. Here, the
decoder 40 transmits high-
level signals 16 to the AND
circuits 84 to
86. Accordingly, no specific data value is inputted into the
register 60 via the
internal bus 12. When the
register 60 transmits a low-
level signal 15 to the ROM read
control circuit 80, the EX-OR circuit
81 continues to output a low-
level signal 14 even if the
signal 13 inputted from the CPU
20 into the ROM read
control circuit 80 changes to a high-level signal. At this point, data cannot be read from the
ROM 30.
On the other hand, when a specific data value is inputted into the
register 60 via the
internal bus 12 and the
register 60 transmits a high-
level signal 15 to the ROM read
control circuit 80, the EX-OR circuit
81 also transmits a high-
level signal 14 if the
signal 13 inputted from the
CPU 20 to the ROM read
control circuit 80 changes to a high-level signal. At this point, it becomes possible to read data from the
ROM 30.
In the ICE mode, as in the EPROM mode, the EX-OR circuit
81 outputs a high-
level signal 14 when the
signals 13,
15, and
16 are all at high level, thereby enabling data reading from the
ROM 30.
Since the data cannot be read from the
ROM 30 when no specific data value is inputted into the
register 60 in the EPROM/ICE mode, it is possible to prevent the ROM data reading against the owner's will. The
semiconductor device 100 has the In-ROM mode and the EPROM/ICE mode, so that there is no need to develop two semiconductor devices corresponding to both mode. Thus, the
semiconductor device 100 can be produced in a shorter period of time, and the production costs of the
semiconductor device 100 can also be reduced.
In the above embodiment, the data to be inputted into the AND
circuit 61 shown in FIG. 2 correspond to the predetermined condition and the data in the claims of the present invention. Also, the signals inputted via the
terminals 71 and
72 correspond to the mode selecting signals in the claims. The
signals 14 and
15 correspond to a first signal and a second signal in the claims of the present invention.
The present invention is not limited to the specifically disclosed embodiments, but variations and modifications may be made without departing from the scope of the present invention.
The present application is based on Japanese priority application No. 10-239016, filed on Aug. 25, 1998, the entire contents of which are hereby incorporated by reference.