US6498724B1 - Heat dissipation device for a computer - Google Patents

Heat dissipation device for a computer Download PDF

Info

Publication number
US6498724B1
US6498724B1 US09/915,281 US91528101A US6498724B1 US 6498724 B1 US6498724 B1 US 6498724B1 US 91528101 A US91528101 A US 91528101A US 6498724 B1 US6498724 B1 US 6498724B1
Authority
US
United States
Prior art keywords
heat dissipation
dissipation device
circuit board
printed circuit
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/915,281
Inventor
Sen Long Chien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US09/915,281 priority Critical patent/US6498724B1/en
Application granted granted Critical
Publication of US6498724B1 publication Critical patent/US6498724B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation device for a computer, more particularly relates to a heat dissipation device having a mounting structure for readily mounting a heat dissipation device onto computer case or printed circuit board in order to draw out the heat generated by semiconductor devices of the computer, wherein the heat dissipation device may be mounted onto a plate of the computer case by fastening members and elastic members, in addition, the heat dissipation device may directly be mounted onto a printed circuit board and connected a heat sink and a semiconductor device to the printed circuit board for cooling the semiconductor device.
  • Another method to mount a heat dissipation fan and heat sink onto the semiconductor device or the printed circuit board will be secured the heat sink onto a frame, which could be mounted on the base of semiconductor device, and then, mounted the heat dissipation fan onto the frame by locking wedges to orifices of the frame. It is will not be need screw the screws into the printed circuit board to mount the heat dissipation fan, however, the length of the wedge is fixed and the heat sink shall be matched the height, that is, the heat sink may not be connected firmly onto semiconductor device in case of the height of the heat sink is too low and the heat sink can not be connected onto semiconductor device in case of the height of the heat sink is too high.
  • the present invention overcomes the above-mentioned disadvantages and drawbacks and provides a new mounting structure of fastening device for mounting the heat dissipation fan onto a plate of the computer case or mounting the heat dissipation fan onto a printed circuit board to connect a heat sink and a semiconductor device to the printed circuit board to cool the semiconductor device.
  • It is an object of the present invention to provide a heat dissipation device which comprising a fan and a mounting structure for mounting the heat dissipation fan onto a printed circuit board, wherein said a mounting structure comprising a support plate having an aperture to accommodate the fan and a pair of sleeve; and a fastening member comprising a head and a inserting end and an elastic member, and there are a pair of wedge protruded on the inserting end.
  • FIG. 1 shows an exploded view of mounting a heat dissipation device, a heat sink and a semiconductor device onto the printed circuit board.
  • FIG. 2 shows a assembled view of FIG. 1 .
  • FIG. 3 shows an exploded view of mounting a heat dissipation device onto a plate of computer case.
  • the present invention relates to a heat dissipation device 10 for readily mounting to a heat sink 30 and a semiconductor device 40 onto the printed circuit board 50 , said heat dissipation device 10 having a fastening member 20 , which comprising a head 21 and a inserting end 22 , and there are a pair of resilient wedge 221 protruded outwardly on the inserting end 22 .
  • the fastening member is incorporated with an elastic member. Wherein said elastic member at the preferable embodiment is a spring 23 .
  • the heat dissipation device 10 having a support plate 11 with an aperture 12 , which accommodated the fan 13 , and on the exterior of the support plate 11 in the opposite position having a pair of extensive downwardly sleeve 14 with a through hole 15 .
  • the spring 23 will be defined in the space within the head 21 and the sleeve 14 .
  • the fastening member 20 inserted through hole 15 and wedged against the hole 51 of the printed circuit board 50 .
  • the heat dissipation device 10 could be fastened onto the printed circuit board 50 . Furthermore, the height between support plate 11 of the mounting structure and the printed circuit board 50 will be adjusted due to the force of the spring 23 , so that the heat dissipation device 10 can accept a heat sink 30 with various height and given a good thermal contact property between the heat sink 30 and the semiconductor device 40 . Consequently, the present invention provides an efficient cooling performance to the heat dissipation device and a simple, easy and economic method to assemble this device.
  • the resilient wedge 221 will pass the through hole 15 of the sleeve 14 and the hole 61 of the plate 60 of computer case.
  • the resilient wedge 221 will be deformed inwardly by compressing force as it encountered the hole 61 , while resilient wedge 221 extended as it passed the hole 61 . Meanwhile, resilient wedge 221 will be lock on the edge of the hole 61 and, as a result, the heat dissipation device 10 could be fastened onto the plate 60 of computer case.
  • the opening 62 of the plate 60 of the computer case has nearly same diameter as the aperture 12 of support plate 11 .
  • the heat dissipation device may draw out the hot air, via the opening 62 , inside of the computer case generated by all electronic devices.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat dissipation device for a computer, more particularly relates to a heat dissipation device having a mounting structure for readily mounting a heat dissipation device onto a computer case or printed circuit board in order to draw out the heat generated by semiconductor devices of the computer, wherein the heat dissipation device may be mounted onto a plate of the computer case by fastening members and elastic members, in addition, the heat dissipation device may directly be mounted onto a printed circuit board and connected a heat sink and a semiconductor device to the printed circuit board for cooling the semiconductor device.

Description

The present invention relates to a heat dissipation device for a computer, more particularly relates to a heat dissipation device having a mounting structure for readily mounting a heat dissipation device onto computer case or printed circuit board in order to draw out the heat generated by semiconductor devices of the computer, wherein the heat dissipation device may be mounted onto a plate of the computer case by fastening members and elastic members, in addition, the heat dissipation device may directly be mounted onto a printed circuit board and connected a heat sink and a semiconductor device to the printed circuit board for cooling the semiconductor device.
PRIOR ART
It is commonly known in the art the method to mount a heat dissipation fan and heat sink onto the semiconductor device or the printed circuit board is secured a frame, which accommodates the heat sink and the semiconductor device, by screwing several screws into the printed circuit board. However, this mounting method should be screwing each screw one by one. This methods to mount heat dissipation devices to semiconductor devices shall connect the heat dissipation fan to the heat sink and connect the heat sink to the semiconductor device by using several fastening assembly, such as screws, thus, it is need more time and cost to mount the heat dissipation fan and heat sink onto the semiconductor devices.
Another method to mount a heat dissipation fan and heat sink onto the semiconductor device or the printed circuit board will be secured the heat sink onto a frame, which could be mounted on the base of semiconductor device, and then, mounted the heat dissipation fan onto the frame by locking wedges to orifices of the frame. It is will not be need screw the screws into the printed circuit board to mount the heat dissipation fan, however, the length of the wedge is fixed and the heat sink shall be matched the height, that is, the heat sink may not be connected firmly onto semiconductor device in case of the height of the heat sink is too low and the heat sink can not be connected onto semiconductor device in case of the height of the heat sink is too high.
SUMMARY OF THE PRESENT INVENTION
The present invention overcomes the above-mentioned disadvantages and drawbacks and provides a new mounting structure of fastening device for mounting the heat dissipation fan onto a plate of the computer case or mounting the heat dissipation fan onto a printed circuit board to connect a heat sink and a semiconductor device to the printed circuit board to cool the semiconductor device.
It is an object of the present invention to provide a heat dissipation device which comprising a fan and a mounting structure for mounting the heat dissipation fan onto a printed circuit board, wherein said a mounting structure comprising a support plate having an aperture to accommodate the fan and a pair of sleeve; and a fastening member comprising a head and a inserting end and an elastic member, and there are a pair of wedge protruded on the inserting end. As assembling, inserting the inserting end of the fastening member through holes of the printed circuit board, and wedges of the fastening member will be locked against the edge of holes of the printed circuit board. It is a simple, easy and economic method to assemble a heat dissipation device.
It is a further object of the present invention to provide a heat dissipation device which having a fastening member incorporated with an elastic member, as fastening the fastening member to the printed circuit board, the elastic member will adjust the height between support plate of the mounting structure and the printed circuit board so that the heat dissipation device can accept a heat sink with various height.
It is a further object of the present invention to provide a heat dissipation device which comprising a fan, a support plate and mounting structure for mounting the heat dissipation fan onto a plate of the case of a computer. Accordingly, this heat dissipation device will be mounted onto a plate with an opening has nearly same diameter as the aperture of support plate. The heat dissipation device may draw out the hot air inside of the computer case generated by all electronic devices.
Preferred embodiments of the present invention will be described as follows, referring to the drawing figures.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows an exploded view of mounting a heat dissipation device, a heat sink and a semiconductor device onto the printed circuit board.
FIG. 2 shows a assembled view of FIG. 1.
FIG. 3 shows an exploded view of mounting a heat dissipation device onto a plate of computer case.
DESCRIPTION OF THE PRESENT INVENTION
Referring now to FIGS. 1 and 2, the present invention relates to a heat dissipation device 10 for readily mounting to a heat sink 30 and a semiconductor device 40 onto the printed circuit board 50, said heat dissipation device 10 having a fastening member 20, which comprising a head 21 and a inserting end 22, and there are a pair of resilient wedge 221 protruded outwardly on the inserting end 22. The fastening member is incorporated with an elastic member. Wherein said elastic member at the preferable embodiment is a spring 23. Meanwhile, the heat dissipation device 10 having a support plate 11 with an aperture 12, which accommodated the fan 13, and on the exterior of the support plate 11 in the opposite position having a pair of extensive downwardly sleeve 14 with a through hole 15. The spring 23 will be defined in the space within the head 21 and the sleeve 14. The fastening member 20 inserted through hole 15 and wedged against the hole 51 of the printed circuit board 50.
During using the heat dissipation device 10, with reference to FIG. 2, placing the heat sink 30 over the semiconductor device 40, which had secured on the printed circuit board 50, then placing the heat dissipation device 10 over the heat sink 30, and aligning the sleeve 14 to the hole 51 of the printed circuit board 50. Inserting, with slight force, the inserting end 22 of fastening member 20 through the hole 51 of printed circuit board 50, the resilient wedge 221 will pass the through hole 15 of the sleeve 14 and the hole 51 of printed circuit board 50. The resilient wedge 221 will be deformed inwardly by compressing force as it encountered the hole 51, while resilient wedge 221 extended as it passed the hole 51. Meanwhile, resilient wedge 221 will be lock on the edge of the hole 51 and, as a result, the heat dissipation device 10 could be fastened onto the printed circuit board 50. Furthermore, the height between support plate 11 of the mounting structure and the printed circuit board 50 will be adjusted due to the force of the spring 23, so that the heat dissipation device 10 can accept a heat sink 30 with various height and given a good thermal contact property between the heat sink 30 and the semiconductor device 40. Consequently, the present invention provides an efficient cooling performance to the heat dissipation device and a simple, easy and economic method to assemble this device.
Referring now to FIG. 3, Inserting, with slight force, the inserting end 22 of fastening member 20 through the hole 61 of the plate 60 of computer case, the resilient wedge 221 will pass the through hole 15 of the sleeve 14 and the hole 61 of the plate 60 of computer case. The resilient wedge 221 will be deformed inwardly by compressing force as it encountered the hole 61, while resilient wedge 221 extended as it passed the hole 61. Meanwhile, resilient wedge 221 will be lock on the edge of the hole 61 and, as a result, the heat dissipation device 10 could be fastened onto the plate 60 of computer case. The opening 62 of the plate 60 of the computer case has nearly same diameter as the aperture 12 of support plate 11. The heat dissipation device may draw out the hot air, via the opening 62, inside of the computer case generated by all electronic devices.
It is to be understood that the embodiments described above are merely illustrative of some of the many specific embodiments of the invention, and that other arrangements can be devised by one of ordinary skill in art at the time the invention was made without departing from the scope of the invention.

Claims (5)

What the invention claimed is:
1. A heat dissipation device for a computer, comprising:
a fastening member, comprising a head and an inserting end, and a pair of resilient wedges protruded outwardly on the inserting end;
an elastic member; and
a support plate with an aperture, wherein said aperture accommodated a fan;
the elastic member is incorporated with the fastening member and located in a space between the head and a sleeve of the support plate.
2. A heat dissipation device according to claim 1, wherein on the exterior of said support plate in the opposite position having a pair of extensive downwardly sleeve with a through hole.
3. A heat dissipation device according to claim 1, wherein said elastic member is a spring.
4. A heat dissipation device according to claim 1, the heat dissipation device is placed on a heat sink over a semiconductor device and mounted onto the printed circuit board and is employed for cooling a heat sink over a semiconductor device.
5. A heat dissipation device according to claim 1, the heat dissipation device is mounted onto a plate of the computer case and is employed for drawing out hot air inside computer case.
US09/915,281 2001-07-27 2001-07-27 Heat dissipation device for a computer Expired - Fee Related US6498724B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/915,281 US6498724B1 (en) 2001-07-27 2001-07-27 Heat dissipation device for a computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/915,281 US6498724B1 (en) 2001-07-27 2001-07-27 Heat dissipation device for a computer

Publications (1)

Publication Number Publication Date
US6498724B1 true US6498724B1 (en) 2002-12-24

Family

ID=25435497

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/915,281 Expired - Fee Related US6498724B1 (en) 2001-07-27 2001-07-27 Heat dissipation device for a computer

Country Status (1)

Country Link
US (1) US6498724B1 (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US20050201064A1 (en) * 2004-03-10 2005-09-15 Hon Hai Precision Industry Co., Ltd. Locking device for heat dissipating device
US20060087818A1 (en) * 2004-10-23 2006-04-27 Foxconn Technology Co., Ltd. Heat sink fastening assembly
US20060118447A1 (en) * 2004-12-02 2006-06-08 Pei Chen Direct cooling pallet assembly for temperature stability for deep ion mill etch process
US20060117762A1 (en) * 2004-12-02 2006-06-08 Pei Chen Direct cooling pallet tray for temperature stability for deep ion mill etch process
US7064957B1 (en) * 2003-07-08 2006-06-20 Cisco Technology, Inc. Methods and apparatus for securing a heat sink to a circuit board component
US20060228237A1 (en) * 2004-10-19 2006-10-12 Winkler Wolfgang A Assembly used for cooling a circuit board or similar
US20080030952A1 (en) * 2006-08-02 2008-02-07 Delta Electronics, Inc. Heat dissipating module and its fan and housing
US20080055858A1 (en) * 2006-09-01 2008-03-06 Hon Hai Precision Industry Co., Ltd. Fastening element for heat dissipating apparatus
US20080062653A1 (en) * 2006-09-08 2008-03-13 Foxconn Technology Co., Ltd. Electronic device assembly with clips for mounting a heat sink thereon
US20080106869A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20080117598A1 (en) * 2006-11-17 2008-05-22 Compal Electronics, Inc. Thermal management module and electronic assembly using the same
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US20090002889A1 (en) * 2007-06-28 2009-01-01 Goitia Jorge A O-Ring free cooling pallet for hard disk drive slider carriers
US20090135552A1 (en) * 2007-11-28 2009-05-28 Cooler Master Co., Ltd. Heat dissipating device and heat sink fastener
US20090290306A1 (en) * 2008-05-26 2009-11-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly and electronic device having same
CN101212880B (en) * 2006-12-29 2010-04-14 富准精密工业(深圳)有限公司 Heat radiator
US20100097761A1 (en) * 2008-10-16 2010-04-22 Hon Hai Precision Industry Co., Ltd. Motherboard
US20100230150A1 (en) * 2009-03-16 2010-09-16 Hon Hai Precision Industry Co., Ltd. Motherboard
US20100252302A1 (en) * 2009-04-02 2010-10-07 Asustek Computer Inc. Circuit board for multi-type heat dissipating devices
US20120293100A1 (en) * 2011-05-16 2012-11-22 Minebea Co., Ltd. Driving control apparatus of brushless motor
US20130119764A1 (en) * 2011-11-11 2013-05-16 Inventec Corporation Modularized power control device
CN103123535A (en) * 2011-11-17 2013-05-29 英业达股份有限公司 Modularized power supply control device
US20130153268A1 (en) * 2011-12-20 2013-06-20 Hon Hai Precision Industry Co., Ltd. Fastening apparatus for heat sink
US20160290365A1 (en) * 2015-03-31 2016-10-06 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Fan and fan assembly
US10764990B1 (en) * 2019-04-23 2020-09-01 Adlink Technology Inc. Heat-dissipating module having an elastic mounting structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943210A (en) * 1997-05-24 1999-08-24 Hon Hai Precision Ind. Co., Ltd. Cooling device for central processing unit module
DE29914753U1 (en) * 1999-01-11 1999-12-23 Sunonwealth Electric Machine Industry Co., Ltd., Kaohsiung Heat dissipation device and fastening device therefor
US6282091B1 (en) * 1999-11-11 2001-08-28 Sunonwealth Electric Machine Industry Co. Ltd Mounting devices for a heat-generating element and a heat-dissipating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943210A (en) * 1997-05-24 1999-08-24 Hon Hai Precision Ind. Co., Ltd. Cooling device for central processing unit module
DE29914753U1 (en) * 1999-01-11 1999-12-23 Sunonwealth Electric Machine Industry Co., Ltd., Kaohsiung Heat dissipation device and fastening device therefor
US6282091B1 (en) * 1999-11-11 2001-08-28 Sunonwealth Electric Machine Industry Co. Ltd Mounting devices for a heat-generating element and a heat-dissipating device

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US7064957B1 (en) * 2003-07-08 2006-06-20 Cisco Technology, Inc. Methods and apparatus for securing a heat sink to a circuit board component
US20050201064A1 (en) * 2004-03-10 2005-09-15 Hon Hai Precision Industry Co., Ltd. Locking device for heat dissipating device
US7099156B2 (en) * 2004-03-10 2006-08-29 Hon Hai Precision Industry Co. Ltd. Locking device for heat dissipating device
US7390172B2 (en) 2004-10-19 2008-06-24 Ebm-Papst St. Georgen Gmbh & Co. Kg Assembly used for cooling a circuit board or similar
US20060228237A1 (en) * 2004-10-19 2006-10-12 Winkler Wolfgang A Assembly used for cooling a circuit board or similar
US7295439B2 (en) * 2004-10-23 2007-11-13 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink fastening assembly
US20060087818A1 (en) * 2004-10-23 2006-04-27 Foxconn Technology Co., Ltd. Heat sink fastening assembly
US20060118447A1 (en) * 2004-12-02 2006-06-08 Pei Chen Direct cooling pallet assembly for temperature stability for deep ion mill etch process
US7296420B2 (en) * 2004-12-02 2007-11-20 Hitachi Global Storage Technologies Amsterdam, B.V. Direct cooling pallet tray for temperature stability for deep ion mill etch process
US7481312B2 (en) 2004-12-02 2009-01-27 Hitachi Global Storage Technologies Netherlands B.V. Direct cooling pallet assembly for temperature stability for deep ion mill etch process
US20060117762A1 (en) * 2004-12-02 2006-06-08 Pei Chen Direct cooling pallet tray for temperature stability for deep ion mill etch process
US20080030952A1 (en) * 2006-08-02 2008-02-07 Delta Electronics, Inc. Heat dissipating module and its fan and housing
US7639502B2 (en) * 2006-09-01 2009-12-29 Hon Hai Precision Industry Co., Ltd. Fastening element for heat dissipating apparatus
US20080055858A1 (en) * 2006-09-01 2008-03-06 Hon Hai Precision Industry Co., Ltd. Fastening element for heat dissipating apparatus
US7430122B2 (en) * 2006-09-08 2008-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Electronic device assembly with clips for mounting a heat sink thereon
US20080062653A1 (en) * 2006-09-08 2008-03-13 Foxconn Technology Co., Ltd. Electronic device assembly with clips for mounting a heat sink thereon
US20080106869A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device
US7480144B2 (en) * 2006-11-03 2009-01-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080117598A1 (en) * 2006-11-17 2008-05-22 Compal Electronics, Inc. Thermal management module and electronic assembly using the same
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US8210241B2 (en) * 2006-12-28 2012-07-03 Nidec Corporation Heat sink fan
CN101212880B (en) * 2006-12-29 2010-04-14 富准精密工业(深圳)有限公司 Heat radiator
US20090002889A1 (en) * 2007-06-28 2009-01-01 Goitia Jorge A O-Ring free cooling pallet for hard disk drive slider carriers
US8096539B2 (en) * 2007-06-28 2012-01-17 Hitachi Global Storage Technologies, Netherlands, B.V. O-ring free cooling pallet for hard disk drive slider carriers
US20090135552A1 (en) * 2007-11-28 2009-05-28 Cooler Master Co., Ltd. Heat dissipating device and heat sink fastener
US7729123B2 (en) * 2008-05-26 2010-06-01 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly and electronic device having same
US20090290306A1 (en) * 2008-05-26 2009-11-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly and electronic device having same
US20100097761A1 (en) * 2008-10-16 2010-04-22 Hon Hai Precision Industry Co., Ltd. Motherboard
US20100230150A1 (en) * 2009-03-16 2010-09-16 Hon Hai Precision Industry Co., Ltd. Motherboard
US20100252302A1 (en) * 2009-04-02 2010-10-07 Asustek Computer Inc. Circuit board for multi-type heat dissipating devices
US20120293100A1 (en) * 2011-05-16 2012-11-22 Minebea Co., Ltd. Driving control apparatus of brushless motor
US8547052B2 (en) * 2011-05-16 2013-10-01 Minebea Co., Ltd. Driving control apparatus of brushless motor
US20130119764A1 (en) * 2011-11-11 2013-05-16 Inventec Corporation Modularized power control device
CN103123535A (en) * 2011-11-17 2013-05-29 英业达股份有限公司 Modularized power supply control device
US20130153268A1 (en) * 2011-12-20 2013-06-20 Hon Hai Precision Industry Co., Ltd. Fastening apparatus for heat sink
US20160290365A1 (en) * 2015-03-31 2016-10-06 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Fan and fan assembly
US10764990B1 (en) * 2019-04-23 2020-09-01 Adlink Technology Inc. Heat-dissipating module having an elastic mounting structure

Similar Documents

Publication Publication Date Title
US6498724B1 (en) Heat dissipation device for a computer
US5966289A (en) Electronic device securement system
US7480144B2 (en) Heat dissipation device
US7262969B2 (en) Heat sink clip assembly
US7430122B2 (en) Electronic device assembly with clips for mounting a heat sink thereon
US7342795B2 (en) Heat sink assembly
US7310229B2 (en) Heat dissipating device
US7349218B2 (en) Locking device for a heat sink
US7723844B2 (en) Heat dissipation device having a locking device
US6822869B2 (en) Fastening device
JP3894070B2 (en) Heat sink, heat sink device, fixing method of heat sink, and electronic device using the heat sink
US6153932A (en) Fix base of integrated circuit chipset and heat sink
KR20030071118A (en) Heat sink device for cooling chipset
US7564687B2 (en) Heat dissipation device having a fixing base
US7606028B2 (en) Heat dissipation device having a fan holder for attachment of a fan
US6603665B1 (en) Heat dissipating assembly with thermal plates
US7637310B2 (en) Heat dissipation device with fixtures for attachment of a fan
US20080050196A1 (en) Fastener assembly for attaching a heat dissipating device to an electronic device
US5999402A (en) Heat sink fastener retention apparatus and method for computer systems
US6950310B2 (en) System and method for self-leveling heat sink for multiple height devices
US6434004B1 (en) Heat sink assembly
US20040109301A1 (en) Cooling device for an integrated circuit
US6419008B1 (en) CPU cooling device with a mounting mechanism
US7142428B2 (en) Locking heatsink apparatus
US7950446B2 (en) Heat dissipation device with clip for mounting a fan to a heat sink thereof

Legal Events

Date Code Title Description
REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20061224