US6090664A - Method for making a stacked DRAM capacitor - Google Patents

Method for making a stacked DRAM capacitor Download PDF

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US6090664A
US6090664A US09/121,021 US12102198A US6090664A US 6090664 A US6090664 A US 6090664A US 12102198 A US12102198 A US 12102198A US 6090664 A US6090664 A US 6090664A
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layer
forming
amorphous silicon
hto
over
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US09/121,021
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Chine-Gie Lou
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Worldwide Semiconductor Manufacturing Corp
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Assigned to WORLDWIDE SEMICONDUCTOR MANUFACTURING CORPORATION reassignment WORLDWIDE SEMICONDUCTOR MANUFACTURING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LOU, CHINE-GIE
Priority to TW087113264A priority patent/TW385543B/en
Priority to CN98118802A priority patent/CN1110851C/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/01—Manufacture or treatment
    • H10D1/041—Manufacture or treatment of capacitors having no potential barriers
    • H10D1/042—Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/714—Electrodes having non-planar surfaces, e.g. formed by texturisation having horizontal extensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/712—Electrodes having non-planar surfaces, e.g. formed by texturisation being rough surfaces, e.g. using hemispherical grains
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides

Definitions

  • This invention relates to semiconductor memories, and more particularly, to an improved method for making a DRAM capacitor.
  • the present invention is directed to such an improved capacitor.
  • a method of forming a capacitor for a DRAM memory cell comprises the steps of: forming an interlayer dielectric; forming a first nitride layer over said interlayer dielectric layer; forming a high temperature oxide (HTO) layer over said first nitride layer; forming a second nitride layer over said HTO layer; forming a contact hole in said first and second nitride layer, said HTO layer, and said interlayer dielectric; forming an in-situ doped amorphous silicon layer in said contact hole and over said second nitride layer; patterning and etching said amorphous silicon layer to leave an amorphous silicon segment in over said contact hole; removing said second nitride layer; forming a hemispherical grain (HSG) polysilicon layer on said amorphous silicon segment; removing said HTO layer; forming a dielectric layer over said HSG polysilicon layer and said amorphous silicon segment; and forming a
  • FIGS. 1-6 are cross-sectional views of a semiconductor substrate illustrating the steps of the present invention for forming a capacitor.
  • interlayer dielectric (ILD) 105 is typically formed from combination layers of silicon dioxide, tetraethylorthosilicate (TEOS) oxide, or BPSG layers and serves as insulation and planarization.
  • TEOS tetraethylorthosilicate
  • BPSG tetraethylorthosilicate
  • the ILD 105 is a sandwich of TEOS oxide, BPSG, and TEOS oxide.
  • a first nitride layer 107 preferably Si 3 N 4 , is deposited over the ILD 105.
  • the first nitride layer 107 is formed using CVD techniques and to a thickness of 500-1500 angstroms.
  • a high temperature oxide (HTO) layer 109 is formed over the first nitride layer 107.
  • the purpose of the HTO layer 109 is to act as a barrier layer during a wet etching step and provide a larger process window during the HSG polysilicon forming step.
  • the HTO layer 109 is formed using CVD techniques and to a thickness of 500-1500 angstroms.
  • a second nitride layer 111 is deposited over the HTO layer 109.
  • the second nitride layer 111 is formed using CVD techniques and to a thickness of 500-1500 angstroms.
  • a contact hole 113 is opened in the second nitride layer 111, the HTO layer 109, the first nitride layer 107, and the ILD 105 by conventional patterning and etching techniques.
  • a layer of in-situ doped amorphous silicon 117 is then formed using conventional CVD techniques to a thickness of 3000-8000 angstroms.
  • silane and phosphane may be used as the reactant gas.
  • a deposition temperature of the in-situ doped amorphous silicon is preferably between 500° and 530° C.
  • the amorphous silicon layer 117 is deposited into the contact hole 113 and over the top of the second nitride layer 111. Then, the amorphous silicon layer 117 is patterned and etched to leave a section of amorphous silicon over and in the contact hole 113.
  • a wet dip nitride etch of the second nitride layer 111 is performed. This can preferably be performed using a hot H 3 PO 4 solution. Note that the HTO layer 109 is used as an etching barrier layer.
  • HSG hemispherical grain
  • the HSG polysilicon is formed using a seeding and high vacuum technique. In summary, silane (SiH 4 ) or disilane (Si 2 H 6 ) is used to seed the surface of the amorphous silicon. Next, the HSG polysilicon is formed in a high vacuum.
  • the advantage of this preferred method is to only form the HSG polysilicon on the surface of the amorphous silicon.
  • the purpose of the HTO layer 109 is to provide a larger process window during the HSG polysilicon forming step.
  • the resulting structure is shown in FIG. 4.
  • the HTO layer 109 is removed using a wet dip oxide etch.
  • a buffered oxide etch or a dilute HF solution is used for the etching step.
  • the first nitride layer 107 is used as a barrier layer during the wet dip oxide etch.
  • the bottom storage node of the capacitor is thus formed.
  • the bottom storage node is preferably of circular shape. However, the bottom storage node may be of any arbitrary shape.
  • any conventional capacitor dielectric 121 (such as oxide/nitride/oxide) is deposited and a final top layer of in-situ doped polysilicon 123 is deposited.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A method of forming a capacitor for a stacked DRAM memory cell. A contact hole is formed in a dielectric stack of an interlayer dielectric, a first nitride layer, a high temperature oxide (HTO) layer, and a second nitride layer. An in-situ doped amorphous silicon segment is formed in and over the contact hole. The second nitride layer is removed and then a hemispherical grain (HSG) polysilicon layer is formed over the amorphous silicon segment. The HTO layer is removed and a capacitor dielectric layer is formed over the HSG polysilicon layer. Finally, a top conductive layer is formed over the capacitor dielectric layer.

Description

TECHNICAL FIELD OF THE INVENTION
This invention relates to semiconductor memories, and more particularly, to an improved method for making a DRAM capacitor.
BACKGROUND OF THE INVENTION
It has been a recent trend in dynamic random access memory (DRAM) to increase the density of DRAM integrated circuits. However, as higher density DRAM cells are developed, the area available for capacitors that are used in the DRAM cells decreases. In order to decrease the area of capacitors while maintaining reliability standards, it is important to be able to maintain the capacitance of each capacitor while decreasing its area. Recently, capacitors having a three-dimensional structure have been suggested to increase cell capacitance. Such capacitors include, for example, double-stacked, fin-structured, cylindrical, spread-stacked, and box structured capacitors.
There is also a challenge to develop methods of manufacturing these capacitors that minimize the manufacturing costs and provide maximum process tolerance to maximize product yields. The present invention is directed to such an improved capacitor.
SUMMARY OF THE INVENTION
A method of forming a capacitor for a DRAM memory cell is disclosed. The method comprises the steps of: forming an interlayer dielectric; forming a first nitride layer over said interlayer dielectric layer; forming a high temperature oxide (HTO) layer over said first nitride layer; forming a second nitride layer over said HTO layer; forming a contact hole in said first and second nitride layer, said HTO layer, and said interlayer dielectric; forming an in-situ doped amorphous silicon layer in said contact hole and over said second nitride layer; patterning and etching said amorphous silicon layer to leave an amorphous silicon segment in over said contact hole; removing said second nitride layer; forming a hemispherical grain (HSG) polysilicon layer on said amorphous silicon segment; removing said HTO layer; forming a dielectric layer over said HSG polysilicon layer and said amorphous silicon segment; and forming a top conductive layer over said dielectric layer.
BRIEF DESCRIPTION OF THE DRAWINGS
The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
FIGS. 1-6 are cross-sectional views of a semiconductor substrate illustrating the steps of the present invention for forming a capacitor.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The present invention will be described in detail with reference to the accompanying drawings. The present invention provides a method of forming a DRAM capacitor.
Turning to FIG. 1, using conventional techniques, a semiconductor substrate 101 having formed thereon an access transistor 103 is shown. Formed atop the access transistor 103 is an interlayer dielectric (ILD) 105. The interlayer dielectric 105 is typically formed from combination layers of silicon dioxide, tetraethylorthosilicate (TEOS) oxide, or BPSG layers and serves as insulation and planarization. In the preferred embodiment, the ILD 105 is a sandwich of TEOS oxide, BPSG, and TEOS oxide.
Then, a first nitride layer 107, preferably Si3 N4, is deposited over the ILD 105. Preferably, the first nitride layer 107 is formed using CVD techniques and to a thickness of 500-1500 angstroms. Next, a high temperature oxide (HTO) layer 109 is formed over the first nitride layer 107. As will be seen below, the purpose of the HTO layer 109 is to act as a barrier layer during a wet etching step and provide a larger process window during the HSG polysilicon forming step. Preferably, the HTO layer 109 is formed using CVD techniques and to a thickness of 500-1500 angstroms. Next, a second nitride layer 111, preferably Si3 N4, is deposited over the HTO layer 109. Preferably, the second nitride layer 111 is formed using CVD techniques and to a thickness of 500-1500 angstroms.
Turning to FIG. 2, a contact hole 113 is opened in the second nitride layer 111, the HTO layer 109, the first nitride layer 107, and the ILD 105 by conventional patterning and etching techniques.
Next, turning to FIG. 3, a layer of in-situ doped amorphous silicon 117 is then formed using conventional CVD techniques to a thickness of 3000-8000 angstroms. For example, silane and phosphane may be used as the reactant gas. A deposition temperature of the in-situ doped amorphous silicon is preferably between 500° and 530° C. The amorphous silicon layer 117 is deposited into the contact hole 113 and over the top of the second nitride layer 111. Then, the amorphous silicon layer 117 is patterned and etched to leave a section of amorphous silicon over and in the contact hole 113.
Next, turning to FIG. 4, a wet dip nitride etch of the second nitride layer 111 is performed. This can preferably be performed using a hot H3 PO4 solution. Note that the HTO layer 109 is used as an etching barrier layer. After the wet dip nitride etch, hemispherical grain (HSG) polysilicon 119 is formed over the amorphous silicon layer 117. In the preferred embodiment, the HSG polysilicon is formed using a seeding and high vacuum technique. In summary, silane (SiH4) or disilane (Si2 H6) is used to seed the surface of the amorphous silicon. Next, the HSG polysilicon is formed in a high vacuum. The advantage of this preferred method is to only form the HSG polysilicon on the surface of the amorphous silicon. The purpose of the HTO layer 109 is to provide a larger process window during the HSG polysilicon forming step. The resulting structure is shown in FIG. 4.
Turning to FIG. 5, the HTO layer 109 is removed using a wet dip oxide etch. Preferably, a buffered oxide etch or a dilute HF solution is used for the etching step. The first nitride layer 107 is used as a barrier layer during the wet dip oxide etch. The bottom storage node of the capacitor is thus formed. Further, although shown only in cross section, it can be appreciated by those skilled in the art that the bottom storage node is preferably of circular shape. However, the bottom storage node may be of any arbitrary shape.
Finally, to complete the capacitor, turning to FIG. 6, any conventional capacitor dielectric 121 (such as oxide/nitride/oxide) is deposited and a final top layer of in-situ doped polysilicon 123 is deposited.
While the preferred embodiment of the invention has been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.

Claims (10)

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:
1. A method of forming a capacitor for a DRAM memory cell, the method comprising the steps of:
forming an interlayer dielectric;
forming a first nitride layer over said interlayer dielectric layer;
forming a high temperature oxide (HTO) layer over said first nitride layer;
forming a second nitride layer over said HTO layer;
forming a contact hole in said first and second nitride layer, said HTO layer, and said interlayer dielectric;
forming an in-situ doped amorphous silicon layer in said contact hole and over said second nitride layer;
patterning and etching said amorphous silicon layer to leave an amorphous silicon segment in over said contact hole;
removing said second nitride layer;
forming a hemispherical grain (HSG) polysilicon layer on said amorphous silicon segment;
removing said HTO layer;
forming a dielectric layer over said HSG polysilicon layer and said amorphous silicon segment; and
forming a top conductive layer over said dielectric layer.
2. The method of claim 1 wherein said dielectric layer is ONO.
3. The method of claim 1 wherein said amorphous silicon layer has a thickness of between 3000-8000 angstroms.
4. The method of claim 1 wherein said HTO layer has a thickness of between 500-1500 angstroms.
5. The method of claim 1 wherein said first nitride layer is formed from Si3 N4 and is between 500-1500 angstroms thick.
6. A method of making a bottom storage node of a capacitor, the method comprising the steps of:
forming a first nitride layer;
forming a high temperature oxide (HTO) layer over said first nitride layer;
forming a second nitride layer over said HTO layer;
forming a contact hole in said first and second nitride layer and said HTO layer;
forming an in-situ doped amorphous silicon layer in said contact hole and over said second nitride layer;
patterning and etching said amorphous silicon layer to leave an amorphous silicon segment in over said contact hole;
removing said second nitride layer;
forming a hemispherical grain (HSG) polysilicon layer on said amorphous silicon segment; and
removing said HTO layer.
7. The method of claim 6 wherein said dielectric layer is ONO.
8. The method of claim 6 wherein said amorphous silicon layer has a thickness of between 3000-8000 angstroms.
9. The method of claim 6 wherein said HTO layer has a thickness of between 500-1500 angstroms.
10. The method of claim 6 wherein said first nitride layer is formed from Si3 N4 and is between 500-1500 angstroms thick.
US09/121,021 1998-07-22 1998-07-22 Method for making a stacked DRAM capacitor Expired - Lifetime US6090664A (en)

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US09/121,021 US6090664A (en) 1998-07-22 1998-07-22 Method for making a stacked DRAM capacitor
TW087113264A TW385543B (en) 1998-07-22 1998-08-12 Method for manufacturing stacked DRAM capacitor
CN98118802A CN1110851C (en) 1998-07-22 1998-08-28 Method for manufacturing capacitor of stacked dynamic random access memory

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US09/121,021 US6090664A (en) 1998-07-22 1998-07-22 Method for making a stacked DRAM capacitor
CN98118802A CN1110851C (en) 1998-07-22 1998-08-28 Method for manufacturing capacitor of stacked dynamic random access memory

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6236080B1 (en) * 1999-07-22 2001-05-22 Worldwide Semiconductor Manufacturing Corp. Method of manufacturing a capacitor for high density DRAMs
US6759294B2 (en) 2002-11-06 2004-07-06 Hynix Semiconductor Inc. Method of forming a capacitor in a semiconductor device
US20070155071A1 (en) * 2005-10-07 2007-07-05 Chan Winston K Method of reducing edge height at the overlap of a layer deposited on a stepped substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100339953C (en) * 2003-02-24 2007-09-26 友达光电股份有限公司 Method for forming contact hole

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5858838A (en) * 1998-02-23 1999-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Method for increasing DRAM capacitance via use of a roughened surface bottom capacitor plate
US5874336A (en) * 1997-06-23 1999-02-23 Vanguard International Semiconductor Manufacturing Method to improve yield for capacitors formed using etchback of polysilicon hemispherical grains

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874336A (en) * 1997-06-23 1999-02-23 Vanguard International Semiconductor Manufacturing Method to improve yield for capacitors formed using etchback of polysilicon hemispherical grains
US5858838A (en) * 1998-02-23 1999-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Method for increasing DRAM capacitance via use of a roughened surface bottom capacitor plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6236080B1 (en) * 1999-07-22 2001-05-22 Worldwide Semiconductor Manufacturing Corp. Method of manufacturing a capacitor for high density DRAMs
US6759294B2 (en) 2002-11-06 2004-07-06 Hynix Semiconductor Inc. Method of forming a capacitor in a semiconductor device
US20070155071A1 (en) * 2005-10-07 2007-07-05 Chan Winston K Method of reducing edge height at the overlap of a layer deposited on a stepped substrate

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CN1242600A (en) 2000-01-26
CN1110851C (en) 2003-06-04

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