US58516A - Improvement in engraving copper, sgc - Google Patents
Improvement in engraving copper, sgc Download PDFInfo
- Publication number
- US58516A US58516A US58516DA US58516A US 58516 A US58516 A US 58516A US 58516D A US58516D A US 58516DA US 58516 A US58516 A US 58516A
- Authority
- US
- United States
- Prior art keywords
- improvement
- sgc
- copper
- plate
- white
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 10
- 229910052802 copper Inorganic materials 0.000 title description 10
- 239000010949 copper Substances 0.000 title description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- 229910000004 White lead Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L Barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 241000779819 Syncarpia glomulifera Species 0.000 description 2
- 229940036248 Turpentine Drugs 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000001739 pinus spp. Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Heat Sensitive Colour Forming Recording (AREA)
Description
IINITEDSTATES PATENT OFFIoE.
VICTORIA QUARRE WEDEKIND, OF PHILADELPHIA, PENNSYLVANIA.
IMPROVEMENT IN ENGRAVING COPPER, 80C.
Specification forming part of Letters Patent No. 58,516, dated October 2, 1866.
To all whom it may concern.-
Be it known that I, VICTORIA QUARRE WEDEKIND, of the city of Philadelphia and State of Pennsylvania, have invented a new and Improved Method of Producing Copper or other Metal Plates engraved in relief, with- I take German white lead, or fine white lead,
finely sifted, and grind in water, and take the finest clear glue, dissolve it in water, and
when moderately warm I mix carefully a small part of it with the German enamel white. I use for this operation a fine camels-hair brush, and whiten the entire surface of the lightlyheated copper plate by passing with a camelshair brush from right to left and from top to bottom till I bring about a perfectly even and' smooth surface. The artist or draftsman can make his design on paper and burnish it by the ordinary process, the lead-pencil marks of his picture upon the white surface of the plate, or it would be better and quicker for him, with ordinary engravers tools, to trace his design upon the plate, taking care not to cut into the copper, because all parts of the plate he uncovers of its white surface will produce the relief of his picture, while the entire surface remaining covered with white will scoop away between the lines forming the picture.
What remains to be done is merely the work of an ordinary copper-plate engraver. Take the ordinary varnish of plate-engravers, cover the entire surface of the plate with it, and keep the plate moderately warm. The varnish being dry, line the borders with wax and pour asmuch nitric acid at five degrees as your basin will allow. In a short time that part of the varnished surface where white and varnish are combined will break oif in small parcels. Stir continually and lightly with a brush till the whole will be removed, then empty your basin and let it dry a few minutes, then pour in nitric acid at ten degrees, taking care to remove the globules as soon as formed, and continue to renew the acid at ten degrees till you bring about the required deepness, and the minute details of the design will stand in bold relief.
Wash the plate with turpentine, and if in some places of the design, by inexperience ot' the draftsman, a large amount of space and deepness is required, such places can be easily deepened with engraver-s tools.
Finally, print any number by the ordinary printing-press.
Having thus described my improvement, what I claim as my invention, and desire to secure by Letters Patent, is-
.nish, and treating it with nitric acid, substantially as above described.
VICTORIA QUARRE WEDEKIN D.
Witnesses:
' Gno. BUoKLnY, H. A. KIMBALL.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US58516A true US58516A (en) | 1866-10-02 |
Family
ID=2128056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US58516D Expired - Lifetime US58516A (en) | Improvement in engraving copper, sgc |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US58516A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2485926A (en) * | 1945-02-20 | 1949-10-25 | Radio Electr Soc Fr | Sealed demountable joint for vacuum tubes |
-
0
- US US58516D patent/US58516A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2485926A (en) * | 1945-02-20 | 1949-10-25 | Radio Electr Soc Fr | Sealed demountable joint for vacuum tubes |
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