US5486681A - Device for heating up electronic boards - Google Patents
Device for heating up electronic boards Download PDFInfo
- Publication number
- US5486681A US5486681A US08/256,166 US25616694A US5486681A US 5486681 A US5486681 A US 5486681A US 25616694 A US25616694 A US 25616694A US 5486681 A US5486681 A US 5486681A
- Authority
- US
- United States
- Prior art keywords
- board
- electronic boards
- convection
- walls
- vents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to a device for heating up electronic boards arranged in board-guides and between which a circulation of air is possible.
- these electronic boards may be intended to operate inside electronic cabinets, computers or various other hardware.
- This hardware may be used in certain cases in harsh climatic environments and in particular at very low temperatures, possibly down to -55° to 60° C. Many components, and in particular the so-called non civilian components, do not operate or operate poorly at such temperatures. It is therefore necessary to raise their temperature to a value sufficient to allow the rapid start-up and correct operation of the electronic boards.
- the purpose of the present invention is to allow the heating up of standard electronic boards using conventional components without any modification.
- a subject of the invention is therefore a device for heating up electronic boards which is simple by virtue of a suitable layout of the board-support and mounting assemblies.
- a device for heating up electronic boards mounted between opposing board-guide walls containing parallel guidance grooves and a back allowing for the interconnections said device being characterized in that a heating element is arranged on at least one of the board-guide walls, on the opposite face to the grooves, in that convection means are associated with the heating element and in that said board-guide walls contain vents arranged between the grooves so as to allow for the circulation of the heated air between the electronic boards.
- the device applies to any type of board without modification to the latter.
- heat-up is all the more effective since it is undertaken from both sides of each board, thus enabling the components to be heated through the body and through the tabs, independently of the direction of mounting.
- FIG. 1 is a perspective view of an embodiment of the device according to the invention.
- FIG. 2 is a basic diagram of the device under natural convection
- FIGS. 3 and 4 show a basic diagram of the device under forced convection
- FIG. 5 illustrates one part of a variant of the device according to the invention.
- FIG. 1 shows in perspective an assembly for mounting electronic boards, which is modified so as to constitute the heating-up device according to the invention.
- the term "electronic board” is understood as any type of board carrying a certain number of electronic components connected together to form a circuit, for example a printed-circuit board, whatever the dimensions, thickness, component technologies and constructional technologies and whatever the constituent substance of the board (glass epoxy, composite epoxy, polyamide ceramic, etc.).
- the electronic boards 8 are fitted for mounting and retention into guidance grooves 6 of opposing board-guide walls 2. These walls are connected to a back 4, motherboard or backplane, furnished with connectors 5 for receiving the corresponding male connectors of the boards. This back 4 is provided so as to allow for the necessary interconnections.
- a heating element 1 on the board-guide walls 2 on the face away from the grooves.
- This element can be a resistive film or support or else a device for circulating heat-carrying fluid or a Peltier-effect device or any other known means of heating.
- This heating element 1 can be fixed to the wall 2 by any means, such as cementing, riveting, retention by screws or by bearing plate, etc.
- the board-guide wall is made from a metallic material or one which is a good conductor of heat.
- a convection means such as fins 3 made from metal (for example aluminium) or any other material which is a good thermal conductor is associated with the heating element 1. Vents 7 allowing passage of the air heated by the fins 3 are drilled in the wall 2, between the grooves 6, between the element 1 with the fins 3 and the back 4.
- the heated air can circulate between the boards 8 inserted into the grooves 6 and heat up the components which they carry.
- the heating element 1 and the fins 3 could be arranged differently on the board-guide wall 2, for example in any position between the back 4 and that side of the wall 2 away from this back.
- the vents could be distributed on either side of the fins 3.
- the heating-up device provides for the heating-up of the components in various possible heat exchange modes:
- FIGS. 3 and 4 represent two possible different positions.
- the thermal power of the heating element, the surface area of the fins and their number and position, and the cross-section of the vents are determined on the basis of the boards and components used, of the low initial temperature, of the desired start-up time from the low temperature, of the volume and overall heat capacity of the cabinet.
- FIG. 5 represents partially a variant of the device according to the invention, more particularly adapted to the case of forced convection.
- the heating element I is arranged on a support 10 rather than directly on the board-guide wall 2.
- the support 10 should be such that the fins 3 associated with the heating element 1 lie within the forced circulation current of air to the vents and boards.
- These fins 3 can be used alone or else another set of fins 3' can be provided, as in FIG. 5, fixed to the board-guide wall 2 and interposed between the fins 3 so as to improve heat exchange to the wall 2 and, by conduction, to the boards 8 and their possible heat sinks.
- the heating-up device is set going and stopped with the aid of any thermal regulation circuit on the basis of the temperature required for correct operation of the components.
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9212950 | 1992-10-29 | ||
FR9212950A FR2697717B1 (en) | 1992-10-29 | 1992-10-29 | Heating device for electronic cards. |
PCT/FR1993/001075 WO2004075614A1 (en) | 1992-10-29 | 1993-10-29 | Device for heating circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
US5486681A true US5486681A (en) | 1996-01-23 |
Family
ID=9434987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/256,166 Expired - Lifetime US5486681A (en) | 1992-10-29 | 1993-10-29 | Device for heating up electronic boards |
Country Status (5)
Country | Link |
---|---|
US (1) | US5486681A (en) |
EP (1) | EP0599678B1 (en) |
DE (1) | DE69302561T2 (en) |
FR (1) | FR2697717B1 (en) |
WO (1) | WO2004075614A1 (en) |
Cited By (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5859409A (en) * | 1996-09-16 | 1999-01-12 | Samsung Electronics Co., Ltd. | Oven for testing peripheral storage devices |
US6049061A (en) * | 1997-10-21 | 2000-04-11 | Lucent Technologies Inc. | Heater for use in a mobile radio base station |
US6097001A (en) * | 1997-06-30 | 2000-08-01 | Alcatel | Portable heating tent and method for testing telecommunications equipment |
US6318688B1 (en) * | 1999-06-08 | 2001-11-20 | Hon Hai Precision Ind. Co., Ltd. | Bracket |
US6493224B1 (en) * | 2000-08-08 | 2002-12-10 | Lucent Technologies Inc. | Method and apparatus to increase convection heat transfer in an electrical system and a method of manufacturing the same |
US6639795B1 (en) * | 2002-02-15 | 2003-10-28 | Steve Cooper | Flow through butterfly backpane |
US20050269308A1 (en) * | 2004-06-02 | 2005-12-08 | Emc Corporation | Ergonomic, rotatable electronic component testing apparatus |
US20090153994A1 (en) * | 2007-12-18 | 2009-06-18 | Teradyne, Inc. | Disk Drive Transport, Clamping and Testing |
US20090153992A1 (en) * | 2007-12-18 | 2009-06-18 | Teradyne, Inc. | Disk Drive Testing |
US20090153993A1 (en) * | 2007-12-18 | 2009-06-18 | Teradyne, Inc. | Disk Drive Testing |
US20090265136A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Disk Drive Emulator And Method Of Use Thereof |
US20090262455A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US20090262454A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US20090265032A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Transferring Storage Devices Within Storage Device Testing Systems |
US20090262444A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Transferring Disk Drives Within Disk Drive Testing Systems |
US20090262445A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Bulk Feeding Disk Drives to Disk Drive Testing Systems |
US20090261229A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Vibration Isolation Within Disk Drive Testing Systems |
US20090261047A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Enclosed Operating Area For Disk Drive Testing Systems |
US20090261228A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US20090297328A1 (en) * | 2008-06-03 | 2009-12-03 | Teradyne, Inc. | Processing Storage Devices |
US7778031B1 (en) | 2009-07-15 | 2010-08-17 | Teradyne, Inc. | Test slot cooling system for a storage device testing system |
US20110011844A1 (en) * | 2009-07-15 | 2011-01-20 | Teradyne, Inc., A Massachusetts Corporation | Conductive heating |
US20110012632A1 (en) * | 2009-07-15 | 2011-01-20 | Merrow Brian S | Conductive Heating |
US7904211B2 (en) | 2008-04-17 | 2011-03-08 | Teradyne, Inc. | Dependent temperature control within disk drive testing systems |
US7929303B1 (en) | 2010-02-02 | 2011-04-19 | Teradyne, Inc. | Storage device testing system cooling |
US7940529B2 (en) | 2009-07-15 | 2011-05-10 | Teradyne, Inc. | Storage device temperature sensing |
US20110123301A1 (en) * | 2008-04-17 | 2011-05-26 | Scott Noble | Bulk feeding storage devices to storage device testing systems |
US8116079B2 (en) | 2009-07-15 | 2012-02-14 | Teradyne, Inc. | Storage device testing system cooling |
US20120312345A1 (en) * | 2011-06-10 | 2012-12-13 | Perpetua Power Source Technologies, Inc. | System and method for thermal protection of an electronics module of an energy harvester |
US8628239B2 (en) | 2009-07-15 | 2014-01-14 | Teradyne, Inc. | Storage device temperature sensing |
US8687349B2 (en) | 2010-07-21 | 2014-04-01 | Teradyne, Inc. | Bulk transfer of storage devices using manual loading |
US9001456B2 (en) | 2010-08-31 | 2015-04-07 | Teradyne, Inc. | Engaging test slots |
US9459312B2 (en) | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
US9779780B2 (en) | 2010-06-17 | 2017-10-03 | Teradyne, Inc. | Damping vibrations within storage device testing systems |
US10725091B2 (en) | 2017-08-28 | 2020-07-28 | Teradyne, Inc. | Automated test system having multiple stages |
US10775408B2 (en) | 2018-08-20 | 2020-09-15 | Teradyne, Inc. | System for testing devices inside of carriers |
US10845410B2 (en) | 2017-08-28 | 2020-11-24 | Teradyne, Inc. | Automated test system having orthogonal robots |
US10948534B2 (en) | 2017-08-28 | 2021-03-16 | Teradyne, Inc. | Automated test system employing robotics |
US10983145B2 (en) | 2018-04-24 | 2021-04-20 | Teradyne, Inc. | System for testing devices inside of carriers |
CN113543580A (en) * | 2020-04-15 | 2021-10-22 | 百度(美国)有限责任公司 | Compact thermal control plate |
US11224098B2 (en) * | 2018-11-01 | 2022-01-11 | General Electric Company | Systems and methods for passive heating of temperature-sensitive electronic components |
US11226390B2 (en) | 2017-08-28 | 2022-01-18 | Teradyne, Inc. | Calibration process for an automated test system |
US11382178B2 (en) * | 2019-06-27 | 2022-07-05 | General Electric Company | System and method for heating an electrical bus in an electrical cabinet for cold startup and condensation/frost control |
US11754622B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Thermal control system for an automated test system |
US11754596B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Test site configuration in an automated test system |
US11867749B2 (en) | 2020-10-22 | 2024-01-09 | Teradyne, Inc. | Vision system for an automated test system |
US11899042B2 (en) | 2020-10-22 | 2024-02-13 | Teradyne, Inc. | Automated test system |
US11953519B2 (en) | 2020-10-22 | 2024-04-09 | Teradyne, Inc. | Modular automated test system |
US12007411B2 (en) | 2021-06-22 | 2024-06-11 | Teradyne, Inc. | Test socket having an automated lid |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1196620A (en) * | 1967-12-01 | 1970-07-01 | Smiths Industries Ltd | Improvements in or relating to Electric Heating Assemblies |
EP0059410A2 (en) * | 1981-02-28 | 1982-09-08 | BROWN, BOVERI & CIE Aktiengesellschaft Mannheim | Casing to house electric and/or electronic elements |
US4374316A (en) * | 1979-08-29 | 1983-02-15 | Kyoto Ceramic Co., Ltd. | Semiconductor integrated circuit supporter having a heating element |
GB2198593A (en) * | 1986-12-08 | 1988-06-15 | Fluke Mfg Co John | Temperature controlled hybrid circuit |
EP0377425A1 (en) * | 1989-01-04 | 1990-07-11 | COMPAGNIE ROYALE ASTURIENNE DES MINES, Société Anonyme | Heating element |
US4985803A (en) * | 1989-03-17 | 1991-01-15 | Square D Company | Housing for a multi-board electronic module for a programmable controller system |
JPH0397299A (en) * | 1989-09-11 | 1991-04-23 | Mitsubishi Electric Corp | Remote controller for air conditioner |
US5010233A (en) * | 1988-11-29 | 1991-04-23 | Amp Incorporated | Self regulating temperature heater as an integral part of a printed circuit board |
EP0484852A1 (en) * | 1990-11-07 | 1992-05-13 | Alcatel Espace | Temperature controlled electronical circuit |
-
1992
- 1992-10-29 FR FR9212950A patent/FR2697717B1/en not_active Expired - Fee Related
-
1993
- 1993-10-29 US US08/256,166 patent/US5486681A/en not_active Expired - Lifetime
- 1993-10-29 WO PCT/FR1993/001075 patent/WO2004075614A1/en active Application Filing
- 1993-10-29 DE DE69302561T patent/DE69302561T2/en not_active Expired - Fee Related
- 1993-10-29 EP EP93402666A patent/EP0599678B1/en not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1196620A (en) * | 1967-12-01 | 1970-07-01 | Smiths Industries Ltd | Improvements in or relating to Electric Heating Assemblies |
US4374316A (en) * | 1979-08-29 | 1983-02-15 | Kyoto Ceramic Co., Ltd. | Semiconductor integrated circuit supporter having a heating element |
EP0059410A2 (en) * | 1981-02-28 | 1982-09-08 | BROWN, BOVERI & CIE Aktiengesellschaft Mannheim | Casing to house electric and/or electronic elements |
GB2198593A (en) * | 1986-12-08 | 1988-06-15 | Fluke Mfg Co John | Temperature controlled hybrid circuit |
US5010233A (en) * | 1988-11-29 | 1991-04-23 | Amp Incorporated | Self regulating temperature heater as an integral part of a printed circuit board |
EP0377425A1 (en) * | 1989-01-04 | 1990-07-11 | COMPAGNIE ROYALE ASTURIENNE DES MINES, Société Anonyme | Heating element |
US4985803A (en) * | 1989-03-17 | 1991-01-15 | Square D Company | Housing for a multi-board electronic module for a programmable controller system |
JPH0397299A (en) * | 1989-09-11 | 1991-04-23 | Mitsubishi Electric Corp | Remote controller for air conditioner |
EP0484852A1 (en) * | 1990-11-07 | 1992-05-13 | Alcatel Espace | Temperature controlled electronical circuit |
US5268558A (en) * | 1990-11-07 | 1993-12-07 | France Telecom | Temperature-controlled electronic circuit |
Cited By (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5859409A (en) * | 1996-09-16 | 1999-01-12 | Samsung Electronics Co., Ltd. | Oven for testing peripheral storage devices |
US6097001A (en) * | 1997-06-30 | 2000-08-01 | Alcatel | Portable heating tent and method for testing telecommunications equipment |
US6313442B1 (en) * | 1997-06-30 | 2001-11-06 | Alcatel Network Systems, Inc. | Portable heating tent and method for testing telecommunications equipment |
US6049061A (en) * | 1997-10-21 | 2000-04-11 | Lucent Technologies Inc. | Heater for use in a mobile radio base station |
US6318688B1 (en) * | 1999-06-08 | 2001-11-20 | Hon Hai Precision Ind. Co., Ltd. | Bracket |
US6493224B1 (en) * | 2000-08-08 | 2002-12-10 | Lucent Technologies Inc. | Method and apparatus to increase convection heat transfer in an electrical system and a method of manufacturing the same |
US6639795B1 (en) * | 2002-02-15 | 2003-10-28 | Steve Cooper | Flow through butterfly backpane |
US7233159B2 (en) * | 2004-06-02 | 2007-06-19 | Emc Corporation | Ergonomic, rotatable electronic component testing apparatus |
US20050269308A1 (en) * | 2004-06-02 | 2005-12-08 | Emc Corporation | Ergonomic, rotatable electronic component testing apparatus |
US20090153994A1 (en) * | 2007-12-18 | 2009-06-18 | Teradyne, Inc. | Disk Drive Transport, Clamping and Testing |
US20090153992A1 (en) * | 2007-12-18 | 2009-06-18 | Teradyne, Inc. | Disk Drive Testing |
US20090153993A1 (en) * | 2007-12-18 | 2009-06-18 | Teradyne, Inc. | Disk Drive Testing |
US8549912B2 (en) | 2007-12-18 | 2013-10-08 | Teradyne, Inc. | Disk drive transport, clamping and testing |
US8467180B2 (en) | 2007-12-18 | 2013-06-18 | Teradyne, Inc. | Disk drive transport, clamping and testing |
US8405971B2 (en) | 2007-12-18 | 2013-03-26 | Teradyne, Inc. | Disk drive transport, clamping and testing |
US7996174B2 (en) | 2007-12-18 | 2011-08-09 | Teradyne, Inc. | Disk drive testing |
US7987018B2 (en) | 2008-04-17 | 2011-07-26 | Teradyne, Inc. | Transferring disk drives within disk drive testing systems |
US20090262445A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Bulk Feeding Disk Drives to Disk Drive Testing Systems |
US20090261229A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Vibration Isolation Within Disk Drive Testing Systems |
US20090261047A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Enclosed Operating Area For Disk Drive Testing Systems |
US20090261228A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US8140182B2 (en) | 2008-04-17 | 2012-03-20 | Teradyne, Inc. | Bulk feeding disk drives to disk drive testing systems |
US20100165501A1 (en) * | 2008-04-17 | 2010-07-01 | Teradyne, Inc., A Massachusetts Corporation | Transferring Disk Drives Within Disk Drive Testing Systems |
US20100168906A1 (en) * | 2008-04-17 | 2010-07-01 | Teradyne, Inc., A Massachusetts Corporation | Transferring Storage Devices Within Storage Device Testing Systems |
US8117480B2 (en) | 2008-04-17 | 2012-02-14 | Teradyne, Inc. | Dependent temperature control within disk drive testing systems |
US8712580B2 (en) | 2008-04-17 | 2014-04-29 | Teradyne, Inc. | Transferring storage devices within storage device testing systems |
US20100302678A1 (en) * | 2008-04-17 | 2010-12-02 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US7848106B2 (en) | 2008-04-17 | 2010-12-07 | Teradyne, Inc. | Temperature control within disk drive testing systems |
US8655482B2 (en) | 2008-04-17 | 2014-02-18 | Teradyne, Inc. | Enclosed operating area for storage device testing systems |
US20090265136A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Disk Drive Emulator And Method Of Use Thereof |
US8482915B2 (en) | 2008-04-17 | 2013-07-09 | Teradyne, Inc. | Temperature control within disk drive testing systems |
US7890207B2 (en) | 2008-04-17 | 2011-02-15 | Teradyne, Inc. | Transferring storage devices within storage device testing systems |
US7904211B2 (en) | 2008-04-17 | 2011-03-08 | Teradyne, Inc. | Dependent temperature control within disk drive testing systems |
US8238099B2 (en) | 2008-04-17 | 2012-08-07 | Teradyne, Inc. | Enclosed operating area for disk drive testing systems |
US7911778B2 (en) | 2008-04-17 | 2011-03-22 | Teradyne, Inc. | Vibration isolation within disk drive testing systems |
US8160739B2 (en) | 2008-04-17 | 2012-04-17 | Teradyne, Inc. | Transferring storage devices within storage device testing systems |
US20090262455A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US8451608B2 (en) | 2008-04-17 | 2013-05-28 | Teradyne, Inc. | Temperature control within storage device testing systems |
US20110106298A1 (en) * | 2008-04-17 | 2011-05-05 | Evgeny Polyakov | Transferring Storage Devices Within Storage Device Testing Systems |
US20090262454A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Temperature Control Within Disk Drive Testing Systems |
US7945424B2 (en) | 2008-04-17 | 2011-05-17 | Teradyne, Inc. | Disk drive emulator and method of use thereof |
US20110123301A1 (en) * | 2008-04-17 | 2011-05-26 | Scott Noble | Bulk feeding storage devices to storage device testing systems |
US20110172807A1 (en) * | 2008-04-17 | 2011-07-14 | Teradyne, Inc. | Enclosed Operating Area for Storage Device Testing Systems |
US20090262444A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Transferring Disk Drives Within Disk Drive Testing Systems |
US20090265032A1 (en) * | 2008-04-17 | 2009-10-22 | Teradyne, Inc. | Transferring Storage Devices Within Storage Device Testing Systems |
US8305751B2 (en) | 2008-04-17 | 2012-11-06 | Teradyne, Inc. | Vibration isolation within disk drive testing systems |
US8041449B2 (en) | 2008-04-17 | 2011-10-18 | Teradyne, Inc. | Bulk feeding disk drives to disk drive testing systems |
US8102173B2 (en) | 2008-04-17 | 2012-01-24 | Teradyne, Inc. | Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit |
US8095234B2 (en) | 2008-04-17 | 2012-01-10 | Teradyne, Inc. | Transferring disk drives within disk drive testing systems |
US8086343B2 (en) | 2008-06-03 | 2011-12-27 | Teradyne, Inc. | Processing storage devices |
US7908029B2 (en) | 2008-06-03 | 2011-03-15 | Teradyne, Inc. | Processing storage devices |
US20100174404A1 (en) * | 2008-06-03 | 2010-07-08 | Teradyne, Inc. | Processing Storage Devices |
US20090297328A1 (en) * | 2008-06-03 | 2009-12-03 | Teradyne, Inc. | Processing Storage Devices |
US7920380B2 (en) | 2009-07-15 | 2011-04-05 | Teradyne, Inc. | Test slot cooling system for a storage device testing system |
US20110013362A1 (en) * | 2009-07-15 | 2011-01-20 | Teradyne, Inc. | Test Slot Cooling System for a Storage Device Testing System |
US8279603B2 (en) | 2009-07-15 | 2012-10-02 | Teradyne, Inc. | Test slot cooling system for a storage device testing system |
US7995349B2 (en) | 2009-07-15 | 2011-08-09 | Teradyne, Inc. | Storage device temperature sensing |
US7778031B1 (en) | 2009-07-15 | 2010-08-17 | Teradyne, Inc. | Test slot cooling system for a storage device testing system |
US7940529B2 (en) | 2009-07-15 | 2011-05-10 | Teradyne, Inc. | Storage device temperature sensing |
US7932734B2 (en) | 2009-07-15 | 2011-04-26 | Teradyne, Inc. | Individually heating storage devices in a testing system |
US8466699B2 (en) | 2009-07-15 | 2013-06-18 | Teradyne, Inc. | Heating storage devices in a testing system |
US20110011844A1 (en) * | 2009-07-15 | 2011-01-20 | Teradyne, Inc., A Massachusetts Corporation | Conductive heating |
US8116079B2 (en) | 2009-07-15 | 2012-02-14 | Teradyne, Inc. | Storage device testing system cooling |
US8547123B2 (en) | 2009-07-15 | 2013-10-01 | Teradyne, Inc. | Storage device testing system with a conductive heating assembly |
US20110012632A1 (en) * | 2009-07-15 | 2011-01-20 | Merrow Brian S | Conductive Heating |
US8628239B2 (en) | 2009-07-15 | 2014-01-14 | Teradyne, Inc. | Storage device temperature sensing |
US7929303B1 (en) | 2010-02-02 | 2011-04-19 | Teradyne, Inc. | Storage device testing system cooling |
US8687356B2 (en) | 2010-02-02 | 2014-04-01 | Teradyne, Inc. | Storage device testing system cooling |
US9779780B2 (en) | 2010-06-17 | 2017-10-03 | Teradyne, Inc. | Damping vibrations within storage device testing systems |
US8687349B2 (en) | 2010-07-21 | 2014-04-01 | Teradyne, Inc. | Bulk transfer of storage devices using manual loading |
US8964361B2 (en) | 2010-07-21 | 2015-02-24 | Teradyne, Inc. | Bulk transfer of storage devices using manual loading |
US9001456B2 (en) | 2010-08-31 | 2015-04-07 | Teradyne, Inc. | Engaging test slots |
US9263659B2 (en) * | 2011-06-10 | 2016-02-16 | Perpetua Power Source Technologies, Inc. | System and method for thermal protection of an electronics module of an energy harvester |
US20120312345A1 (en) * | 2011-06-10 | 2012-12-13 | Perpetua Power Source Technologies, Inc. | System and method for thermal protection of an electronics module of an energy harvester |
US9459312B2 (en) | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
US10725091B2 (en) | 2017-08-28 | 2020-07-28 | Teradyne, Inc. | Automated test system having multiple stages |
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Also Published As
Publication number | Publication date |
---|---|
DE69302561D1 (en) | 1996-06-13 |
EP0599678A1 (en) | 1994-06-01 |
FR2697717B1 (en) | 1994-12-16 |
FR2697717A1 (en) | 1994-05-06 |
EP0599678B1 (en) | 1996-05-08 |
WO2004075614A1 (en) | 2004-09-02 |
DE69302561T2 (en) | 1996-09-19 |
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