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Method for manufacturing a printed wiring board having a shield layer

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Publication number
US5308644A
US5308644A US07739708 US73970891A US5308644A US 5308644 A US5308644 A US 5308644A US 07739708 US07739708 US 07739708 US 73970891 A US73970891 A US 73970891A US 5308644 A US5308644 A US 5308644A
Authority
US
Grant status
Grant
Patent type
Prior art keywords
layer
shield
printed
wiring
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07739708
Inventor
Shin Kawakami
Satoshi Haruyama
Hirotaka Okonogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Ground layout on printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the metallic pattern or other conductive pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Abstract

The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.

Description

FIELD OF THE INVENTION

The present invention is related to a method for manufacturing a printed wiring board having a shield layer.

The method of providing an electromagnetic wave shield layer in a printed wiring board through an insulating layer is described in Patent Application Laid-Open No. 213192/1987 and thus it is already publicly known, and as shown in FIG. 3, a printed wiring board 9 is constituted by providing electromagnetic wave shield layer 5 over printed wiring circuits 2 formed on both sides of an insulating board 1 through an insulating layer 4, and providing earth circuit 5a between the two and a solder resist layer 6.

The electromagnetic wave shield layer 5 of the printed wiring board 9 is formed over the board except for the region through hole 7 for conduction by a plated through hole 8, or for electronic parts connecting lands, not shown.

The shield layer 5 of the printed wiring board 9 is usually formed by printing a conductive coating by means of the silk screen printing, but if shield layer 5 is provided on the whole surface of insulating board 1, it is difficult to make its layer thickness uniform and the desired shield effect may not appropriately be obtained. By the same token, a shield layer 5 having an appropriate layer thickness can not always be obtained if the shield layer 5 is provided only over a required portion, and accordingly it lacks of stability.

In addition, the earth circuit 5a with the printed wiring circuit 2 of the printed wiring board 9 is also formed by silk screen printing simultaneously with the shield layer 5, but the coating is not fully introduced to the portion of the earth circuit 5a and connection failure may occur.

SUMMARY OF THE INVENTION

Accordingly, the present invention was developed to remedy the defects in the traditional method for forming a shield layer, and its object is to provide a manufacturing method of good workability which can always form a shield layer having a stable layer thickness and can also form an earth circuit without fear of connection failure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are explanatory views showing the first and second embodiments of the present invention, and

FIG. 3 is an explanatory view of the conventional printed wiring board having a shield layer.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The embodiments of the method for manufacturing a printed wiring board having a shield layer according to the present invention are described with reference to the accompanying drawings.

FIG. 1 is an explanatory view showing a first embodiment of a method for manufacturing the printed wiring board according to the present invention.

An insulating board 1 contains, on both sides thereof, printed wiring circuits 2 formed through a plated through hole 8. A sealing member 3a is filled in the conducting through hole portion 7, and such sealing member 3a is made of a thermosetting synthetic resin material such as epoxy resin or a photo-setting synthetic resin material such as acryl epoxy resin. The sealing member 3a is formed by filling a paste made of such synthetic resin material in each through hole portion 7 of the printed wiring board 9 by means of screen printing or the like, and thereafter hardening it.

Insulating layers 4 are also formed by screen printing or the like, and electromagnetic wave shield layers 5 are formed on the insulating layers 4. In forming such electromagnetic wave shield layers 5, the printed wiring board 9 is mounted and set on a mounting base (not shown) and a mask 13 is aligned and set on the printed wiring board 9.

Thereafter, a coating 10 for an electromagnetic wave shield is discharged from the nozzle end 15 of a filling nozzle 14 used for electromagnetic wave shield coating which is mounted above the mask 13 for horizontal movement, and coating 10 for electromagnetic wave shield is applied on insulating layer 4 of printed wiring board 9 through mask 13.

In addition, the filling nozzle 14 consists of a nozzle main body 17 provided with a filling section 16 for containing the coating 10 for the electromagnetic wave shield, and an operation section 18 of a discharge valve provided above filling section 16 of the nozzle main body 17.

The coating 10 for the electromagnetic wave shield is supplied to the filling section 16 through a supply port 19 from a supply section (not shown), and nozzle end 15 is removably attached to a discharge hole 20 of filling section 16 by means of mounting screws 21.

Further, a discharge valve 23 is mounted on discharge hole 20 of filling section 16 through an operation lever 22, and the top end of the operation lever 22 is coupled to an operation valve 26 elastically mounted by a spring 25 in operation chamber 24, which is provided above the nozzle main body 17.

Moreover, the operation chamber 24 of the operation section 18 is connected to an air pressure source (not shown) for operation through a connecting port 27 and a control section (not shown).

A slide bearing 28 is provided for the operation lever 22.

Accordingly, to apply coating 10 for an electromagnetic wave shield on insulating layer 4 via mask 13 by means of filling nozzle 14 constructed above, filling nozzle 14 is operated via the operation section (not shown) to abut nozzle end 15 on the upper surface of mask 13 and moved in the horizontal direction.

The portion of printed wiring board 1 to be coated is scanned during the horizontal movement, and at its corresponding position, operation lever 22 of operation section 18 is risen against the elastic force of spring 25 to open discharge valve 23 for opening discharge hole 20, and coating 10 for the electromagnetic wave shield, which is fed under pressure from connecting port 19 into filling section 16 through the supply source, is discharged from nozzle end 15 to apply coating 10 for the electromagnetic wave shield on insulating layer 4 through mask 13.

In addition, the electromagnetic wave shield layer 5 is formed by hardening the coating 10 for the electromagnetic wave shield applied on the insulating layer 4, on which solder resist layer 6, also acting as a protective layer is formed.

In the applying process of the coating 10 for the electromagnetic wave shield, the coating is also filled in the earth circuit portion so that earth circuit 5a can also be formed simultaneously with the formation of the electromagnetic wave shield layer 5.

The layer thickness of the insulating layer 5 is 20 to 50 μm.

FIG. 2 is an explanatory view showing a second embodiment of the present invention.

This embodiment is different in the construction of the filling nozzle 14 used in the first embodiment, but the same in other means, and thus the same reference numerals are assigned to the same structural portions in the figure and the concrete description of those means is omitted.

A squeegee 29 is thus attached to nozzle end 15 in the construction of filling nozzle 14.

This squeegee 29 is attached in a position behind filling nozzle 14 with respect to the advance direction in the horizontal moving direction thereof.

Accordingly, as filling nozzle 14 is horizontally moved after coating 10 for the electromagnetic wave shield is applied on insulating layer 4 by filling nozzle 14, the coating 10 for electromagnetic wave shield exposed on insulating layer 4 can be removed along mask 13 by squeegee 29 attached to the nozzle end 15.

In addition, nozzle end 15 can be changed by mounting screws 21 so as to select the size of its discharge hole 15a, but it is desirably formed of a plastic material or synthetic rubber in consideration of the wear resistance of the surface abutting mask 13 and the protection of mask 13, and similarly it is desirable to consider the material of squeegee 29.

In FIG. 1, the shield layer 5 for the printed wiring circuit 2 on the underside of printed wiring board 9 is shown having already been formed.

In accordance with the present invention, a shield layer of a uniform layer thickness can be formed with good workability and without producing irregularities in the layer thickness of the shield layer, and a proper earth circuit can be formed without causing connection failure by also forcibly feeding and applying under pressure the coating for the shield onto the earth circuit.

Claims (1)

What is claimed is:
1. In a method for manufacturing a printed wiring board having a printed wiring circuit provided on one or both sides of an insulating board and a shield layer provided on the printed wiring circuit through an insulating layer, the steps of: forming a shield layer and an earth circuit by injecting a shield coating material under pressure on said insulating layer through a mask from a nozzle; and removing excess shield coating material from the printed wiring board by a squeegee attached to the nozzle.
US07739708 1990-08-13 1991-08-02 Method for manufacturing a printed wiring board having a shield layer Expired - Fee Related US5308644A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2-214077 1990-08-13
JP21407790A JPH0496400A (en) 1990-08-13 1990-08-13 Manufacture of printed circuit board having shield layer

Publications (1)

Publication Number Publication Date
US5308644A true US5308644A (en) 1994-05-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
US07739708 Expired - Fee Related US5308644A (en) 1990-08-13 1991-08-02 Method for manufacturing a printed wiring board having a shield layer

Country Status (3)

Country Link
US (1) US5308644A (en)
JP (1) JPH0496400A (en)
GB (1) GB2247785B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925414A (en) * 1996-11-20 1999-07-20 International Business Corpration Nozzle and method for extruding conductive paste into high aspect ratio openings
US6132510A (en) * 1996-11-20 2000-10-17 International Business Machines Corporation Nozzle apparatus for extruding conductive paste
US6761926B1 (en) * 1994-12-27 2004-07-13 Visteon Global Technologies, Inc. Method for compressing viscous material through openings
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
US20130047877A1 (en) * 2011-08-25 2013-02-28 Cheol Jun YOO Squeeze apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2192824A1 (en) * 2008-11-27 2010-06-02 Siemens Aktiengesellschaft Printed circuit board with an electromagnetic wave shield layer

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622239A (en) * 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
US4664945A (en) * 1983-08-19 1987-05-12 Matsushita Electric Industrial Co., Ltd. Method of forming thick film circuits
US4720402A (en) * 1987-01-30 1988-01-19 American Telephone And Telegraph Company Method for dispensing viscous material
US4970354A (en) * 1988-02-21 1990-11-13 Asahi Chemical Research Laboratory Co., Ltd. Electromagnetic wave shielding circuit and production method thereof
US5030800A (en) * 1989-01-27 1991-07-09 Nippon Cmk Corp. Printed wiring board with an electronic wave shielding layer
US5055321A (en) * 1988-04-28 1991-10-08 Ibiden Co., Ltd. Adhesive for electroless plating, printed circuit boards and method of producing the same
GB2247112A (en) * 1990-08-10 1992-02-19 Nippon Cmk Kk Packing filler in holes in printed circuit boards
JPH0475398A (en) * 1990-07-18 1992-03-10 Cmk Corp Filling device for filling material into through hole of printed wiring board
JPH0476991A (en) * 1990-07-18 1992-03-11 Cmk Corp Manufacture of printed circuit board
JPH0494592A (en) * 1990-08-10 1992-03-26 Cmk Corp Filling method for filler in through hole of printed circuit board
US5112648A (en) * 1990-07-18 1992-05-12 Nippon Cmk Corp. Method of manufacturing a printed circuit board
US5133120A (en) * 1990-07-11 1992-07-28 Nippon Cmk Corp. Method of filling conductive material into through holes of printed wiring board

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664945A (en) * 1983-08-19 1987-05-12 Matsushita Electric Industrial Co., Ltd. Method of forming thick film circuits
US4622239A (en) * 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
US4720402A (en) * 1987-01-30 1988-01-19 American Telephone And Telegraph Company Method for dispensing viscous material
US4970354A (en) * 1988-02-21 1990-11-13 Asahi Chemical Research Laboratory Co., Ltd. Electromagnetic wave shielding circuit and production method thereof
US5055321A (en) * 1988-04-28 1991-10-08 Ibiden Co., Ltd. Adhesive for electroless plating, printed circuit boards and method of producing the same
US5030800A (en) * 1989-01-27 1991-07-09 Nippon Cmk Corp. Printed wiring board with an electronic wave shielding layer
US5133120A (en) * 1990-07-11 1992-07-28 Nippon Cmk Corp. Method of filling conductive material into through holes of printed wiring board
JPH0475398A (en) * 1990-07-18 1992-03-10 Cmk Corp Filling device for filling material into through hole of printed wiring board
JPH0476991A (en) * 1990-07-18 1992-03-11 Cmk Corp Manufacture of printed circuit board
US5112648A (en) * 1990-07-18 1992-05-12 Nippon Cmk Corp. Method of manufacturing a printed circuit board
JPH0494592A (en) * 1990-08-10 1992-03-26 Cmk Corp Filling method for filler in through hole of printed circuit board
JPH0494593A (en) * 1990-08-10 1992-03-26 Cmk Corp Forming method for through hole of printed circuit board
GB2247112A (en) * 1990-08-10 1992-02-19 Nippon Cmk Kk Packing filler in holes in printed circuit boards

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6761926B1 (en) * 1994-12-27 2004-07-13 Visteon Global Technologies, Inc. Method for compressing viscous material through openings
US5925414A (en) * 1996-11-20 1999-07-20 International Business Corpration Nozzle and method for extruding conductive paste into high aspect ratio openings
US6132510A (en) * 1996-11-20 2000-10-17 International Business Machines Corporation Nozzle apparatus for extruding conductive paste
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
US20130047877A1 (en) * 2011-08-25 2013-02-28 Cheol Jun YOO Squeeze apparatus

Also Published As

Publication number Publication date Type
JPH0496400A (en) 1992-03-27 application
GB2247785B (en) 1994-06-01 grant
GB2247785A (en) 1992-03-11 application
GB9117199D0 (en) 1991-09-25 grant

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Legal Events

Date Code Title Description
AS Assignment

Owner name: NIPPON CMK CORP., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:HARUYAMA, SATOSHI;OKONOGI, HIROTAKA;REEL/FRAME:005806/0623

Effective date: 19910723

LAPS Lapse for failure to pay maintenance fees
FP Expired due to failure to pay maintenance fee

Effective date: 19980503