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US4988577A - Printed circuit board stiffener - Google Patents

Printed circuit board stiffener Download PDF

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Publication number
US4988577A
US4988577A US07363278 US36327889A US4988577A US 4988577 A US4988577 A US 4988577A US 07363278 US07363278 US 07363278 US 36327889 A US36327889 A US 36327889A US 4988577 A US4988577 A US 4988577A
Authority
US
Grant status
Grant
Patent type
Prior art keywords
board
pin
circuit
printed
stiffener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07363278
Inventor
John A. Jamieson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BUSSCO ENGINEERING Inc 119 STANDARD STREET EL SEGUNDO CA 90245 A CORP OF CA
Bussco Engineering Inc
Original Assignee
Bussco Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12201Width or thickness variation or marginal cuts repeating longitudinally
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12361All metal or with adjacent metals having aperture or cut
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24298Noncircular aperture [e.g., slit, diamond, rectangular, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777Edge feature

Abstract

A stiffener for a printed circuit board which comprises an elongated metallic electrically conductive bar. Extending from the bar are a plurality of spaced apart pins with these pins being in longitudinal alignment. Each pin is constructed to facilitate physical deformation such as by including a through opening within the body of the pin or with the pin including notched-out areas in the side walls of the pin. Upon the pin incurring a sufficiently powerful striking force, the pin will deform and expand laterally.

Description

BACKGROUND OF THE INVENTION

The field of this invention relates to electronics and more particularly to a mechanical device to rigidize a printed circuit board and to eliminate and/or minimize the bow and twist introduced to the board during various board manufacturing processes.

Boards upon which are mounted specific electronic circuits and components are used extensively within electronic equipment. As circuits increase in complexity, printed circuit boards have been developed into multi-layered boards wherein each layer, with its associated electrical circuits, are a plane within the board envelope. Insulating layers are interleaved with different interconnected printed conductor patterns.

At the present time, boards are manufactured from a variety of board materials. The most common board material is a composition of glass fabrics or fibers bonded with epoxy resins. Other compositions used are made up by various other material like aramid fibers and polymide or polytetrafluoroethylene resins. It is well-known that all boards tend to warp when subjected to heat, wave soldering for example.

Typical manufacturing procedure requires that the board be impregnated with resin and then cured within an over. Curing temperatures of one hundred seventy degrees centigrade are quite common along with a curing pressure of one thousand five hundred pounds per square inch.

Common usage for printed circuit boards is for the board to be "plugged in" to a particular piece of electronic hardware such as a computer. A particular piece of electronic hardware may have literally hundreds of such boards. Each board has its own "slot" in which the board is to be installed. The space allotted to the particular board conforms closely to the board itself. At times, during the manufacture of the board, the board may assume a warped or slightly non-planar configuration which is the result of the various manufacturing processes. This warping of the board may make it impossible to install such in its particular slot.

In the past, it has been known to install a circuit board stiffener on the board to prevent the board from assuming warped configuration. These stiffeners are installed at selected locations, generally both longitudinal and transversely, to insure that the board will be maintained planar. A typical stiffener comprises an elongated metallic bar which is to be mounted in a fixed relationship onto the upper or bottom surface of the board. Typical installation will sue a conventional fastener such as rivet or soldering to securely fixed in position the stiffener to the board. Generally, the stiffener will be constructed of an electrically conductive material and the stiffener may also function as power distributor or as a common electrical ground for a portion of the circuitry embodied within the board.

The mounting of the stiffener on the board by either installing of fasteners or by soldering is a time consuming and expensive procedure. Previous to the present invention, there has not been known an easy quick way to install a stiffener in conjunction with a printed circuit board.

SUMMARY OF THE INVENTION

The structure of the present invention constitutes an elongated narrow metallic bar from which extends in a spaced row a plurality of pins. Within each pin is incorporated an opening and/or notches. Each pin is to be located within and protrude exteriorly from a respective hole formed within a printed circuit board so that all the pins protrude slightly from the undersurface of the board. Each of the pins are then to be struck with a force applying tool which causes the pin to partially collapse and expand laterally. This expansion laterally is sufficient to form a secure connection with the hole wall surface, circuitry or both. As a result, the elongated bar is fixed in position on the printed circuit board.

The primary objective of the present invention is to construct a stiffener for a printed circuit board which can be installed quickly and easily eliminating expensive and time consuming installation procedures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of that portion of a printed circuit board upon which has been installed the printed circuit board stiffener of the present invention;

FIG. 2 is a cross sectional view taken through the board along line 2--2 of FIG. 1 showing more clearly a pin mounted within a hole in the printed circuit board with the pin not being fixed to the board;

FIG. 3 is a bottom plain view taken along 3--3 of FIG. 2;

FIG. 4 is a view similar to FIG. 2 but showing the pin in its installed position;

FIG. 5 is a view taken along line 5--5 of FIG. 4;

FIG. 6 is a view similar to FIg. 2 but of a modified form of a pin;

FIG. 7 is a view of the modified form of a pin of FIG. 6 but showing the pin in its installed position which is similar to the position shown in FIG. 4;

FIG. 8 is a view showing a still further modified form of pin in its non-installed position;

FIG. 9 is a view of a still further modified form of pin which is also shown in its non-installed position; and

FIG. 10 is a view of a still further modified form of pin which is also shown in its non-installed position.

DETAILED DESCRIPTION OF THE SHOWN EMBODIMENT

Referring specifically to the drawings, there is shown a printed circuit board 10 which is to include an appropriate electrical circuit pattern (not shown). The circuit board 10 will normally include a plurality of spaced apart holes 12. The printed circuit board 10 has an upper surface 14 and a lower surface 16.

In order to insure that the printed circuit board 10 is to remain planar, that is not to warp during heat treating of the board 10, there is to be mounted on the board 10 the stiffener 18 of this invention. The stiffener 18 is shown in FIGS. 1 through 5 of the drawings. Stiffener 18 is composed of an elongated bar 20 which is composed of an electrically conductive metallic material with that sheet metal being preferred. The bar 20 is shown to be of low height and narrow in width. The bar 20 is actually constructed in a hairpin configuration when taken in cross section. Because of this hairpin configuration, bending of the bar 20 in a direction toward and away from the upper surface 14 is prevented with the bar 20 being maintained in a straight configuration.

It is to be understood that the actual shape in cross section of the bar 20 could be altered. For example, the bar 20 could assume an L-shape configuration in cross section. It is also to be understood that the thickness of the sheet material employed within the bar 20 could vary as well as the type of material within bar 20. Typical material would be a tin plated brass.

Integrally connected to the bar 20 and extending therefrom are a plurality of pins 22. These pins 22 are identical and are normally evenly spaced apart. The exact spacing can vary for the particular installation. Also a particular installation may dictate that the pins 22 not be evenly spaced apart. The pins 22 are in longitudinal alignment.

Associated with each pin 22 is a shoulder 24. The shoulder 24 is to abut against the upper surface 14 of the printed circuit board 10. A pin 22 is to extend through a hole 12.

Each pin 22 is to include some type of structural change to make the pin 22 frangible. In referring particularly to FIGs. 1 through 5, this type of structural change has to do with incorporating of a through opening 26 within the body of the pin 22. The outer end of the pin 22 is beveled forming a somewhat sharpened point 28.

When the stiffener 18 is installed in position as shown in FIG. 1 in conjunction with the printed circuit board 10, the bar 20 is solidly supported along its longitudinal length usually within some type of fixture (not shown). A striking tool, such as a hammer (not shown), is to apply an impact force to the somewhat pointed end 28 which causes the outer end of the pin 22 to deform and collapse about the through opening 26. This collapsing is clearly shown in FIG. 4. As a result, the lateral dimensions of each pin 22 is increased resulting in the lateral edges 30 and 32 being expanded into the engagement with the side walls of the hole 12. It is to be understood that this type of deforming procedure is to be completed for each and every pin 22 which will then result in the stiffener 18 being securely fastened on the printed circuit board 10.

In referring to FIGs. 6 and 7 of the drawings, there is shown a modified form of stiffener 34 in which the pin 36 includes a air of spaced apart holes 38 and 40. The only difference between the stiffeners 18 and 34 is that within the stiffener 34 there is utilized a pair of holes 38 and 40 which is similar to hole 265. The reason for this is that if perchance the stiffener 34 is utilized with a thinner printed circuit board 10 then the hole 38 will still permit the lateral edges 42 and 44 of the pin 36 to spread laterally and bind against the wall surface of hole 12. In other words, this stiffener 34 is capably being used with a variety of thicknesses of printed circuit boards 10 where stiffener 18 is intended to be used with approximately one general thickness of printed circuit board 10./

Referring particularly to FIG. 8, there is shown a pin 46 which includes a through opening 48. The outer end of the pin 46 is against beveled to form a somewhat sharpened end 50. Formed within the side walls of the pin 46 are a pair of notches 542 and 54. The combination of the hole 48 and the notches 52 and 54 provide for the frangible nature of the pin 46 and permit such to be readily deformed and spread laterally upon the somewhat sharpened end 50 being impacted.

Referring particularly to FIG. 9, there is shown a pin 56 which instead of including a circular through opening includes a triangular shaped through opening 58. The only difference of the pin in FIG. 9 is that the opening 58 is non-circular and may prove to be more effective for certain types of printed circuit boards.

Referring particularly to FIG. 10, there is again shown a modified form of pin 60 which includes an elliptical shaped through opening 62. Again,. this elliptical shape through impending 62 may prove to be most effective with certain types or certain thicknesses of printed circuit boards.

Claims (4)

What is claimed is:
1. A printed circuit board stiffener comprising:
an elongated bar, said elongated bar being rigid, said elongated bar being narrow;
a plurality of pins integrally connected to said elongated bar, said pins being spaced apart and extending outwardly from said elongated bar, each said pin adapted to be inserted within a close conforming hole formed within a printed circuit board, each said pin including frangible means, said frangible means permitting the deforming of each said pinion application of a sufficiently powerful striking force causing collapsing and lateral expansion of each said pin; and
said frangible means including a plurality of notches formed within the side walls of each said pin.
2. The printed circuit boards stiffener as defined in claim 8 wherein:
said elongated bar being electrically conductive.
3. 'The printed circuit boards stiffener as defined in claim 2 wherein:
each said pin being identical.
4. The printed circuit board stiffener as defined in claim 1 wherein:
each said pin including a shoulder, said shoulder being adapted to abut against the surface of the printed circuit board for correct positioning of the printed circuit board relative to said pins.
US07363278 1989-06-08 1989-06-08 Printed circuit board stiffener Expired - Fee Related US4988577A (en)

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Application Number Priority Date Filing Date Title
US07363278 US4988577A (en) 1989-06-08 1989-06-08 Printed circuit board stiffener

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Application Number Priority Date Filing Date Title
US07363278 US4988577A (en) 1989-06-08 1989-06-08 Printed circuit board stiffener

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US4988577A true US4988577A (en) 1991-01-29

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992014607A1 (en) * 1991-02-19 1992-09-03 Carnahan David W Fragrance sampler with dual fragrance delivery means
US5360346A (en) * 1993-12-22 1994-11-01 Molex Incorporated Electrical connector assembly with printed circuit board stiffening system
US5378545A (en) * 1993-04-02 1995-01-03 Ag Communication Systems Corporation Removable snap-on card stiffener
WO1998027799A1 (en) * 1996-12-19 1998-06-25 Minnesota Mining And Manufacturing Company Vibration damped and stiffened circuit articles
US6084182A (en) * 1997-04-07 2000-07-04 Hybricon Corporation Backplane stiffener
US6094358A (en) * 1998-07-13 2000-07-25 International Business Machines Corporation Card stiffener optimized for connector engagement
US6122815A (en) * 1998-04-27 2000-09-26 Power Distribution Products Circuit board stiffener and method of attachment to a circuit board
US6260265B1 (en) * 1998-04-27 2001-07-17 Power Distribution Products Circuit board stiffener
GB2361812A (en) * 2000-02-22 2001-10-31 Nec Corp Reinforcing structure for a printed circuit board
WO2002009124A1 (en) * 2000-07-26 2002-01-31 General Electric Company Circuit board protection system and method
US6498728B1 (en) * 1998-04-28 2002-12-24 Thomson-Csf Sextant Simplified modular structure
US6512676B1 (en) 2000-07-20 2003-01-28 Silicon Graphics, Inc. Printed circuit board stiffener
US6550474B1 (en) 1997-01-29 2003-04-22 Cns, Inc. Microencapsulated fragrances and methods of coating microcapsules
US6682802B2 (en) 2000-12-14 2004-01-27 Intel Corporation Selective PCB stiffening with preferentially oriented fibers
US6769428B2 (en) 1997-01-29 2004-08-03 Peter J. Cronk Adhesively applied external nasal strips and dilators containing medications and fragrances
US20040252476A1 (en) * 2003-05-12 2004-12-16 Dingman Michael Allan Printed circuit board stiffener
US20040253842A1 (en) * 2003-06-11 2004-12-16 Hewlett-Packard Development Company, L.P. Backplane support system
US20050028360A1 (en) * 2002-10-04 2005-02-10 Sanmina-Sci Corporation Apparatus for stiffening a circuit board
US20060077641A1 (en) * 2002-12-13 2006-04-13 Thales Electronic card with braced structure
US20110000483A1 (en) * 2009-05-01 2011-01-06 Matthias Joseph A External nasal dilator
EP2427034A1 (en) * 2010-09-03 2012-03-07 Long Jing International Technology Enterprise Co., Ltd. Anti-deflection structure for flexible circuit board
US8506996B2 (en) 1997-01-29 2013-08-13 Peter J. Cronk Therapeutic delivery system
US8834514B2 (en) 2006-08-30 2014-09-16 Xennovate Medical Llc Resilient band medical device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469018A (en) * 1966-12-16 1969-09-23 Chem & Aerospace Products Inc Circuit board
US3558289A (en) * 1968-02-12 1971-01-26 Joseph J Cervenka Chain form clip
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469018A (en) * 1966-12-16 1969-09-23 Chem & Aerospace Products Inc Circuit board
US3558289A (en) * 1968-02-12 1971-01-26 Joseph J Cervenka Chain form clip
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992014607A1 (en) * 1991-02-19 1992-09-03 Carnahan David W Fragrance sampler with dual fragrance delivery means
US5378545A (en) * 1993-04-02 1995-01-03 Ag Communication Systems Corporation Removable snap-on card stiffener
US5360346A (en) * 1993-12-22 1994-11-01 Molex Incorporated Electrical connector assembly with printed circuit board stiffening system
US5958556A (en) * 1996-12-19 1999-09-28 Minnesota Mining And Manufacturing Company Vibration damped and stiffened circuit articles
WO1998027799A1 (en) * 1996-12-19 1998-06-25 Minnesota Mining And Manufacturing Company Vibration damped and stiffened circuit articles
US6550474B1 (en) 1997-01-29 2003-04-22 Cns, Inc. Microencapsulated fragrances and methods of coating microcapsules
US8506996B2 (en) 1997-01-29 2013-08-13 Peter J. Cronk Therapeutic delivery system
US7013889B2 (en) 1997-01-29 2006-03-21 Cronk Peter J Adhesively applied external nasal strips and dilators containing medications and fragrances
US7011093B2 (en) 1997-01-29 2006-03-14 Cns, Inc. Microencapsulated fragrances and methods of coating microcapsules
US20050066965A1 (en) * 1997-01-29 2005-03-31 Cronk Peter J. Adhesively applied external nasal strips and dilators containing medications and fragrances
US20040005830A1 (en) * 1997-01-29 2004-01-08 Anderson Milton W. Microencapsulated fragrances and methods of coating microcapsules
US6769428B2 (en) 1997-01-29 2004-08-03 Peter J. Cronk Adhesively applied external nasal strips and dilators containing medications and fragrances
US8852224B2 (en) 1997-01-29 2014-10-07 Peter J. Cronk Therapeutic delivery system
US6084182A (en) * 1997-04-07 2000-07-04 Hybricon Corporation Backplane stiffener
US6122815A (en) * 1998-04-27 2000-09-26 Power Distribution Products Circuit board stiffener and method of attachment to a circuit board
US6260265B1 (en) * 1998-04-27 2001-07-17 Power Distribution Products Circuit board stiffener
US6498728B1 (en) * 1998-04-28 2002-12-24 Thomson-Csf Sextant Simplified modular structure
US6094358A (en) * 1998-07-13 2000-07-25 International Business Machines Corporation Card stiffener optimized for connector engagement
US6418028B2 (en) 2000-02-22 2002-07-09 Nec Corporation Reinforcing structure for a printed circuit board
GB2361812A (en) * 2000-02-22 2001-10-31 Nec Corp Reinforcing structure for a printed circuit board
GB2361812B (en) * 2000-02-22 2002-04-17 Nec Corp Reinforcing structure for a printed circuit board
US6771517B2 (en) 2000-07-20 2004-08-03 Silicon Graphics, Inc. Printed circuit board stiffener
US6512676B1 (en) 2000-07-20 2003-01-28 Silicon Graphics, Inc. Printed circuit board stiffener
WO2002009124A1 (en) * 2000-07-26 2002-01-31 General Electric Company Circuit board protection system and method
US6380487B1 (en) * 2000-07-26 2002-04-30 General Electric Company Circuit board protection system and method
US7041357B2 (en) 2000-12-14 2006-05-09 Intel Corporation Selective PCB stiffening with preferentially oriented fibers
US6682802B2 (en) 2000-12-14 2004-01-27 Intel Corporation Selective PCB stiffening with preferentially oriented fibers
US20050028360A1 (en) * 2002-10-04 2005-02-10 Sanmina-Sci Corporation Apparatus for stiffening a circuit board
US6880243B2 (en) 2002-10-04 2005-04-19 Sanmina-Sci Corporation Stiffener for stiffening a circuit board
US20060077641A1 (en) * 2002-12-13 2006-04-13 Thales Electronic card with braced structure
US7289337B2 (en) * 2002-12-13 2007-10-30 Thales Electronic card with braced structure
US20040252476A1 (en) * 2003-05-12 2004-12-16 Dingman Michael Allan Printed circuit board stiffener
US6943292B2 (en) * 2003-05-12 2005-09-13 Siemens Vdo Automotive Corporation Printed circuit board stiffener
US20040253842A1 (en) * 2003-06-11 2004-12-16 Hewlett-Packard Development Company, L.P. Backplane support system
US7095622B2 (en) 2003-06-11 2006-08-22 Hewlett-Packard Development Company, L.P. Backplane support system with stiffener
US8834514B2 (en) 2006-08-30 2014-09-16 Xennovate Medical Llc Resilient band medical device
US20110000483A1 (en) * 2009-05-01 2011-01-06 Matthias Joseph A External nasal dilator
EP2427034A1 (en) * 2010-09-03 2012-03-07 Long Jing International Technology Enterprise Co., Ltd. Anti-deflection structure for flexible circuit board

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Legal Events

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AS Assignment

Owner name: BUSSCO ENGINEERING, INC., 119 STANDARD STREET, EL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:JAMIESON, JOHN A.;REEL/FRAME:005088/0459

Effective date: 19890522

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Expired due to failure to pay maintenance fee

Effective date: 19950202