US4759787A - Method of purifying molten silica - Google Patents
Method of purifying molten silica Download PDFInfo
- Publication number
- US4759787A US4759787A US06/897,636 US89763686A US4759787A US 4759787 A US4759787 A US 4759787A US 89763686 A US89763686 A US 89763686A US 4759787 A US4759787 A US 4759787A
- Authority
- US
- United States
- Prior art keywords
- crucible
- wall
- vitreous silica
- melt
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B32/00—Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
- C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/06—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in pot furnaces
- C03B5/08—Glass-melting pots
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/009—Poling glass
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
- C30B15/18—Heating of the melt or the crystallised materials using direct resistance heating in addition to other methods of heating, e.g. using Peltier heat
Definitions
- This invention relates to a method of improving the quality of a product made from or made in contact with a body of vitreous silica.
- the invention relates to a method of making an improved vitreous silica product, such as a crucible, a tube or a plate, having a reduced impurity content, and to a product produced by the method.
- the invention also relates to an improved method for using a vitreous silica vessel for the high temperature processing of a material contained therein. Particularly valuable uses of this method of the invention are found in the treatment of molten semiconductor materials in a vitreous silica crucible (e.g. in the drawing of a single crystal of silicon).
- An arc moulded crucible is normally produced by fusing a powder material under the influence of an electrical arc while the powder material (e.g. quartz powder) is held in place in a rotating mould (e.g. of water cooled metal) by centrifugal force, with or without the application of a vacuum via the mould wall(s).
- a powder material e.g. quartz powder
- a rotating mould e.g. of water cooled metal
- a vitreous silica crucible is commonly used to contain a melt from which a single crystal is drawn.
- high purity is of vital importance and much effort has been, and is still being, given to avoiding impurity contamination of the melt during the crystal pulling operation.
- the crucible is one potential source of such contamination.
- alkali impurities may transfer to the molten silicon from the wall(s) of the crucible and a variety of different, often time-consuming and otherwise expensive, procedures have been proposed for the purification of the starting material used for a vitreous silica crucible to reduce the alkali impurities therein.
- a reduced impurity content in material fused in a vitreous silica crucible can be obtained by the simple expedient of applying a polarising potential across the wall(s) of the crucible, at least while the latter is at a temperature in excess of 700° C., for such a period and with such a polarity that ions of the or each impurity will migrate across the wall(s) of the crucible away from the inside surface thereof.
- Impurity migration can be effected when the crucible is first fused from the starting material and/or by applying a correctly polarised potential across the wall(s) of the crucible when it contains melt.
- a correctly polarised potential across the wall(s) of the crucible when it contains melt.
- alkali impurity ions which so far appear to be the impurities most easily removed from the crucible wall/melt interface
- a voltage with positive polarity on the inside and negative polarity on the outside of the crucible will be required.
- Voltages between 1 and 2000 volts appear to be effective over the temperatures and times typical for pulling a single crystal from a bath of molten semiconductor material.
- the migration rate is a function of temperature and applied voltage and preferably the temperature of the inside surface of the crucible wall(s) is in excess of 900° C.
- the crucible wall(s) is/are not a significant barrier to the diffusion of impurities (e.g. Na, K or Li) which in the absence of an electrolysing potential may migrate through the wall(s) from the crucible holder, and which in the presence of an electrolysing potential can migrate into the wall(s) from melt in the crucible.
- impurities e.g. Na, K or Li
- vitreous silica tubing whose impurity content has been reduced by electrolysis can have other useful applications than as an intermediary in the manufacture of a vitreous silica vessel.
- the invention also extends to the production of improved vitreous silica products (e.g. tubing) either by a one-stage process in which an ion-migrating potential is applied across the product during manufacture, or by a two-stage process in which an ion-migrating potential is applied across a heated billet prior to further processing (e.g. drawing) with or without further electrolysis during that further processing.
- improved vitreous silica products e.g. tubing
- the present invention relates to a method of improving the quality of a product made from, or made in contact with, a body of vitreous silica, which is characterised in that impurity ions are made to migrate away from one boundary surface of the body towards an opposite boundary surface thereof by applying a polarising potential across the boundary surfaces of the body while the body is maintained at a temperature above 700° C.
- the polarising potential is typically poled to make alkali metal ions migrate away from the said one boundary surface.
- Typical temperatures are in the range 800° to 2000° C.
- typical process times are from one to a few tens of hours at the lower end of the range and a few minutes to an hour at higher temperatures and typical polarising potentials from a few tens of volts to a few kilovolts.
- the method can be used to make tubing and other vitreous silica products of improved purity.
- FIG. 1 is a schematic indication of the invention applied to improve single crystal semiconductor material drawn from a vitreous silica crucible and as described in the following Examples 10 to 12,
- FIG. 2 shows a vitreous silica crucible whose purity has been improved by the method of the invention which is being processed as described in the following Examples 1 and 2,
- FIG. 3 shows how a vitreous silica crucible can be made in accordance with the invention in the manner described in the following Examples 3 and 4,
- FIGS. 4 and 5 show a crucible being made in the manner described, respectively, in the following Examples 5 to 7 and Example 8, and
- FIG. 6 shows how the quality of vitreous silica tubing can be improved as described in the following
- FIG. 1 shows, purely schematically, a single crystal 10 of silicon being drawn from a bath 12 of molten silicon contained in a vitreous silica arc moulded crucible 14.
- the crucible 14 is contained within a graphite susceptor 16 heated by an induction coil (not shown) and the crystal 10 depends from a seed crystal 10a which has been slowly drawn upwards out of the surface of the bath 12.
- a d.c. potential is applied between the seed crystal 10a and the susceptor 16 with the polarity as shown, this potential being maintained throughout the pulling operation.
- the magnitude of the applied potential can vary from a minimum which is sufficient to overcome contact resistances and ionisation potentials and establish a current of a few microamps, to a maximum where the high voltage causes arcing or other problems. In practice, a potential of between a few volts and a few hundred volts would normally be used.
- FIG. 1 is further discussed in the following Examples 10 to 13.
- a previously manufactured crucible 20 of 300 mm diameter with a 6 mm wall thickness was heated to 1050° C. in nitrogen.
- An internal electrodes 21, consisting of high purity carbon powder loosely filled into the crucible 20, and an external electrode was provided by a graphite holder 22 into which the crucible 20 fitted loosely.
- the gap between the holder 22 and the crucible 20 was filled with high purity carbon powder 23. Care was taken to ensure excess carbon powder did not cause short circuits.
- the upper 10 mm of the crucible protruded above the holder and internal powder fill to act as a barrier to surface tracking by the applied voltage.
- the holder was made the negative electrode.
- the voltage was applied gradually on the crucible reaching 1050° C. to keep the electrolysing current below 50 mA. After 40 minutes, the full voltage of 2.5 KV could be applied.
- a second crucible was treated as in Example 1 except that the polarising voltage was switched off at 800° C. as the crucible was cooling following electrolysis at 1050° C.
- a further crucible 30 was heated directly in a spinning graphite mould 31 using an oxy propane flame 32 so that the crucible softened and came into intimate contact with the mould.
- the mould was made negative and the burner positive using a voltage of 3.8 KV.
- the high electrical impedance of the flame greatly reduced the voltage available for electrolysis but some improvement was measured as can be seen from the figures shown in Table 1 as AMC 10.
- the time of electrolysis was 5 minutes.
- a further crucible was treated as in Example 3 except that an R.F. induction plasma replaced the flame 32.
- the analysis of this treated crucible is shown as AMC 14 in Table 1.
- a crucible 40 was manufactured using the spinning mould method to hold high purity quartz powder in position. Heating was with an arc 41 and the mould 42 was of water-cooled metal. An electrolysing voltage of 10 KV was applied for the final 2 minutes of heating using the arc 41 as the positive electrode and the mould 42 as the negative electrode. The analytical result is shown as AMC 21 in Table 1.
- Example 5 A crucible was manufactured as for Example 5 except that an uncooled graphite mould was used in place of the water-cooled mould 42.
- the analytical result is shown in Table 1 as AMC 23.
- the improved result when compared with Example 5 is believed to be due to the higher electrical resistance of the quartz powder kept cold by the water-cooled mould in Example 5, reducing the voltage available for electrolysis.
- a crucible was manufactured as for Example 6 except that during fusion a partial vacuum of 8-7 kPa was applied between the mould 42 and the forming crucible 40 via a pipe 45.
- the analytical result is shown as AMC 31.
- the lower impurity content in this case is believed to be due to partial ionisation of the gas in the gap between the mould and the forming crucible due to the partial vacuum and this ionised gas acting as the negative electrode.
- a manufactured crucible 50 was placed over a closely fitting graphite internal mould 51 and heated externally with an oxy-propane ribbon burner 52. The temperature reached on the surface of the crucible was sufficient to remelt it.
- a potential difference was applied between the burner 52 and the mould 51 of 4.5 KV.
- the mould was rotated at 1 RPM so that the flame swept over all the crucible.
- the mould was the positive electrode.
- the flame was coloured by the ions being electrolysed from the crucible.
- a cylindrical pipe 60 of fused quartz with an external diameter of 200 mm, a length of 1500 mm and a wall thickness of 25 mm was subject to electrolysis across the wall with a potential difference of 10 KV.
- An inner electrode 61 (anode) was made by coating the inner surface with a layer approximately 2 mm thick consisting of a paste of low alkali titanium dioxide (British Titan Products Ltd.--Grade A-HR) and a proprietary low alkali silica sol (Nalfloc Ltd.--"Nalcoag 1034A"). Connection to this electrode was made with a nickel chromium alloy band 62 which was a spring fit in the bore.
- An outer electrode (cathode) consisted of a layer 63 approximately 2 mm thick coating the whole outer surface except the ends and consisting of a paste of ferric oxide and a silica sol. Connection to this electrode was made with an open pitch coil 64 of nickel chromium heat resisting wire.
- Electrolysis was carried out at 1050° C. On reaching temperature, the voltage was gradually increased so as to avoid exceeding the current limitation of the power supply (100 ma). Maximum voltage of 10 KV was reached after 8 hours 40 minutes.
- the cylindrical pipe of fused quartz from Example 9 was machined externally to remove 1 mm from the bore and 3 mm from the external surface leaving a wall thickness of 21 mm. After cleaning with detergent and dilute hydrofluoric acid it was reheated in a graphite resistance furnace and drawn into tubing. Some of this tubing was reworked with flames on a glass working lathe to the form of a crucible. The analysis of the crucible is shown in Table 2 as Cl.
- a single crystal "puller” was modified to allow a voltage to be applied between the silicon single crystal 10a of FIG. 1 and the graphite susceptor 16 during that growing operation which was carried out in Argon at 1 atmosphere gauge. After the crystal 10 had achieved the desired diameter, a voltage of 50-1000 V was applied between the crystal (positive) and the susceptor (negative). The voltage was derived from a current limited source of 0.010A.
- a single crystal was grown as for Example 11 except that a sub-atmospheric pressure of 15-20 torr was used in the puller.
- the maximum polarising voltage was limited to 200 V.
- a single crystal was grown as for Example 11 except that a coating of glassy carbon (obtained by the pyrolysis of propane diluted with Argon) had been made on the outside of the quartz crucible before use in order to improve the electrical contact between the crucible and the susceptor.
- the electrolysing temperature and time conditions are related one to the other and to the wall thickness across which the polarising potential is applied.
- these process conditions are preferably that the body is maintained for a time of at least 1 hour/mm wall thickness in the temperature range 800°-1200° C. and at least 1 min/mm thickness in the temperature range 1201°-2000° C.
- the effective polarising potential applied across the boundary surfaces preferably exceeds 10 V/mm thickness but not 1 KV/mm thickness.
Abstract
Description
TABLE 1 ______________________________________ Noted impurity in ppm by weight Crucible Position Surface Na.sub.2 O K.sub.2 O Li.sub.2 O ______________________________________ AMC3 Side Inner <0.1 <0.1 <0.1 Wall Outer 1.5 4.2 3.3 Base Inner 0.2 0.2 0.2 Wall Outer 1.6 3.3 2.8 AMC4 Side Inner <0.1 <0.1 <0.1 Wall Outer 2.5 2.0 4.4 Base Inner <0.1 <0.1 <0.1 Wall Outer 0.1 0.2 0.3 AMC10 Mean Inner 0.9 1.5 0.2 Value Outer 2.2 2.0 2.0 AMC14 Mean Inner <0.1 <0.1 <0.1 Value Outer 0.2 0.4 0.2 AMC21 Mean Inner 0.9 1.2 0.2 Value Outer 1.4 2.5 2.0 AMC23 Mean Inner 0.2 1.3 <0.1 Value Outer 0.9 2.5 0.5 AMC31 Mean Inner <0.1 0.2 <0.1 Value Outer 0.1 0.4 0.1 AMC33 Mean Inner <0.1 <0.1 <0.1 Value Outer 0.2 0.5 <0.1 Starting Material for AMC 3, 4, 5.6 5.4 3.8 10, 14 Starting Material for21, 23, 1.4 2.5 3.2 31 ______________________________________ AMC
TABLE 2 ______________________________________ Impurity concentration in ppm by weight Surface Na.sub.2 O K.sub.2 O Li.sub.2 O ______________________________________ B4 Inner <0.1 <0.1 <0.1 Centre <0.1 <0.1 <0.1 Outer 13.9 4.8 8.0 Tube from B4 0.1 0.1 <0.1 C1 Inner <0.1 <0.1 <0.1 Outer <0.1 0.1 <0.1 Starting Material 8.8 4.3 4.4 for B4 ______________________________________
TABLE 3 ______________________________________ Resistivity of Single Crystal ohm-cm P.Type Silicon ______________________________________ Without polarizing Crystal Shoulder 145 Voltage Crystal end 115 With polarizing S1 Crystal Shoulder 500 Voltage Crystal end 300 S2 Crystal Shoulder 850 Crystal end 600 S3 Crystal Shoulder 1250 Crystal end 1050 ______________________________________
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8427915 | 1984-10-26 | ||
GB848427915A GB8427915D0 (en) | 1984-11-05 | 1984-11-05 | Vitreous silica products |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/180,440 Continuation US4874417A (en) | 1984-11-05 | 1988-04-12 | Method of purifying vitreous silica |
Publications (1)
Publication Number | Publication Date |
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US4759787A true US4759787A (en) | 1988-07-26 |
Family
ID=10569253
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/897,636 Expired - Lifetime US4759787A (en) | 1984-11-05 | 1985-11-04 | Method of purifying molten silica |
US07/180,440 Expired - Lifetime US4874417A (en) | 1984-11-05 | 1988-04-12 | Method of purifying vitreous silica |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/180,440 Expired - Lifetime US4874417A (en) | 1984-11-05 | 1988-04-12 | Method of purifying vitreous silica |
Country Status (6)
Country | Link |
---|---|
US (2) | US4759787A (en) |
EP (1) | EP0199787B1 (en) |
JP (1) | JPH0784328B2 (en) |
DE (1) | DE3576813D1 (en) |
GB (2) | GB8427915D0 (en) |
WO (1) | WO1986002919A1 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4874417A (en) * | 1984-11-05 | 1989-10-17 | Thermal Syndicate P.L.C. | Method of purifying vitreous silica |
DE3900593A1 (en) * | 1989-01-12 | 1990-07-12 | Toshiba Ceramics Co | ELECTROLYSIS DEVICE |
US5082484A (en) * | 1989-09-25 | 1992-01-21 | Toshiba Ceramics Co., Ltd. | Apparatus for making quartz glass crucibles |
US5096479A (en) * | 1988-08-18 | 1992-03-17 | Tsl Group Plc | Method of enhancing fused quartz body purity |
US5104432A (en) * | 1989-05-18 | 1992-04-14 | Manville Corporation | Process for fiberizing molten glass or refractory oxide materials |
EP0693461A1 (en) * | 1994-07-19 | 1996-01-24 | Heraeus Quarzglas GmbH | Quartz glass crucible, method for producing the same, and apparatus for producing the same |
US5964913A (en) * | 1996-03-18 | 1999-10-12 | Dynelec Corporation | Method of making a vitreous material |
US6182237B1 (en) | 1998-08-31 | 2001-01-30 | International Business Machines Corporation | System and method for detecting phase errors in asics with multiple clock frequencies |
WO2002083586A1 (en) * | 2001-04-10 | 2002-10-24 | Schott Glas | Method for reducing the adhesion tendency during the hot forming of glass |
EP1464629A2 (en) * | 2003-04-02 | 2004-10-06 | Japan Super Quartz Corporation | Method for producing high purity silica crucible by electrolytic refining, crucible and pulling method |
US20100000465A1 (en) * | 2008-07-07 | 2010-01-07 | Japan Super Quartz Corporation | Method for producing vitreous silica crucible |
US20100071417A1 (en) * | 2008-09-22 | 2010-03-25 | Japan Super Quartz Corporation | Arc discharge method, arc discharge apparatus, and fused silica crucible manufacturing apparatus |
US20100132609A1 (en) * | 2007-05-31 | 2010-06-03 | Heraeus Quarzglas Gmbh & Co. Kg | Quartz glass crucible for silicon single crystal pulling operation and process for manufacturing the same |
EP2226300A1 (en) * | 2007-11-30 | 2010-09-08 | Japan Super Quartz Corporation | Method and apparatus for manufacturing quartz glass crucible |
US20110197631A1 (en) * | 2009-10-20 | 2011-08-18 | Japan Super Quartz Corporation | Method and apparatus for manufacturing vitreous silica crucible |
CN112341006A (en) * | 2020-10-13 | 2021-02-09 | 江苏太平洋石英股份有限公司 | Method and device for high-purity quartz tube/rod, quartz tube/rod and application |
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JPH06104577B2 (en) * | 1987-07-14 | 1994-12-21 | 東芝セラミックス株式会社 | Electrolysis device |
JP2577587B2 (en) * | 1987-12-15 | 1997-02-05 | 東芝セラミックス株式会社 | Quartz glass crucible manufacturing equipment |
DE3815974C1 (en) * | 1988-05-10 | 1989-08-24 | Heraeus Quarzschmelze | |
DE3836934A1 (en) * | 1988-10-29 | 1990-05-03 | Heraeus Schott Quarzschmelze | METHOD FOR CLEANING PARTICLE FORMED SILICON DIOXIDE |
US5055958A (en) * | 1989-03-31 | 1991-10-08 | Tdk Corporation | Surface-reinforced glass and magnetic head having surface-reinforced glass |
US5201927A (en) * | 1990-10-26 | 1993-04-13 | Matsushita Electric Industrial Co., Ltd. | Method of producing the optical element |
US6632277B2 (en) | 1999-07-14 | 2003-10-14 | Seh America, Inc. | Optimized silicon wafer gettering for advanced semiconductor devices |
US6395085B2 (en) | 1999-07-14 | 2002-05-28 | Seh America, Inc. | Purity silicon wafer for use in advanced semiconductor devices |
US6454852B2 (en) | 1999-07-14 | 2002-09-24 | Seh America, Inc. | High efficiency silicon wafer optimized for advanced semiconductor devices |
US6228165B1 (en) * | 1999-07-28 | 2001-05-08 | Seh America, Inc. | Method of manufacturing crystal of silicon using an electric potential |
DE19943103A1 (en) | 1999-09-09 | 2001-03-15 | Wacker Chemie Gmbh | Highly filled SiO2 dispersion, process for its production and use |
US6510707B2 (en) | 2001-03-15 | 2003-01-28 | Heraeus Shin-Etsu America, Inc. | Methods for making silica crucibles |
KR20050027086A (en) * | 2002-08-12 | 2005-03-17 | 스미토모 덴키 고교 가부시키가이샤 | Method of producing higher-purity glass element, high-purity glass element, and production method and device for glass tube |
DE10319300B4 (en) * | 2003-04-29 | 2006-03-30 | Wacker Chemie Ag | Process for producing a shaped body of silica glass |
JP4526311B2 (en) * | 2004-06-30 | 2010-08-18 | ジャパンスーパークォーツ株式会社 | Method for producing quartz glass crucible |
US8713966B2 (en) | 2011-11-30 | 2014-05-06 | Corning Incorporated | Refractory vessels and methods for forming same |
CN107250064A (en) | 2014-12-11 | 2017-10-13 | 康宁股份有限公司 | The method for handling ceramic body |
CN106587071B (en) * | 2016-12-30 | 2018-09-04 | 大连理工大学 | A kind of lateral solidification superposition of electric field improves the device and method of polycrystalline silicon purifying yield |
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1984
- 1984-11-05 GB GB848427915A patent/GB8427915D0/en active Pending
-
1985
- 1985-11-04 US US06/897,636 patent/US4759787A/en not_active Expired - Lifetime
- 1985-11-04 GB GB8527116A patent/GB2166434B/en not_active Expired
- 1985-11-04 EP EP85905522A patent/EP0199787B1/en not_active Expired - Lifetime
- 1985-11-04 WO PCT/GB1985/000499 patent/WO1986002919A1/en active IP Right Grant
- 1985-11-04 DE DE8585905522T patent/DE3576813D1/en not_active Expired - Fee Related
- 1985-11-04 JP JP60504860A patent/JPH0784328B2/en not_active Expired - Lifetime
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1988
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Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US4874417A (en) * | 1984-11-05 | 1989-10-17 | Thermal Syndicate P.L.C. | Method of purifying vitreous silica |
US5096479A (en) * | 1988-08-18 | 1992-03-17 | Tsl Group Plc | Method of enhancing fused quartz body purity |
DE3900593A1 (en) * | 1989-01-12 | 1990-07-12 | Toshiba Ceramics Co | ELECTROLYSIS DEVICE |
DE3900593C3 (en) * | 1989-01-12 | 1998-11-12 | Toshiba Ceramics Co | Electrolysis device |
US5104432A (en) * | 1989-05-18 | 1992-04-14 | Manville Corporation | Process for fiberizing molten glass or refractory oxide materials |
US5082484A (en) * | 1989-09-25 | 1992-01-21 | Toshiba Ceramics Co., Ltd. | Apparatus for making quartz glass crucibles |
EP0693461A1 (en) * | 1994-07-19 | 1996-01-24 | Heraeus Quarzglas GmbH | Quartz glass crucible, method for producing the same, and apparatus for producing the same |
US5762672A (en) * | 1994-07-19 | 1998-06-09 | Shin-Etsu Quartz Products, Ltd. | Method for producing a quartz glass crucible |
US5964913A (en) * | 1996-03-18 | 1999-10-12 | Dynelec Corporation | Method of making a vitreous material |
US6182237B1 (en) | 1998-08-31 | 2001-01-30 | International Business Machines Corporation | System and method for detecting phase errors in asics with multiple clock frequencies |
WO2002083586A1 (en) * | 2001-04-10 | 2002-10-24 | Schott Glas | Method for reducing the adhesion tendency during the hot forming of glass |
US20040129024A1 (en) * | 2001-04-10 | 2004-07-08 | Ulrike Stoehr | Method for reducing the adhesion tendency during the hot forming of glass |
CN100374627C (en) * | 2003-04-02 | 2008-03-12 | 日本超精石英株式会社 | Method for producing high purity silica crucible by electrolytic refining, mfg. method of crucible and pulling method |
EP1464629A3 (en) * | 2003-04-02 | 2005-03-23 | Japan Super Quartz Corporation | Method for producing high purity silica crucible by electrolytic refining, crucible and pulling method |
EP1464629A2 (en) * | 2003-04-02 | 2004-10-06 | Japan Super Quartz Corporation | Method for producing high purity silica crucible by electrolytic refining, crucible and pulling method |
KR101081834B1 (en) | 2003-04-02 | 2011-11-09 | 쟈판 스파 쿼츠 가부시키가이샤 | High purity silica glass crucible by electrolytic refining, and its production method and pulling method |
US8555674B2 (en) * | 2007-05-31 | 2013-10-15 | Heraeus Quarzglas Gmbh & Co. Kg | Quartz glass crucible for silicon single crystal pulling operation and process for manufacturing the same |
US20100132609A1 (en) * | 2007-05-31 | 2010-06-03 | Heraeus Quarzglas Gmbh & Co. Kg | Quartz glass crucible for silicon single crystal pulling operation and process for manufacturing the same |
US20100244311A1 (en) * | 2007-11-30 | 2010-09-30 | Japan Super Quartz Corporation | Method and apparatus for manufacturing vitreous silica crucible |
EP2226300A1 (en) * | 2007-11-30 | 2010-09-08 | Japan Super Quartz Corporation | Method and apparatus for manufacturing quartz glass crucible |
EP2226300A4 (en) * | 2007-11-30 | 2011-04-20 | Japan Super Quartz Corp | Method and apparatus for manufacturing quartz glass crucible |
US8196430B2 (en) | 2007-11-30 | 2012-06-12 | Japan Super Quartz Corporation | Method and apparatus for manufacturing vitreous silica crucible |
US20100000465A1 (en) * | 2008-07-07 | 2010-01-07 | Japan Super Quartz Corporation | Method for producing vitreous silica crucible |
US20100071417A1 (en) * | 2008-09-22 | 2010-03-25 | Japan Super Quartz Corporation | Arc discharge method, arc discharge apparatus, and fused silica crucible manufacturing apparatus |
US8416833B2 (en) | 2008-09-22 | 2013-04-09 | Japan Super Quartz Corporation | Arc discharge method, arc discharge apparatus, and fused silica crucible manufacturing apparatus |
US20110197631A1 (en) * | 2009-10-20 | 2011-08-18 | Japan Super Quartz Corporation | Method and apparatus for manufacturing vitreous silica crucible |
US8276402B2 (en) * | 2009-10-20 | 2012-10-02 | Japan Super Quartz Corporation | Method and apparatus for manufacturing vitreous silica crucible |
CN112341006A (en) * | 2020-10-13 | 2021-02-09 | 江苏太平洋石英股份有限公司 | Method and device for high-purity quartz tube/rod, quartz tube/rod and application |
Also Published As
Publication number | Publication date |
---|---|
EP0199787A1 (en) | 1986-11-05 |
JPH0784328B2 (en) | 1995-09-13 |
US4874417A (en) | 1989-10-17 |
GB2166434B (en) | 1989-06-01 |
EP0199787B1 (en) | 1990-03-28 |
GB8527116D0 (en) | 1985-12-11 |
WO1986002919A1 (en) | 1986-05-22 |
JPS62501067A (en) | 1987-04-30 |
GB8427915D0 (en) | 1984-12-12 |
DE3576813D1 (en) | 1990-05-03 |
GB2166434A (en) | 1986-05-08 |
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