US4599788A - Solid electrolytic capacitor manufacture - Google Patents
Solid electrolytic capacitor manufacture Download PDFInfo
- Publication number
- US4599788A US4599788A US06/630,916 US63091684A US4599788A US 4599788 A US4599788 A US 4599788A US 63091684 A US63091684 A US 63091684A US 4599788 A US4599788 A US 4599788A
- Authority
- US
- United States
- Prior art keywords
- substrate
- pellets
- array
- layer
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 30
- 239000007787 solid Substances 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000008188 pellet Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- 239000010407 anodic oxide Substances 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 11
- 239000007784 solid electrolyte Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 6
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 3
- 150000004706 metal oxides Chemical class 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 239000008393 encapsulating agent Substances 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 229920006334 epoxy coating Polymers 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
Definitions
- This invention relates to a method of making a solid electrolytic capacitor in which a valve metal powder ink is screen printed on a valve metal substrate to form an array of pads, a valve metal pellet is placed on end on each pad, and the assembly is sintered producing a porour metal pellet array bonded through a graded density layer to the substrate. The assembly is then anodized to form a valve metal oxide over its surfaces and processed to form an array of solid electrolyte capacitors which may then be separated into individual capacitors.
- Solid electrolytic capacitors have been made by screen printing multiple layers of tantalum onto a substrate, sintering, and processing into capacitors. Still others have been made by pressing and sintering powder pellets onto substrates and then processing to form solid electrolyte capacitors.
- pellets made from the high CV powders currently available have lower densities than those of the prior art and can not be adequately compressed onto a substrate to form any sort of a bond therebetween. While it is possible to screen print multiple layers of these high CV powders to form capacitors, the long dimension of the resulting body lies in the plane of the substrate which limits the numbers of anodes processed per batch.
- valve metal pellets are affixed to a valve metal substrate through a layer of a valve metal ink screen printed onto that substrate.
- the ink initially serves as a binder or glue to attach the pellets, and the assembly is sintered to bond the pellets to the substrate via a graded density joint.
- the pellets are placed on end, allowing a greater density of pellets per square unit of substrate surface area. This means that more anodes can be processed into capacitors per batch than was possible heretofore.
- FIG. 3 shows a cross-section of the capacitor of this invention.
- the pellets 12 preferably have a green (unsintered) density of about 4 g/cc as opposed to the usual 5.5-6.5 g/cc.
- the screen printed ink has a density of about 5.5 g/cc, and when the array is sintered provides a graded density joint between the pellets and the substrate (density of about 16.6 g/cc for tantalum foil).
- low-density pellets pressed with a binder/filler are used as the binder/filler imparts enough strength so that these can be used without sintering.
- the substrate 10 bearing the pads 11 and pellets 12 is heated, e.g., to about 150° C., to remove the binder and solidify the pads prior to sintering. Otherwise the pellets are partially sintered to increase their strength before placement on the pads.
- Pad 11 is graded density joint between substrate 10 and pellet 12. All of the surfaces of pellet 12, pad 11, and the adjacent surface of substrate 10 bears a layer of anodic oxide 13.
- Polymer 14 overlies the portion of anodic oxide 13 on substrate 10.
- Solid manganese dioxide electrolyte 15 is deposited over the anodic oxide 13 which covers pellet 12 electrolyte 15 does not adhere to polymer 14.
- conductive layer 16 adheres to electrolyte 15 but not to polymer 14.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Organic Insulating Materials (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/630,916 US4599788A (en) | 1984-07-13 | 1984-07-13 | Solid electrolytic capacitor manufacture |
CA000481985A CA1222030A (en) | 1984-07-13 | 1985-05-21 | Solid electrolytic capacitor manufacture |
JP60151464A JPS6151911A (en) | 1984-07-13 | 1985-07-11 | Improved solid electrolytic condenser and method of producing same |
FR8510742A FR2567679B1 (en) | 1984-07-13 | 1985-07-12 | METHOD FOR MANUFACTURING A SOLID ELECTROLYTIC CAPACITOR AND CAPACITOR OBTAINED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/630,916 US4599788A (en) | 1984-07-13 | 1984-07-13 | Solid electrolytic capacitor manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
US4599788A true US4599788A (en) | 1986-07-15 |
Family
ID=24529092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/630,916 Expired - Fee Related US4599788A (en) | 1984-07-13 | 1984-07-13 | Solid electrolytic capacitor manufacture |
Country Status (4)
Country | Link |
---|---|
US (1) | US4599788A (en) |
JP (1) | JPS6151911A (en) |
CA (1) | CA1222030A (en) |
FR (1) | FR2567679B1 (en) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357399A (en) * | 1992-09-25 | 1994-10-18 | Avx Corporation | Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor |
US5394295A (en) * | 1993-05-28 | 1995-02-28 | Avx Corporation | Manufacturing method for solid state capacitor and resulting capacitor |
US5483415A (en) * | 1993-02-26 | 1996-01-09 | Rohm Co., Ltd. | Solid electrolytic capacitor and method of making the same |
EP0758788A1 (en) * | 1995-03-03 | 1997-02-19 | Rohm Co., Ltd. | Solid electrolytic capacitor and its manufacturing method |
EP0893808A1 (en) * | 1994-06-10 | 1999-01-27 | Avx Corporation | Preforms for the fabrication of surface mountable solid state capacitors |
WO2001011638A1 (en) * | 1999-08-10 | 2001-02-15 | Avx Limited | Manufacture of solid state capacitors |
WO2001037296A1 (en) * | 1999-11-15 | 2001-05-25 | Avx Limited | Solid state capacitors and methods of manufacturing them |
CN1085393C (en) * | 1994-04-08 | 2002-05-22 | 罗姆股份有限公司 | Structure and production of solid electrolytic capacitor |
US6673389B1 (en) * | 1999-09-17 | 2004-01-06 | Avx Limited | Manufacture of solid state capacitors |
US6699767B1 (en) * | 1998-11-06 | 2004-03-02 | Avx Limited | Manufacture of solid state capacitors |
WO2004049361A1 (en) * | 2002-11-25 | 2004-06-10 | Medtronic, Inc. | Advanced valve metal anodes with complex interior and surface features and methods for processing same |
DE19738149B4 (en) * | 1996-08-30 | 2006-10-05 | Rohm Co. Ltd. | Solid electrolytic capacitor assembly and method of making the same |
US20070158783A1 (en) * | 2006-01-09 | 2007-07-12 | Yueh-You Chen | Interdigitated capacitive structure for an integrated circuit |
US20070177336A1 (en) * | 2004-03-30 | 2007-08-02 | Rohm Co., Ltd. | Solid electrolytic capacitor |
US20080198535A1 (en) * | 2004-03-08 | 2008-08-21 | Rohm Co., Ltd. | Solid Electrolytic Capacitor, Anode Used For Solid Electrolytic Capacitor, and Method of Manufacturing the Anode |
EP2130208A1 (en) * | 2007-03-07 | 2009-12-09 | Kemet Electronics Corporation | Thin solid electrolytic capacitor embeddable in a substrate |
CN101901695A (en) * | 2009-05-29 | 2010-12-01 | 阿维科斯公司 | Solid electrolytic capacitor with facedown terminations |
US20100302710A1 (en) * | 2009-05-29 | 2010-12-02 | Avx Corporation | Anode for an Electrolytic Capacitor that Contains Individual Components Connected by a Refractory Metal Paste |
US20100302713A1 (en) * | 2009-05-29 | 2010-12-02 | Avx Corporation | Refractory Metal Paste for Solid Electrolytic Capacitors |
US20140226258A1 (en) * | 2013-02-14 | 2014-08-14 | Brandon Summey | Capacitor Array and Method of Manufacture |
EP3297009A1 (en) | 2016-09-19 | 2018-03-21 | BIOTRONIK SE & Co. KG | Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor |
US10658111B2 (en) | 2015-08-10 | 2020-05-19 | Murata Manufacturing Co., Ltd. | Capacitor |
US11495416B2 (en) * | 2019-03-29 | 2022-11-08 | Murata Manufacturing Co., Ltd. | Capacitor array and composite electronic component |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2625602B1 (en) * | 1987-12-30 | 1994-07-01 | Europ Composants Electron | PROCESS FOR MANUFACTURING ALUMINUM ELECTROLYTIC CAPACITORS AND CONDENSER WITH INTEGRATED ANODE OBTAINED BY THIS PROCESS |
JP2777490B2 (en) * | 1991-08-30 | 1998-07-16 | 株式会社松下縫工所 | Belt guide device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3588626A (en) * | 1969-04-10 | 1971-06-28 | Sprague Electric Co | Leadless solid electrolyte tantalum capacitor |
US3588627A (en) * | 1969-04-10 | 1971-06-28 | Sprague Electric Co | Leadless solid electrolyte tantalum capacitor |
US3889357A (en) * | 1973-07-05 | 1975-06-17 | Sprague Electric Co | Screen printed solid electrolytic capacitor |
US4188706A (en) * | 1978-04-18 | 1980-02-19 | Sprague Electric Company | Method for making a plurality of solid electrolyte capacitors and capacitors made thereby |
US4203194A (en) * | 1978-07-17 | 1980-05-20 | Sprague Electric Company | Batch method for making solid-electrolyte capacitors |
-
1984
- 1984-07-13 US US06/630,916 patent/US4599788A/en not_active Expired - Fee Related
-
1985
- 1985-05-21 CA CA000481985A patent/CA1222030A/en not_active Expired
- 1985-07-11 JP JP60151464A patent/JPS6151911A/en active Pending
- 1985-07-12 FR FR8510742A patent/FR2567679B1/en not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3588626A (en) * | 1969-04-10 | 1971-06-28 | Sprague Electric Co | Leadless solid electrolyte tantalum capacitor |
US3588627A (en) * | 1969-04-10 | 1971-06-28 | Sprague Electric Co | Leadless solid electrolyte tantalum capacitor |
US3889357A (en) * | 1973-07-05 | 1975-06-17 | Sprague Electric Co | Screen printed solid electrolytic capacitor |
US4188706A (en) * | 1978-04-18 | 1980-02-19 | Sprague Electric Company | Method for making a plurality of solid electrolyte capacitors and capacitors made thereby |
US4203194A (en) * | 1978-07-17 | 1980-05-20 | Sprague Electric Company | Batch method for making solid-electrolyte capacitors |
Cited By (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357399A (en) * | 1992-09-25 | 1994-10-18 | Avx Corporation | Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor |
US5483415A (en) * | 1993-02-26 | 1996-01-09 | Rohm Co., Ltd. | Solid electrolytic capacitor and method of making the same |
US5394295A (en) * | 1993-05-28 | 1995-02-28 | Avx Corporation | Manufacturing method for solid state capacitor and resulting capacitor |
CN1085393C (en) * | 1994-04-08 | 2002-05-22 | 罗姆股份有限公司 | Structure and production of solid electrolytic capacitor |
EP0893808A1 (en) * | 1994-06-10 | 1999-01-27 | Avx Corporation | Preforms for the fabrication of surface mountable solid state capacitors |
EP1047087A1 (en) * | 1994-06-10 | 2000-10-25 | Avx Corporation | Method of manufacturing solid state capacitors |
EP0758788A4 (en) * | 1995-03-03 | 2004-11-10 | Rohm Co Ltd | Solid electrolytic capacitor and its manufacturing method |
EP0758788A1 (en) * | 1995-03-03 | 1997-02-19 | Rohm Co., Ltd. | Solid electrolytic capacitor and its manufacturing method |
DE19738149B4 (en) * | 1996-08-30 | 2006-10-05 | Rohm Co. Ltd. | Solid electrolytic capacitor assembly and method of making the same |
US6699767B1 (en) * | 1998-11-06 | 2004-03-02 | Avx Limited | Manufacture of solid state capacitors |
US7687884B2 (en) * | 1998-11-06 | 2010-03-30 | Avx Limited | Manufacture of solid state capacitors |
US20050111164A1 (en) * | 1998-11-06 | 2005-05-26 | David Huntington | Manufacture of solid state capacitors |
US6849292B1 (en) * | 1999-08-10 | 2005-02-01 | Avx Limited | Manufacture of solid state capacitors |
WO2001011638A1 (en) * | 1999-08-10 | 2001-02-15 | Avx Limited | Manufacture of solid state capacitors |
US6673389B1 (en) * | 1999-09-17 | 2004-01-06 | Avx Limited | Manufacture of solid state capacitors |
WO2001037296A1 (en) * | 1999-11-15 | 2001-05-25 | Avx Limited | Solid state capacitors and methods of manufacturing them |
KR100675958B1 (en) | 1999-11-15 | 2007-02-01 | 에이브이엑스 리미티드 | Solid state capacitors and methods of manufacturing them |
US20040134874A1 (en) * | 2002-11-25 | 2004-07-15 | Joachim Hossick-Schott | Advanced valve metal anodes with complex interior and surface features and methods for processing same |
US7342774B2 (en) | 2002-11-25 | 2008-03-11 | Medtronic, Inc. | Advanced valve metal anodes with complex interior and surface features and methods for processing same |
WO2004049361A1 (en) * | 2002-11-25 | 2004-06-10 | Medtronic, Inc. | Advanced valve metal anodes with complex interior and surface features and methods for processing same |
US7554794B2 (en) | 2004-03-08 | 2009-06-30 | Rohm Co., Ltd. | Solid electrolytic capacitor, anode used for solid electrolytic capacitor, and method of manufacturing the anode |
CN1930648B (en) * | 2004-03-08 | 2011-02-09 | 罗姆股份有限公司 | Solid electrolytic capacitor, anode used for solid electrolytic capacitor, and method of manufacturing the anode |
US20080198535A1 (en) * | 2004-03-08 | 2008-08-21 | Rohm Co., Ltd. | Solid Electrolytic Capacitor, Anode Used For Solid Electrolytic Capacitor, and Method of Manufacturing the Anode |
US7551424B2 (en) | 2004-03-30 | 2009-06-23 | Rohm Co., Ltd. | Solid electrolytic capacitor |
US20070177336A1 (en) * | 2004-03-30 | 2007-08-02 | Rohm Co., Ltd. | Solid electrolytic capacitor |
CN1938801B (en) * | 2004-03-30 | 2012-10-31 | 罗姆股份有限公司 | Solid electrolytic capacitor |
US20070158783A1 (en) * | 2006-01-09 | 2007-07-12 | Yueh-You Chen | Interdigitated capacitive structure for an integrated circuit |
US8169014B2 (en) | 2006-01-09 | 2012-05-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interdigitated capacitive structure for an integrated circuit |
EP2130208A4 (en) * | 2007-03-07 | 2010-05-05 | Kemet Electronics Corp | Thin solid electrolytic capacitor embeddable in a substrate |
EP2130208A1 (en) * | 2007-03-07 | 2009-12-09 | Kemet Electronics Corporation | Thin solid electrolytic capacitor embeddable in a substrate |
US8279583B2 (en) | 2009-05-29 | 2012-10-02 | Avx Corporation | Anode for an electrolytic capacitor that contains individual components connected by a refractory metal paste |
CN101901695B (en) * | 2009-05-29 | 2016-01-20 | 阿维科斯公司 | There is the solid electrolytic capacitor of facedown terminations |
US20100302710A1 (en) * | 2009-05-29 | 2010-12-02 | Avx Corporation | Anode for an Electrolytic Capacitor that Contains Individual Components Connected by a Refractory Metal Paste |
US8199461B2 (en) * | 2009-05-29 | 2012-06-12 | Avx Corporation | Refractory metal paste for solid electrolytic capacitors |
US20100302712A1 (en) * | 2009-05-29 | 2010-12-02 | Avx Corporation | Solid Electrolytic Capacitor with Facedown Terminations |
CN101901695A (en) * | 2009-05-29 | 2010-12-01 | 阿维科斯公司 | Solid electrolytic capacitor with facedown terminations |
US8441777B2 (en) * | 2009-05-29 | 2013-05-14 | Avx Corporation | Solid electrolytic capacitor with facedown terminations |
US20100302713A1 (en) * | 2009-05-29 | 2010-12-02 | Avx Corporation | Refractory Metal Paste for Solid Electrolytic Capacitors |
US20140226258A1 (en) * | 2013-02-14 | 2014-08-14 | Brandon Summey | Capacitor Array and Method of Manufacture |
US9741494B2 (en) * | 2013-02-14 | 2017-08-22 | Kemet Electronics Corporation | Capacitor array and method of manufacture |
US10283276B2 (en) | 2013-02-14 | 2019-05-07 | Kemet Electronics Corporation | Method of manufacturing a capacitor array |
US10658111B2 (en) | 2015-08-10 | 2020-05-19 | Murata Manufacturing Co., Ltd. | Capacitor |
EP3297009A1 (en) | 2016-09-19 | 2018-03-21 | BIOTRONIK SE & Co. KG | Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor |
US10388464B2 (en) | 2016-09-19 | 2019-08-20 | Biotronik Se & Co. Kg | Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor |
US11495416B2 (en) * | 2019-03-29 | 2022-11-08 | Murata Manufacturing Co., Ltd. | Capacitor array and composite electronic component |
US11670462B2 (en) | 2019-03-29 | 2023-06-06 | Murata Manufacturing Co., Ltd. | Capacitor array and composite electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPS6151911A (en) | 1986-03-14 |
CA1222030A (en) | 1987-05-19 |
FR2567679A1 (en) | 1986-01-17 |
FR2567679B1 (en) | 1988-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SPRAGUE ELECTRIC COMPANY, NORTH ADAMS, MA., A CORP Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:LOVE, GORDON R.;MILLARD, RICHARD J.;REEL/FRAME:004528/0190 Effective date: 19840731 |
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FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: MANUFACTURERS BANK, N.A. Free format text: SECURITY INTEREST;ASSIGNOR:VISHAY SPRAGUE, INC., A CORP. OF DE;REEL/FRAME:006085/0078 Effective date: 19920214 |
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AS | Assignment |
Owner name: VISHAY SPRAGUE, INC., MAINE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:SPRAGUE ELECTRIC COMPANY;REEL/FRAME:006445/0261 Effective date: 19920214 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 19940720 |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |