US3638366A - Lapping method for metallic workpieces - Google Patents

Lapping method for metallic workpieces Download PDF

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Publication number
US3638366A
US3638366A US881867A US3638366DA US3638366A US 3638366 A US3638366 A US 3638366A US 881867 A US881867 A US 881867A US 3638366D A US3638366D A US 3638366DA US 3638366 A US3638366 A US 3638366A
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lap
lapping
working surface
given
lapped
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US881867A
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Norman M Gamache
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Saint Gobain Abrasives Inc
Pratt and Whitney Co Inc
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Norton Co
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Assigned to PRATT & WHITNEY COMPANY, INC., THE, CHARTER OAK BLVD., P.O. BOX 106221, WEST HARTFORD, CONNECTICUT 06110-6221, A CORP. OF OHIO reassignment PRATT & WHITNEY COMPANY, INC., THE, CHARTER OAK BLVD., P.O. BOX 106221, WEST HARTFORD, CONNECTICUT 06110-6221, A CORP. OF OHIO ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: WARNER & SWASEY COMPANY, THE
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Definitions

  • ABSTRACT A process for providing clean lapped surfaces on metallic workpieces supported in operative relation to the working surface of a bonded abrasive lap for sliding and rotary movement relative to such working surface throughout a single continuous lapping operation including a first predetermined time period during which an abrasive slurry is supplied to the working surfaces of the lap and a second predetermined time period during which the working surface of the lap is flooded continuously with a nonabrasive cleaning fluid effective to wash clean the working surface of the lap and the lapped surfaces of the workpieces.
  • One of these methods applies to lapping machines equipped with a bonded abrasive lap, made like a grinding wheel, effective first to remove stock from workpieces and then to produce a clean lapped surface, without the use of a loose abrasive on the working surface of the lap.
  • the other method is applicable to lapping machines equipped with a metal lap, usually either cast iron or steel, to which a loose abrasive is applied.
  • this loose abrasive is usually either combined with a paste or with a liquid vehicle to form a slurry.
  • the instant invention consists of a new lapping method combining the use of a bonded abrasive lap characteristic of the first well-known method described above with the use of loose abrasive in a slurry or paste characteristic of the second well-known method described above, and also introduces the use of a nonabrasive cleaning fluid to flood the working surface of the lapping element.
  • a first source of abrasive particles is the lap itself which is selected as noted above, to be of the bonded abrasive rather than of the metallic type.
  • a second source of abrasive is a fluid reservoir containing abrasive grains in a fluid AF. The reservoir has a value V1 and nozzle N] for selectively dispensing fluid to the lap where the lap motion tends to distribute it to the lap/workpiece butting surfaces.
  • a reservoir of clear fluid CF with a valve V2 and nozzle N2 for selectively dispensing such clear fluid to the lapping region is also provided.
  • Lapping cycles are carried out with initial feed of abrasive bearing fluid via valve V1, nozzle N1 and with valve V2 closed for a predetermined period of time and the cycles are then finished off with continuous feed of nonabrasive cleaning fluid via valve V2, nozzle N2 and valve VI closed for a second predetermined period of time to wash clean the working (upper) surface of the lap and the lapped (bottom) surface of the metallic workpiece. While this drawing illustrates a single workpiece, it will be understood that multiple workpieces can be simultaneously lapped in a single lapping cycle.
  • the method of producing a clean lapped surface on a workpiece with at least one surface to be finished by lapping comprising supporting a given workpiece with its surface to be lapped in operative engagement with a working surface of a given lapping element composed of bonded abrasive material,

Abstract

A process for providing clean lapped surfaces on metallic workpieces supported in operative relation to the working surface of a bonded abrasive lap for sliding and rotary movement relative to such working surface throughout a single continuous lapping operation including a first predetermined time period during which an abrasive slurry is supplied to the working surfaces of the lap and a second predetermined time period during which the working surface of the lap is flooded continuously with a nonabrasive cleaning fluid effective to wash clean the working surface of the lap and the lapped surfaces of the workpieces.

Description

United States Patent Gamache Feb. 1, 1972 [54] LAPPING METHOD FOR METALLIC WORKPIECES [72] inventor:
[73] Assignee: Norton Company, Worcester, Mass.
[22] Filed: Dec. 3, 1969 [2]] Appl. No.: 881,867
Norman M. Gamache, Worcester, Mass.
Bullard ..Sl/l3l Norton ..5l/l3l [57] ABSTRACT A process for providing clean lapped surfaces on metallic workpieces supported in operative relation to the working surface of a bonded abrasive lap for sliding and rotary movement relative to such working surface throughout a single continuous lapping operation including a first predetermined time period during which an abrasive slurry is supplied to the working surfaces of the lap and a second predetermined time period during which the working surface of the lap is flooded continuously with a nonabrasive cleaning fluid effective to wash clean the working surface of the lap and the lapped surfaces of the workpieces.
1 Claims, 1 Drawing Figure PATENTEU FEB 11972 $638,366
I VENTOR. NORMAN M gAMACHE ATTORNEY LAPPING METHOD FOR METALLIC WORKPIECES BACKGROUND OF THE INVENTION There are two well-known lapping methods for providing lapped surfaces on metallic workpieces of various different sizes and shapes.
One of these methods applies to lapping machines equipped with a bonded abrasive lap, made like a grinding wheel, effective first to remove stock from workpieces and then to produce a clean lapped surface, without the use of a loose abrasive on the working surface of the lap.
The other method is applicable to lapping machines equipped with a metal lap, usually either cast iron or steel, to which a loose abrasive is applied. On such lapping machines, this loose abrasive is usually either combined with a paste or with a liquid vehicle to form a slurry.
SUMMARY OF THE INVENTION The instant invention consists of a new lapping method combining the use of a bonded abrasive lap characteristic of the first well-known method described above with the use of loose abrasive in a slurry or paste characteristic of the second well-known method described above, and also introduces the use of a nonabrasive cleaning fluid to flood the working surface of the lapping element.
This new lapping method is most effective when it is applied to a lapping machine equipped with a relatively hard-bonded abrasive lap, in order to avoid producing excess quantities of loose abrasives from the lap itself, particularly while the working surface of the lap is flooded with a nonabrasive cleaning fluid which may comprise a thin filtered mineral seal oil.
DRAWING The single FIGURE of drawing shows schematically a bonded abrasive lapping element (lap") which is lapping the lower surface of metallic workpiece MP.
The workpiece is held in a holder H, such as the planetary ring holder shown in Norton US. Pat. No. 2,870,580. The lapping action is accomplished by relative sliding motion between the surface to be lapped and the lap in the presence of abrasive particles. A first source of abrasive particles is the lap itself which is selected as noted above, to be of the bonded abrasive rather than of the metallic type. A second source of abrasive is a fluid reservoir containing abrasive grains in a fluid AF. The reservoir has a value V1 and nozzle N] for selectively dispensing fluid to the lap where the lap motion tends to distribute it to the lap/workpiece butting surfaces. The relative sliding motion may be of various directions but in accordance with conventional practice is shown here as rotary/planetary with the lap being driven about a major or central axis of rotation of the machine Al and the workpiece MP being driven about a second local axis A2. Details of the necessary drives and other conventional elements necessary to complete a lap machine are omitted and reference is made to said Norton patent for a description of these.
A reservoir of clear fluid CF with a valve V2 and nozzle N2 for selectively dispensing such clear fluid to the lapping region is also provided. Lapping cycles are carried out with initial feed of abrasive bearing fluid via valve V1, nozzle N1 and with valve V2 closed for a predetermined period of time and the cycles are then finished off with continuous feed of nonabrasive cleaning fluid via valve V2, nozzle N2 and valve VI closed for a second predetermined period of time to wash clean the working (upper) surface of the lap and the lapped (bottom) surface of the metallic workpiece. While this drawing illustrates a single workpiece, it will be understood that multiple workpieces can be simultaneously lapped in a single lapping cycle.
The usual requirement for interrupting the lapping operation to true the bonded abrasive lap can be avoided by applying this new lapping method to a lapping machine equipped with cast iron or other metallic conditioning rings such as those shown and described in US. Pat. Nos. 2,565,590 and 2,870,580, so that lap conditioning is a continuous process during lapping operations according to this new method.
While this new method has been described thus far as it applies to lapping machines equipped with a single lap, it is also applicable to lapping machines equipped with opposing upper and lower bonded abrasive laps arranged in the manner already well known in the art to finish workpieces on opposite sides at the same time in a single lapping operation.
What is claimed is:
l. The method of producing a clean lapped surface on a workpiece with at least one surface to be finished by lapping comprising supporting a given workpiece with its surface to be lapped in operative engagement with a working surface of a given lapping element composed of bonded abrasive material,
producing relative sliding movement between the given workpiece and the given lapping element,
supplying an abrasive slurry to the working surface of the given lapping element only during a first predetermined period of time, and then flooding the working surface of the given lapping element with a nonabrasive cleaning fluid during a second predetermined period of time sufficient to produce a clean lapped surface on the given workpiece.

Claims (1)

1. The method of producing a clean lapped surface on a workpiece with at least one surface to be finished by lapping comprising supporting a given workpiece with its surface to be lapped in operative engagement with a working surface of a given lapping element composed of bonded abrasive material, producing relative sliding movement between the given workpiece and the given lapping element, supplying an abrasive slurry to the working surface of the given lapping element only during a first predetermined period of time, and then flooding the working surface of the given lapping element with a nonabrasive cleaning fluid during a second predetermined period of time sufficient to produce a clean lapped surface on the given workpiece.
US881867A 1969-12-03 1969-12-03 Lapping method for metallic workpieces Expired - Lifetime US3638366A (en)

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US88186769A 1969-12-03 1969-12-03

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4048763A (en) * 1974-08-27 1977-09-20 Jmj Werkzeugmaschinen Gmbh Fuer Feinbearbeitung Method for surface-, plane-parallel-, and plain lapping
US4053288A (en) * 1976-03-30 1977-10-11 Barron Sr Lee H Hand fed glass beveling apparatus
EP0064136A2 (en) * 1981-05-04 1982-11-10 International Business Machines Corporation Magnetic disk substrate polishing method and polishing pad therefor
US4920700A (en) * 1987-04-30 1990-05-01 Hoya Corporation Process for finishing optical lenses and apparatus therefor
US5603654A (en) * 1994-02-14 1997-02-18 Nec Corporation Method for supplying a polishing liquid and polishing method using the same
WO1998018159A1 (en) * 1996-10-18 1998-04-30 Micron Technology, Inc. Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
US5833523A (en) * 1996-09-03 1998-11-10 Hykes; Timothy W. Variable volume coolant system
US5868608A (en) * 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US6220934B1 (en) 1998-07-23 2001-04-24 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US20090280721A1 (en) * 2008-05-07 2009-11-12 Douglas Martin Hoon Configuring of lapping and polishing machines

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US387555A (en) * 1888-08-07 cumminas
US546025A (en) * 1895-09-10 Ors of one-third to martin huonker
US1945510A (en) * 1931-10-05 1934-02-06 White S Dental Mfg Co Method of and mechanism for forming hardened steel
US2565590A (en) * 1948-03-12 1951-08-28 Earl J Bullard Lapping machine
US2870580A (en) * 1955-04-18 1959-01-27 Pacific Valves Inc Flat lapping machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US387555A (en) * 1888-08-07 cumminas
US546025A (en) * 1895-09-10 Ors of one-third to martin huonker
US1945510A (en) * 1931-10-05 1934-02-06 White S Dental Mfg Co Method of and mechanism for forming hardened steel
US2565590A (en) * 1948-03-12 1951-08-28 Earl J Bullard Lapping machine
US2870580A (en) * 1955-04-18 1959-01-27 Pacific Valves Inc Flat lapping machine

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4048763A (en) * 1974-08-27 1977-09-20 Jmj Werkzeugmaschinen Gmbh Fuer Feinbearbeitung Method for surface-, plane-parallel-, and plain lapping
US4053288A (en) * 1976-03-30 1977-10-11 Barron Sr Lee H Hand fed glass beveling apparatus
EP0064136A2 (en) * 1981-05-04 1982-11-10 International Business Machines Corporation Magnetic disk substrate polishing method and polishing pad therefor
EP0064136A3 (en) * 1981-05-04 1984-08-08 International Business Machines Corporation Magnetic disk substrate polishing method and polishing pad therefor
US4920700A (en) * 1987-04-30 1990-05-01 Hoya Corporation Process for finishing optical lenses and apparatus therefor
US5603654A (en) * 1994-02-14 1997-02-18 Nec Corporation Method for supplying a polishing liquid and polishing method using the same
US6168502B1 (en) 1996-08-13 2001-01-02 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5868608A (en) * 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5833523A (en) * 1996-09-03 1998-11-10 Hykes; Timothy W. Variable volume coolant system
US5972792A (en) * 1996-10-18 1999-10-26 Micron Technology, Inc. Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
WO1998018159A1 (en) * 1996-10-18 1998-04-30 Micron Technology, Inc. Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
US6716089B2 (en) 1998-07-23 2004-04-06 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US6368194B1 (en) 1998-07-23 2002-04-09 Micron Technology, Inc. Apparatus for controlling PH during planarization and cleaning of microelectronic substrates
US6220934B1 (en) 1998-07-23 2001-04-24 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US20040192174A1 (en) * 1998-07-23 2004-09-30 Sharples Judson R. Method for controlling PH during planarization and cleaning of microelectronic substrates
US6913523B2 (en) 1998-07-23 2005-07-05 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US20060011585A1 (en) * 1998-07-23 2006-01-19 Sharples Judson R Method for controlling ph during planarization and cleaning of microelectronic substrates
US7214125B2 (en) * 1998-07-23 2007-05-08 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US20090280721A1 (en) * 2008-05-07 2009-11-12 Douglas Martin Hoon Configuring of lapping and polishing machines
US8123593B2 (en) * 2008-05-07 2012-02-28 Zygo Corporation Configuring of lapping and polishing machines

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Owner name: PRATT & WHITNEY COMPANY, INC., THE, CHARTER OAK BL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:WARNER & SWASEY COMPANY, THE;REEL/FRAME:004993/0091

Effective date: 19880706