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US3608711A - Package for electronic devices and the like - Google Patents

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Publication number
US3608711A
US3608711A US3608711DA US3608711A US 3608711 A US3608711 A US 3608711A US 3608711D A US3608711D A US 3608711DA US 3608711 A US3608711 A US 3608711A
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Grant
Patent type
Prior art keywords
tape
package
according
stratum
fragile
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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Inventor
Mordechai Wiesler
John S Maclntyre
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Teledyne Inc
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Teledyne Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets, or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling

Abstract

Small, fragile products such as transistors, diodes and integrated-circuit dice are packaged on a tape which may be indexed through various production stages. The tape is formed with spaced apertures closed on one side by means of a pressuresensitive adhesive wall bonded to one side of the tape. Devices are dropped onto the wall and adhere thereto. Sprocket holes are formed along the marginal edge of the tape for engagement with an indexing drive mechanism.

Description

United States Patent [72] lnventors Mordeehai Wiesler Lexington; John S. Maclntyre, Lynntield, both 01 Mass.

[211 App]. No. 866,793

[22] Filed Oct. 6, 1969 [45] Patented Sept. 28, 1971 [73 Assignee Teledyne, Inc.

Hawthorne, Calif.

- Continuation-impart of application Ser. No.

665,635, Sept. 5, 1967, now Patent No. 3,497,948,'dated Mar. 3, 1970, and a continuation-in-part of 785,209, Dec. 19, 1968.

[54] PACKAGE FOR ELECTRONIC DEVICES AND THE Primary Examinerwilliam T. Dixson, Jr. Attorney-Morse, Altman & Oates ABSTRACT: Small, fragile products such as transistors,

diodes and integrated-circuit dice are packaged on a tape which may be indexed through various production stages. The tape is formed with spaced apertures closed on one side by means of a pressure-sensitive adhesive wall bonded to one side of the tape. Devices are dropped onto the wall and adhere thereto. Sprocket holes are formed along the marginal edge of the tape for engagement with an indexing drive mechanism.

LIKE I 1 Claims, 5 Drawing Figs.

[52] US. Cl 206/56 A [51] Int. Cl. B65d85/30, B65d 73/02 l4 [IO PATENTEU SEP28 I97! FIGQ2 FIG.4

E113 m ning INVENTORS MORDECHAI WIESLER JOHN S. MACINTYRE ATTORNEYS PACKAGE FOR ELECTRONIC DEVICES AND THE LIKE CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation-in-part of U.S. application Ser. No. 665,635 filed Sept. 5, 1967 entitled Method & Apparatus for Sorting Semiconductor Devices, now U.S. Pat. No. 3,497,948 dated Mar. 3, 1970 and of U.S. application Ser. No. 785,209 filed Dec. 19, 1968 entitled Die Sorting System," both applications being commonly assigned to the assignee of the present application.

Background of the invention 1. Field of the invention This invention relates generally to the packaging of small, fragile products such as electronic devices and more particularly is directed towards a new and improved package for use in the testing, sorting and packaging of individual semiconductive dice formed from monolithic wafers.

2. History of the Prior Art in the production of semiconductive devices, particularly integrated circuits, there has been a need for a simple and efficient packaging system. Integrated-circuit dice are extremely small, light and fragile and heretofore have presented problems in handling and packaging by reason of their physical characteristics. It is an object of the present invention to provide a packaging system for small, fragile products and particularly semiconductor dice wherein the dice may be individually packaged for convenient storage and handling or for transfer operations from stage to stage in an assembly process.

Summary of the Invention This invention features a package for fragile devices such as semiconductive dice and is comprised of a flexible strip of material of a thickness exceeding that of the device to be packaged and fonned with longitudinally spaced openings, closed on one side by means of a pressure sensitive wall on which the device is deposited and held. Sprocket holes are provided for indexing the tape through a feed mechanism. The tape may be rolled up for storage or shipment without damage to the parts.

Detailed Description of the Drawings FIG. 1 is a fragmentary view in perspective showing a section of packaging tape made according to the invention,

FIG. 2 is a view in side elevation thereof,

FlG. 3 is a sectional view in side elevation thereof,

FIG. 4 is a cross-sectional view taken along the line 4-4 of FIG. 1, and,

H6. 5 is a top plan view thereof.

Detailed Description of the preferred Embodiment Referring now to the drawings the reference character generally indicates a small fragile product such as an integrated circuit die packaged by a tape 12 for storage, shipment or transfer through processing and assembling stations. The tape 12 is characterized by a plurality of openings 14 evenly spaced along the length of the tape 12 and each of a size sufficient to receive a device 10. Applied to the rear or bottom face of the tape 12 is a stratum 16 of pressure-sensitive adhesive which closes one side of e openings 14 to form a pocket for the part 10. The adhesive serves not only to bond the stratum 16 to the bottom face of the tape but also serves as a mounting means for holding the part 10 in position once deposited in the pocket.

Formed along one marginal edge of the tape 12 are sprocket holes 18 for engaging a driving sprocket wheel in an indexing mechanism by which the tape is advanced longitudinally through various assembly stations.

In practice, the tape 12 is of a thickness at least equal to and preferably greater than the thickness of the part 10 which is packaged. As best shown in FIG. 3 this feature will provide clearance between the top of the part 10 and the upper surface of the tape. Thus the top surface of the part 10 will be protected against abrasion or the like should the tape be wound up into a roll insofar as the top will not contact a facing convolution of the rolled tape, it is also desirable that the opening 14 be somewhat larger than the lateral dimensions of the part 10, not only to permit receiving a wide range in sizes of parts, but also to provide clearance for transfer mechanisms and the like employed to deposit parts in the pockets and remove the same therefrom.

While various materials including metal may be employed for the tape 12a polyester such as sold under the trademark MYLAR has been found to be particularly satisfactory since it provides longitudinal stability, provides protection against crushing, distortion and the like and is easy to handle, particularly with respect to threading the tape to an indexing mechanism.

The stratum 16 preferably is quite thin and its adhesive layer should have low tack characteristics suflicient to hold the part in position during handling yet permit a clean, easy release of the part when required. A polyvinyl chloride stratum 16 of perhaps 1.5 mils thickness and an adhesive stratum of low tack characteristics also 1.5 mils thickness may be employed to advantage. Typically the die 10 will range in size from 4 to 6 mils in thickness and perhaps 15 mils square to 40 X60 mils.

The tape 12 should therefore exceed the 6 mils thickness of the part and may be on the order of 10 inils or so, for example.

The openings 14 may be circular as shown or may be of other configurations such as square, for example. The pressure-sensitive stratum 16 preferably is narrower in width than the tape 12 to leave the sprocket hole margin of the tape clear for free access to the sprocket holes.

Some pressure-sensitive adhesives lose most of their tackiness at low temperatures although a small release force may still be required. While cold release is not necessary it may be found useful in certain applications, Adhesives of this nature must exhibit a marked change in viscosity with temperature. in this way a soft tacky material can be frozen into a hard brittle one. Certain combinations of polymers and tackifier resins are well suited for the formation of these adhesives.

The polymers must be thermoplastic; that is they must soften when heated and harden when cool. The ethylene vinyl acetate copolymer such as Dupont Elfax resins are thermoplastic materials which are quite suitable for this particular application. The tackifier resins also must be themtoplastic. It has been found that the combination of two resin derivatives, namely Staybilite, Ester 3 and Staybilite Ester 10 works well, these products being made by Hercules Powder Co. Optimum formulation has been found to be 30 parts by weight of Elfax 150, 10 parts by weight of Staybilite Ester 3, and 60 parts by weight of Staybilite Ester 10.

The ingredients are first blended in a molten state at 300 F. and then dissolved in a toluene for coating on the tape. A 30 percent solution is used for coating and an adhesive film between 0.75 and 1.0 mils works well.

Numerous modifications may be made to the invention. For example, sprocket drive holes can be provided along both margins of the tape and multiple rows of pockets for the parts 10 may be provided Also, while a top cover is not necessary it may be found useful to apply a pressure-sensitive adhesive ply to the top of the tape once the parts have been deposited in their respective pockets, the cover tape, of course, having to be removed prior to removal of the part. Further, in place of through holes closed by the adhesive ply to form pockets, the tape may be formed with spaced depressions and a patch of adhesive deposited at bottom thereof.

Having thus described the invention what I claim and desire to obtain by Letters Pat. of the U.S. is:

l. A package for fragile objects such as integrated circuit dice and the like, comprising:

a. a longitudinally flexible elongated tape formed with a plurality of spaced pockets in one face thereof, each said pocket defining an opening larger than the lateral dimension of each said fragile object, each said pocket having a depth at least equal to the thickness of each said fragile object; and

b. an adhesive stratum disposed in each said pocket for mounting said fragile object depositing therein, each said fragile object secured within each said respectively, by said adhesive stratum.

2. A package according to claim 1 wherein said stratum is pressure sensitive.

3. A package according to claim 1 wherein said tape is formed with sprocket holes spaced lengthwise along said tape.

4. A package according to claim 1 wherein said tape is formed with openings spaced along said tape and a stratum of pressure sensitive adhesive tape is mounted along one face of the tape to close one side of said opening to form said pockets.

5. A package according to claim 1 wherein said tape is plastic.

6. A package according to claim 1 wherein said tape is metal.

7. A package according to claim 5 wherein said plastic is polyester.

8. A package according to claim 6 wherein said metal is stainless steel.

9. A package according to claim 1 including a removable stratum applied to said tape over the pocket openings.

10. A package according to claim 2 wherein said stratum is of a low tack characteristic.

11. A package according to claim 1 wherein the depth of said pockets is greater than the thickness of said objects.

Claims (11)

1. A package for fragile objects such as integrated circuit dice and the like, comprising: a. a longitudinally flexible elongated tape formed with a plurality of spaced pockets in one face thereof, each said pocket defining an opening larger than the lateral dimension of each said fragile object, each said pocket having a depth at least equal to the thickness of each said fragile object; and b. an adhesive stratum disposed in each said pocket for mounting said fragile object depositing therein, each said fragile object secured within each said pocket, respectively, by said adhesive stratum.
2. A package according to claim 1 wherein said stratum is pressure sensitive.
3. A package according to claim 1 wherein said tape is formed with sprocket holes spaced lengthwise along said tape.
4. A package according to claim 1 wherein said tape is formed with openings spaced along said tape and a stratum of pressure sensitive adhesive tape is mounted along one face of the tape to close one side of said opening to form said pockets.
5. A package according to claim 1 wherein said tape is plastic.
6. A package according to claim 1 wherein said tape is metal.
7. A package according to claim 5 wherein said plastic is polyester.
8. A package according to claim 6 wherein said metal is stainless steel.
9. A package according to claim 1 including a removable stratum applied to said tape over the pocket openings.
10. A package according to claim 2 wherein said stratum is of a low tack characteristic.
11. A package according to claim 1 wherein the depth of said pockets is greater than the thickness of said objects.
US3608711A 1969-10-06 1969-10-06 Package for electronic devices and the like Expired - Lifetime US3608711A (en)

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Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695414A (en) * 1970-11-27 1972-10-03 Teledyne Inc Die sorting system
US3698076A (en) * 1970-08-03 1972-10-17 Motorola Inc Method of applying leads to an integrated circuit
US3858721A (en) * 1971-10-01 1975-01-07 Western Electric Co Loading of compliant tape
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3871945A (en) * 1973-03-12 1975-03-18 Ferranti Packard Ltd Magnetically actuable element
US3871936A (en) * 1971-10-01 1975-03-18 Western Electric Co Loading of compliant tape
US3920121A (en) * 1972-04-13 1975-11-18 Minnesota Mining & Mfg Electric terminal carrier tape and method of manufacture
US4015708A (en) * 1975-11-21 1977-04-05 Gould Inc. Button cell storage and merchandising package
US4069916A (en) * 1976-06-01 1978-01-24 Western Electric Co., Inc. Tape for holding electronic articles
US4099615A (en) * 1974-08-22 1978-07-11 Amp, Incorporated Carrier strip mounted electrical components
DE2821623A1 (en) * 1977-05-19 1978-11-23 Tdk Electronics Co Ltd Behaeltnisrohstueck and aufnahmebehaeltnis for on a strip mounted electronic components
US4193287A (en) * 1978-03-30 1980-03-18 Fairchild Camera And Instrument Corporation Technique for applying polarizer material to liquid-crystal displays
DE2949196A1 (en) * 1978-12-26 1980-07-03 Murata Manufacturing Co Cradle for electronic components in chip form and process or the like to serially provision of such devices for manufacturing processes.
FR2489789A1 (en) * 1980-09-08 1982-03-12 Philips Nv Package of electrical parts and / or electronic
FR2489790A1 (en) * 1980-09-08 1982-03-12 Philips Nv Packaging for electrical components and / or electronic
US4354337A (en) * 1979-03-05 1982-10-19 Matsushita Electric Industrial Co., Ltd. Apparatus for packaging electrical circuit components
US4450959A (en) * 1980-10-30 1984-05-29 Siemens Aktiengesellschaft Packaging for electrical components
JPS6063995A (en) * 1984-07-13 1985-04-12 Murata Manufacturing Co Chip type electronic part containing strip
GB2151578A (en) * 1983-12-19 1985-07-24 Murata Manufacturing Co Tape-mounted electronic components assembly
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
US4724958A (en) * 1985-12-28 1988-02-16 Murata Manufacturing Co., Ltd. Tape-like electronic component package
EP0300838A1 (en) * 1987-07-24 1989-01-25 LINTEC Corporation Cover tape for sealing the chip-holding parts of a carrier tape
US4805771A (en) * 1986-07-17 1989-02-21 Siemens Aktiengesellschaft Belt for machine delivery of piece goods, especially electrical components and modules in automatic circuit board assembly machines
US4887981A (en) * 1987-11-25 1989-12-19 Augat Inc. Electronic socket carrier system
US4898275A (en) * 1989-05-25 1990-02-06 Minnesota Mining And Manufacturing Company Non nesting component carrier tape
US5025923A (en) * 1983-02-28 1991-06-25 Tokujiro Okui Package for electronic parts
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5284790A (en) * 1990-01-03 1994-02-08 Karpinski Arthur A Method of fabricating monolithic laser diode array
GB2291859A (en) * 1994-08-05 1996-02-07 Yugen Kaisha Studio Unit Device for adhesively holding an article
GB2294678A (en) * 1994-10-20 1996-05-08 Thomas & Betts Corp Methods of enabling articles to be transported
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5667073A (en) * 1994-06-23 1997-09-16 Okui; Tokujiro Carrier tape for storage use of electronic components
US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US5769237A (en) * 1996-07-15 1998-06-23 Vichem Corporation Tape carrier for electronic and electrical parts
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US5908114A (en) * 1997-09-09 1999-06-01 Gelpak, Llc Tape carrier for electronic and electrical parts
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US6357594B1 (en) 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
DE10044418A1 (en) * 2000-09-08 2002-04-18 Siemens Ag Pick-and-belt, pick-and-extraction device and method for removing fitting elements of a pick-and-belt
US6389672B1 (en) * 1996-05-10 2002-05-21 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
US6554137B1 (en) * 1999-02-05 2003-04-29 Agere Systems Inc. Device and method for protecting electronic component
US6606789B2 (en) * 2000-04-19 2003-08-19 Telefonaktiebolaget Lm Ericsson (Publ) Method and apparatus in a production line
US6655021B2 (en) * 2000-04-06 2003-12-02 Telefonaktiebolaget Lm Ericsson (Publ) Method and apparatus for improving mounting
US20040025329A1 (en) * 2002-08-07 2004-02-12 Belt James G. Apparatus and method for producing a pre-loaded display strip
US20040099626A1 (en) * 2002-11-22 2004-05-27 Belt James G. Display strip
US20050039845A1 (en) * 2003-08-22 2005-02-24 James Belt Apparatus and method for producing a pre-loaded display strip
US7097040B1 (en) * 2005-08-05 2006-08-29 Charles Gutentag Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components
US20110114450A1 (en) * 2009-11-18 2011-05-19 Ev Group E. Thallner Gmbh Transport system for accommodating and transporting flexible substrates
US8132673B1 (en) * 2008-03-07 2012-03-13 Charles Gutentag Method and apparatus for retention of small components on adhesive backed carrier tape

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US2963805A (en) * 1957-09-03 1960-12-13 Boeing Co Porcelain enameled foil labels
US3047144A (en) * 1960-10-10 1962-07-31 Joseph A Wissel Ad-token card
US3335852A (en) * 1962-12-20 1967-08-15 Nippon Electric Co Mounting assembly supporting semiconductor devices
US3339719A (en) * 1965-10-12 1967-09-05 Thomas & Betts Co Inc Terminal tape
US3465874A (en) * 1967-06-12 1969-09-09 Frances Hugle Carrier for semiconductor devices
US3494459A (en) * 1968-06-10 1970-02-10 Fluoroware Inc Carrier for integrated circuit chips

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US2963805A (en) * 1957-09-03 1960-12-13 Boeing Co Porcelain enameled foil labels
US3047144A (en) * 1960-10-10 1962-07-31 Joseph A Wissel Ad-token card
US3335852A (en) * 1962-12-20 1967-08-15 Nippon Electric Co Mounting assembly supporting semiconductor devices
US3339719A (en) * 1965-10-12 1967-09-05 Thomas & Betts Co Inc Terminal tape
US3465874A (en) * 1967-06-12 1969-09-09 Frances Hugle Carrier for semiconductor devices
US3494459A (en) * 1968-06-10 1970-02-10 Fluoroware Inc Carrier for integrated circuit chips

Cited By (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698076A (en) * 1970-08-03 1972-10-17 Motorola Inc Method of applying leads to an integrated circuit
US3695414A (en) * 1970-11-27 1972-10-03 Teledyne Inc Die sorting system
US3858721A (en) * 1971-10-01 1975-01-07 Western Electric Co Loading of compliant tape
US3871936A (en) * 1971-10-01 1975-03-18 Western Electric Co Loading of compliant tape
US3920121A (en) * 1972-04-13 1975-11-18 Minnesota Mining & Mfg Electric terminal carrier tape and method of manufacture
US3871945A (en) * 1973-03-12 1975-03-18 Ferranti Packard Ltd Magnetically actuable element
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4099615A (en) * 1974-08-22 1978-07-11 Amp, Incorporated Carrier strip mounted electrical components
US4015708A (en) * 1975-11-21 1977-04-05 Gould Inc. Button cell storage and merchandising package
US4069916A (en) * 1976-06-01 1978-01-24 Western Electric Co., Inc. Tape for holding electronic articles
DE2821623A1 (en) * 1977-05-19 1978-11-23 Tdk Electronics Co Ltd Behaeltnisrohstueck and aufnahmebehaeltnis for on a strip mounted electronic components
US4193287A (en) * 1978-03-30 1980-03-18 Fairchild Camera And Instrument Corporation Technique for applying polarizer material to liquid-crystal displays
DE2949196A1 (en) * 1978-12-26 1980-07-03 Murata Manufacturing Co Cradle for electronic components in chip form and process or the like to serially provision of such devices for manufacturing processes.
US4354337A (en) * 1979-03-05 1982-10-19 Matsushita Electric Industrial Co., Ltd. Apparatus for packaging electrical circuit components
FR2489789A1 (en) * 1980-09-08 1982-03-12 Philips Nv Package of electrical parts and / or electronic
FR2489790A1 (en) * 1980-09-08 1982-03-12 Philips Nv Packaging for electrical components and / or electronic
DE3135075A1 (en) * 1980-09-08 1982-03-25 Philips Nv "Packaging for electrical and / or electronic elements"
US4406367A (en) * 1980-09-08 1983-09-27 U.S. Philips Corporation Package for electrical and/or electronic components
US4450959A (en) * 1980-10-30 1984-05-29 Siemens Aktiengesellschaft Packaging for electrical components
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
US5025923A (en) * 1983-02-28 1991-06-25 Tokujiro Okui Package for electronic parts
GB2151578A (en) * 1983-12-19 1985-07-24 Murata Manufacturing Co Tape-mounted electronic components assembly
JPS6063995A (en) * 1984-07-13 1985-04-12 Murata Manufacturing Co Chip type electronic part containing strip
JPH0321428B2 (en) * 1984-07-13 1991-03-22 Murata Manufacturing Co
US4724958A (en) * 1985-12-28 1988-02-16 Murata Manufacturing Co., Ltd. Tape-like electronic component package
US4805771A (en) * 1986-07-17 1989-02-21 Siemens Aktiengesellschaft Belt for machine delivery of piece goods, especially electrical components and modules in automatic circuit board assembly machines
US5064064A (en) * 1987-07-24 1991-11-12 Lintec Corporation Cover tape for sealing chip-holding parts of carrier tape
US4929486A (en) * 1987-07-24 1990-05-29 Fsk Kabushiki Kaisha Cover tape for sealing chip-holding parts of carrier tape
US4994300A (en) * 1987-07-24 1991-02-19 Lintec Corporation Method of making a cover tape for sealing chip-holding parts of carrier tape
EP0300838A1 (en) * 1987-07-24 1989-01-25 LINTEC Corporation Cover tape for sealing the chip-holding parts of a carrier tape
US4887981A (en) * 1987-11-25 1989-12-19 Augat Inc. Electronic socket carrier system
US4898275A (en) * 1989-05-25 1990-02-06 Minnesota Mining And Manufacturing Company Non nesting component carrier tape
US5284790A (en) * 1990-01-03 1994-02-08 Karpinski Arthur A Method of fabricating monolithic laser diode array
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5667073A (en) * 1994-06-23 1997-09-16 Okui; Tokujiro Carrier tape for storage use of electronic components
GB2291859A (en) * 1994-08-05 1996-02-07 Yugen Kaisha Studio Unit Device for adhesively holding an article
GB2294678A (en) * 1994-10-20 1996-05-08 Thomas & Betts Corp Methods of enabling articles to be transported
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US6389672B1 (en) * 1996-05-10 2002-05-21 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
US5769237A (en) * 1996-07-15 1998-06-23 Vichem Corporation Tape carrier for electronic and electrical parts
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US5908114A (en) * 1997-09-09 1999-06-01 Gelpak, Llc Tape carrier for electronic and electrical parts
US6357594B1 (en) 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US6554137B1 (en) * 1999-02-05 2003-04-29 Agere Systems Inc. Device and method for protecting electronic component
US6655021B2 (en) * 2000-04-06 2003-12-02 Telefonaktiebolaget Lm Ericsson (Publ) Method and apparatus for improving mounting
US6606789B2 (en) * 2000-04-19 2003-08-19 Telefonaktiebolaget Lm Ericsson (Publ) Method and apparatus in a production line
DE10044418A1 (en) * 2000-09-08 2002-04-18 Siemens Ag Pick-and-belt, pick-and-extraction device and method for removing fitting elements of a pick-and-belt
DE10044418C2 (en) * 2000-09-08 2002-09-19 Siemens Ag Pick-and-extraction device and method for removing fitting elements of a pick-and-belt
US20040025329A1 (en) * 2002-08-07 2004-02-12 Belt James G. Apparatus and method for producing a pre-loaded display strip
US6929132B2 (en) 2002-11-22 2005-08-16 James G. Belt Display strip
US20040099626A1 (en) * 2002-11-22 2004-05-27 Belt James G. Display strip
US20050039845A1 (en) * 2003-08-22 2005-02-24 James Belt Apparatus and method for producing a pre-loaded display strip
US7318876B2 (en) 2003-08-22 2008-01-15 James Belt Apparatus and method for producing a pre-loaded display strip
US7097040B1 (en) * 2005-08-05 2006-08-29 Charles Gutentag Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components
US8132673B1 (en) * 2008-03-07 2012-03-13 Charles Gutentag Method and apparatus for retention of small components on adhesive backed carrier tape
US20110114450A1 (en) * 2009-11-18 2011-05-19 Ev Group E. Thallner Gmbh Transport system for accommodating and transporting flexible substrates
US8931624B2 (en) * 2009-11-18 2015-01-13 Ev Group E. Thallner Gmbh Transport system for accommodating and transporting flexible substrates

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