US3298886A

US3298886A - Process and apparatus for manufacturing mosaics

Info

Publication number: US3298886A
Application number: US255894A
Authority: US
Inventors: Vevoda Ernest
Original assignee: Soule Steel Co
Current assignee: Soule Steel Co
Priority date: 1963-02-04
Filing date: 1963-02-04
Publication date: 1967-01-17
Anticipated expiration: 1984-01-17

Description

Jan.v17,1967 I E. vEvoDA 3,293,886

l PROCESS AND APPARATUS 4FOR MANUFACTURING MosAlcs Filed Feb.. 4, 1965 4 Sheets-Sheet l INVENTOR. ERNEST VEVODA Janfl?, 1967 E. vEvonA 3,298,886

v PROCESS AND APPARATUS FOR MANUFACTURING MOSAICS Filed Feb. 4, 196s 4 sheets-sheet 2 A INVENTOR` .A ERNESTV vEvoDA n BY 'A KZMR'MM f ATTORNEYS I Jan. 17, 1967l E, 'VEVQDA 3,298,886

v PROCESS AND APPARATUS FOR MANUFACTURING MOSAICS Filed Feb. 4, 1965 v 4 Sheets-Sheet 5 67 hQ8 l j 707 INVENTOR. ERNEST vEvoDAf BY v ""md'm l? mfr/M ATTORNEYS E. VEVODA PROCESS AND APPARATUS FOR MANUFACTURING MOSAIGS Filed Feb. 4, 196s 4 Sheefs-Sheet 4 K INVENTOR. `ERNEST .VEVODA BY ATToRNL-:Ysf

United States Patent G Ernest This invention relates to the manufacture of mosaics. More particularly it relates to an improvement in the method for arranging mosaic chips into a mosaic pattern andV for atiixng the permanent substrate or backing to the individual chips or. tiles. It also relates to apparatus for doing the same. K i

Previously, it has been the` practice in making mosaics to arrange the mosaic chips in the desired pattern in a single plane and then apply a temporary backing such as kraft paper to one surface of the mosaic chips with lan adhesive. The chips with the temporary backing were then turned over and eventually a permanent backing was applied to the other surface of the chips.

'This two-step procedure was necessary Ibecause beforel the chips are attached to some type of substrate, they are subject to dislocation by any slight movement. For example, one of the common types of permanent backing employed is a cement asbestos board. If the chips had heretofore not been first fixed in relative positions by adhesion to a temporary backing paper, when the cement asbestos board was placed in position against the chips, some of the chips would become dislocated and cause disarray to the mosaic pattern. This is due to the fact that thecement asbestos board is normally flexible and it'has not Vbeen possible to place the board in contact with all of the mosaic chips simultaneously. The contact of the board against some of the tiles would jar the remaining tiles out of their appropriatepositionsbefore being contacted with the board. On the other hand, when a temporary backing such as kraft-paper is employed, the extreme flexibility of the paper permits its positioning on the pattern.

lThis prior two-step procedure has several disadvantages. First, as the' term implies it involves two steps and is, therefore, both. costly'and time-consuming as compared with a single step procedure where the permanent backing is applied directly to the chips'. In addition, where the two-step procedure with the temporary backing is employed, the temporary backing must ultimately be physically removed to expose the finished mosaic.v In ef,- fect then, the two-step procedure requires three steps with the third step comprising removal of the temporarylbacking. Further, with this two-step laminating combination,there is a danger of air entrapment when the permanent backing Vis applied while the kraft paper is still in place on the opposite side of the chips. This can lead to a poor bond between the chips and the permanent backing. Finally, the two-step method requires two different coats of laminating resin or the like-one for the the temporary backing and the other for the permanent backing.

chips witho'ut disturbing the mosaic The present invention avoids the disadvantages'of the l prior practices in that it permits the direct positioning ofthe permanent ,backing against the mosaic chips without the necessity of using `and `subsequently removing a lCC Thev present invention also provides a new Way for positioning the individual mosaic chips into a single plane or layer to define a mosaic pattern so that the permanent backing member may be affixed thereto by the aforementioned technique or by any other. The method and apparatus for accomplishing this end is characterized by speed made possible by semi-continuous operation, and efficiency in arranging the chips in proper location without jamming.

Thus in the preferred embodiment of the present invention, there is provided an improved method -of forming mosaics including the steps of positioning a plurality of mosaic chips in a common plane to define a mosaic pattern by providing a controlled flow of chips onto a moving web in a single layer and providing a tunnel having one closed end and a height approximately equal to the thickness of the .layer of chips. The web with the chips resting thereon is moved through the tunnel along its bottom end under the closed end thereof so that the chips on the web are stopped by the closed end of the tunnel and retained therein. The closed tunnel end and the chips initially stopped also serve to` stop subsequent chips moved by the web while the impact of chip upon chip and tunnel serve to shift the chips into a closely spaced mosaic pattern on the web. The mosaic pattern on the web is then transferred from the web to a generally fiat horizontal surface. A permanent normally fiexible backing member is provided having opposing first and second fiat surfaces and adhesive on the first flat surface thereof. The backing member is supported substantially uniformly over its second fiat surface with a vacuum plate so that said entire first flat adhesive surface lies substantially in'a single plane. The first fiat adhesive surface is moved, while continuing to support the backing member, parallel to the mosaic pattern on 4the horizontal surface and into parallel bonding contact therewith. The chips may then be further caused to adhesively unite themselves in fixed mosaic pattern to said first flat adhesive surface. Further, as in prior procedures, cementitious grouting may be placed between the chips along withother conventional finishing steps.

The foregoing method, and apparatus provided by the present invention that is suitable for use with the method, are more specifically illustrated in the accompanying drawings where there-is shown in FIG. 1 schematically i `in side section, part of a pair of glass plates for positioning the mosaic -chips in a single plane withv chips therebetween.

FIG. 2 shows schematically in side section, apparatus for practicing the present method including the means for moving the mosaic backing into position against the mosaic chips.

FIG. 2a shows schematically in side section an alternate embodiment for positioning the backing against the temporary backing material. The gist of this aspect `of the present invention lies in supporting the permanent backing parallel to the chips substantially uniformly'over` its surface so that all of the ceramic chips simultaneously contact `the permanent backing. As a result, none of the chips are jarred out of position by piecemeal contact between the chips` and the backing.

chips.

FIG. 3 shows schematically in side section the position of part of the vacuum plate after the backing has been moved into contact with the mosaic chips.

FIG. 4 shows schematically in side section the apparatus of FIG. 3 but wherein the apparatus is turned upside down.

FIG. 5` shows schematically in'side section part of -a mosaic in position on permanent backing after both glass plates have been moved.

FIG. 6 shows schematically in side elevation a portion of the present apparatus for making mosaics relating to the positioning of individual chips into a mosaic pattern occupying .a single layer.l

FIG. 7 `shows schematically a top view of the apparatus illustrated in FIG. 6.

FIG. 8 shows schematically in sidek elevation that portion of the present apparatus to be joined to the left side Patented Jan. 17, 1967 of the apparatus of FIG. 6 and including the swinga-ble surface for transferring chips from the conveyor belt and a vacuum belt similar to th-at illustrated in FIG. 2a for cooperation With the swingable surface.

FIG. 9 shows schema-tically in top elevation the apparatus of FIG. 8 and particularly illustrates the pivoting of the transfer surface and vacuum plate.

The :aspect of the process dealing with the direct joining of the permanent backing in one step to the mosaic pattern is illustrated particularly in FIGS. 1-5. A 'plurality of glass or ceramic or other suitable type of mosaic chips `10 are confined within a single plane and arranged in a mosaic pattern. One specific method for so arranging these ceramic chips 10 is illustrated by FIGS. 6-9 and will be described in detail hereinafter. However, any technique for accomplishing the desired arrangement may be employed.

In the embodiment illustrated in FIGS. 1-5 the chips 10 are confined in a single plane between two glass plates 11 `and 12. It should be obvious that the plates need not be glass but may be any rigid plates suitably having polished planar surfaces and also having the necessary resistance to abrasion :and a low coefficient of friction.

' The chips 10 may be disposed between the glass plates 11 and 12 by the process described and illustrated in United States Patent No. 2,949,689 to Vida patented August 23, 1960.

After the chips 10 have been disposed in one common plane as in FIG. 1, the first or upper glass plate 11 is removed so that the 4chips 10 are supported solely on the lower or bottom plate as shown in FIGS. 2 and 2a.

A suitable permanent backing for t-he mosaic chips 10 is. provided. Preferably, the backing is :a cement asbestos board and such will be used for illustration. However, other suitable materials such las sheet materials includling metals like sheet aluminum, whether fiexible or relatively more rigid like the cement asbestos board and including materials such las Wood fiberboard, plywood, precast concrete slab and the like, could also be used as will be obvious to those skilled in the art.

Cement asbestos board 13 has first fiat surface 13a and second fiat surface 13b and a suitable adhesive layer 14 on the first fiat surface 13a thereof. Any suitable adhesive is used for this purpose. Preferably, the adhesive is -made from a polyester resin and may include an inorganic filler and =a pigment. A number of other suitable adhesives or binding materials can be compounded from various resins such :as polyester and epoxy resins and they can be filled, pigmented a-nd/or reinforced wit'h fibers as conditions may require. In like manner, the adhesive material may be a modified Portland cement bond coat which can be used on certain types of backing materials particularly where fire-resistant qualities in the finished mosaic panel are desired.

In order to directly position the permanent backing on the ceramic chips 10 without disturbing any portion of the mosaic configuration, cement asbestos board 13 is uniformly supported over substantially entirely its second fiat surface 13b". The uniform support here illustrated comprises a vacuum plate 15 linked to an alternate source of vacuum and pressure 16 by fiexible conduit 17. When source 16 is actuated for vacuum, it applies a negative pressure over second surface 13b of cement asbestos board 13 through a plurality of channels 18. Channels 18 are defined by a plurality of dividers 34 in vacuum plate 15 and lare distributed so that channels 18 uniformly cover a major portion of the surface 13b of cement asbestos board 13. Channels 18 thereby define a plurality of orifices on the surface of vacuum plate 15 at the interface with second surface 13b, with each orifice having the function of a suction cup. Consequently, cement asbestos board 13 may be supported so that adhesive layer 14 on first surface 13a of cement board 13 may be caused to lie substantially in one com-mon plane. If adhesive layer 14 is placed in one common plane land then moved into parallel bonding contact with mosaic chips 10, mosaic chips 10 will all be simultaneously adhered to cement asbestos board 13 and will keep their mosaic. configuration.

This may be accomplished by any suitable method such as one of the two alternative methods illustrated in FIGS. 2 and 2a. In FIG. 2 vacuum plate 15 is supported over chips 10. Vacuum plate 15 is mounted parallel to and over supporting surfacel 20 by suitable attachment to beam 35. Bea-m -35 is in turn supported at opposite ends on cylinders 21 and 22 within which hydraulic pistons 23, 24 reciprocate respectively. (Beam 35 may of course be actua-ted other ways-such as electrically or pneu-matically instead of hydraulically.) Pistons 23, 24 are Vfixed to beam by connecting rods 25 and 26 respectively. Pistons 23 and 24 are suitably actuated wit-hin cylinders 21 and 22 hydraulically for .simultaneous and coordinated up and down motion in conventional fashion from a source of hydraulic fiuid under pressure (not shown).

When pistons 23 and 24 are urged downwardly, cement asbest-os board 13 (which has been uniformly supported over chips 10 by vacuum plate 15 as described above) is moved downwardly normal to chips 10 and into parallel contact therewith. (Alternatively, surface 20 could be moved upwardly.) After bonding contact has been made between cement asbestos board 13 and chips 10, the negative pressure applied to board 13 by plate 15 for uniform support may be released and vacuum plate 15 moved upwardly out of contact with board 13 by reversing the hydraulic pressure in cylinders 21 and 22 and moving pistons 23 and 24 upwardly. Chips 10 have therefore been adhered t-o board 13 by adhesive ilayer 14 and may be further treated as described hereinafter.

In a preferred procedure, before vacuum plate 15 is moved upwardly the negative pressure applied by plate 15 is released and positive pressure is supplied from alternate vacuum and pressure source 16 to plate 15. The positive pressure applied from plate 15 to board 13 serves to cause -a positive bond between chips 10 and adhesive layer 14. This eliminates all chance of failure of some of the chips 10 to adhere to board 13 when brought into contact with adhesive `layer 14. Positive pressure can also lbe applied from the hydraulic apparatus described.

In the alternate embodiment shown in FIG. 2a, board 13 is placed in parallel bonding contact with chips 10 by swinging board 13 about fixed point 27. Chips 10 on plate 12 are placed on a suitable supporting surface 28. Board 13 with its adhesive layer 14 are supported by vacuum plate 15 as above. Vacuum plate 15 is again linked to alternate vacuum and pressure source 16 by conduit 17. In this case, however, vacuum plate 15 is bolted to pivot arm 29 by bolts 19. Pivot larm 29 is pivotable about shaft 30 running through fixed point 27.

Shaft 30 and pivot arm 29 arevin turn supported by first upright arm 31. First upright arm 31 is slidably and releasably locked to second upright arm 32 by bolt 33 fixed to arm 32 and passing through vertical slot 31a in upright arm 31 and threaded to nut 33a. Consequently, if nut 33a is loosened, first upright arm 31 may be moved up or down vertically to thereby select a suitable height for vacuum pl-ate 15 and cement asbestos board 13 and fixed by tightening nut 33a. The vertical height selected will depend upon the thickness of plate 12 and the resulting height of mosaic chips 10. When pivot arm 29 is pivoted about shaft 30, board 13 will be swung parallel to chips 10 and into parallel bonding contact therewith.

After moving board 13 into parallel bonding contact with chips 10 through adhesive layer 14, the various memtop and vacuum plate 15 is now on bottom as illustrated in FIG. 4. By removing plate 12 as illustrated in FIG. 5,

chips are exposed, Suitably, chips 10 may *then be adhesively further united to board 13v through adheslve layer' 14 by any `suitable steps such as heat curing the adhesive 14or'tl1e like.

` Further treatment of chips 10 (which define a mosaic pattern) maybe desiredin accordance with conventional practice. For example, cementitious lgrouting may be placed between the chips 10 and the edges ofthe board 13 may be cut, sanded, and the like. t

FIGS. l6-9' illustrate'themethod and `apparatus of the present invention which may be used for obtaining a mosaic 'pattern of chips in -a single layer. The figures also illustrate how this apparatus may be integrated Ifor cooperation with the pivoted vacuum plate of FIG. 2a.

`With 'reference tol FIGS. `6 and 7, individual chips are fed into 'a h-opper 36 from which they are discharged through a gate 37 (when open) and into a trough .or feeder A38. Ther chips are caused to be discharged from trough 38 when trough 38 is vibrated by arm 39 attached to trough-38. r Arm 39 is1actuated by a suitable power source40. w

The chips, upon being discharged from trough 38,- are disposed rupon a continuous conveyor belt 41. Beltv 41 lpasses over plate 42. Plate -42 is supported upon a plurality of suction cups43 which are in turn mounted upon beams 44.` Belt `41 passes .over suitably coated

rollers

45, 46 which are in y'turn supported in bearings 47, 48 respectively. Bearings 47, 48 are mountedon base 49; Beams 44 are likewise mounted on. base 449. Belt 41 also passes` around a centrally disposed roller supported in bearing 51. Roller -50 is adjustable in bearing 51 to providethe desired uniform tension on belt 41.

"Roller 46 is drivenby motor 52 through a variable speed drive `53 and a belt or chain 54. `Rotation of roller 46k in. turn causesr movement of belt 41 around

rollers

46, 45 and l50 while belt 41 is passed over plate 421 in the direction of the arrows.

Thechips leave trough ,l 38 because of its vibratory movement imparted to the chips` and'drop onto belt 41 in the area ygenerally indicated by 55. Since `belt 41 is moved in the direction of thearrows, the chips entering upon belt 41 in the area 55`are carried through amechanism A for disposing the chips in a single, layer on the belt 41. This step is necessary since the chips in many cases fall fromtrough 38 onto belt 41 in overlapped and stacked relation. The mechanism A for disposing the chips in a common' planer includesv a plurality of transverse arms 56 supported over belt 41 on

housings

58, 58 on` opposite sides of basek49. Each arm 56 is attached at oneend to' aspring 57 suitably -mounted in housing 58. At the other end arm 56 is attached to a cam shaft 59 in housing-58. Cam shaftv 59 is in turn. actuated by a motor -60 with suitable linkages61`.,` As motorn60 ydrives cam shaft 59, 'armsf5g6" areshiftedtransversely toward springs 57 out of phase with each other depending upon the shape ofv cam shaft p59., When each arm 56 reaches its -furthermost lateralshift towarda spring 57, the spring 57 in combination with the further rotation ofV cam shaft 59 causes the arm 56 to return to its starting position back t-oward cam shaft 59 for a repetition of the cycle.

Depending lfrom each armA `56 is. a^plurality Iof closely spaced flexible brushes I62. The lower edge =63 of brushes 62 is set above belt 41 at a distanceapproximately equal to the thickness of a single layer of chips. As a result, as'Iv the chips pass beneath brushes y62 on belt 41, the transverse motion of the brushes 62 on the chips 10 cause the chips to become disposed on belt 41 in a single layer.

The single layer of chips are then conveyed by belt 41 into a space 64 defined .by a tunnel 65 having one closed end 66 and comprising an overhead plate l67 having two longitudinally depending

lips

68, 68 and a depending li-p 69 forming closed end 66.

Lips

68, 68 and 69 are of a selected height, and plate 67 is positioned a distance above belt 41 so that the space 64 inside tunnel 65 -has a verti- 71. and a pair of longitudinal arms 72 interconnected to -forrn a frame 'denoted lgenerally by 73. Frame 73 is` pivotally supported for swingable movement about rallA 74 positioned longitudinally alongside base 49. Base 49 is slidably supported on tracks 75, 7-6 (which are Iparallel* to rail 74) so that base 49 may belongit-udinally shifted from the positions shown in FIGS. 6 and 7 to a second position longitudinally spaced therefrom for'cooperation with the apparat-us illustratedV in FIGS.k 8 and 9 (to` be described hereinafter). v

When in position showninFIGS. 6 andl 7', tunnel 65 i supported by frame 73. Frame 73 is supportedon one of its sides on rail 74 by bearings 77. Frame 73 is supported on its transversely opposite side from rail 74 by a pair of adjustment screws 7 8which depend downwardly through arms 71, through base 49, and rest upon -rail 76. Tunnel 65 maybe raised or lowered with respect to belt 41 by turning screws 78 in the proper direction.

As the chips enter `tunnel' -65 their movement in the direction of the arrows is stopped when they reach closed end 66. of tunnel 65. Subsequent chips moving into tunnel` 65 are also stopped in tunnel 65vwhen they meet andy touch the initially stopped chips. The impact of chip upon chip and against the interior of tunnel 65 causes the chips to shift into a closely spaced mosaic pattern resting on belt 41. During this sequence belt 41 continues to move through tunnel `65.along the bottom thereof and under closed end I66. When a sufficiently large mosaic pattern has formedV in tunnel 65, vibrating trough 38 iS shut off and' conveyor belt 41 is stopped by turning motor 5201i with suitable switches (not shown). Tunnel 65 and frame 73 are then pivoted lupwardly `and away from conveyor belt 41 about rail 74`leaving a mosaic pattern disposed on the portion of belt 41 that happened` to have been positioned in tunnel 65v at the time that motor 5.2 was stopped. Base 49 is then slid longitudinally to the left as viewed in FIGS. 6 and 7 on tracks 75, 76.

Referring now toFIGS. 8 and 9., base 49 is shifted on tracks 7-5, 76 to the left until base 49 -reaches collar 79 on track 76 whereupon .further longitudinal shifting lto the left is prevented. Belt41 with the` mosaic pattern disposed thereon `is now adjacent to a transfer surface shown generally at 80. In the preferred embodiment transfer surface 80comprises a pair of parallel frame members 81 which a-re pivotally and slidably supported on a rod 82 by bearings 83. Rod 82 is parallel to and adjacent tracks 75, 76. (Rod `82may be a separate entity or an extension to the left of rail 74.) A resiliently de-- formable generally flat sheet 84`is supported between frame members 81. Any soft tiexible resiliently deformable material. may be usedfor sheet 84. A spongy mate? rial such as neoprene has been found suitable for this purpose. l

When base 49 has been moved and stopped by collarA 79, frame members 81 will be in position for cooperation therewith when frame members 81 are shifted to the-right on rod 82 as viewed in FIG. 8 until positioned against collar 85. Frame members 81 are then pivoted about rod 82 until side 86v of sheet 84 rests upon and in contact with the chips which m-ay be disposed upon belt 41. With side 86 of resilient sheet 84 pressing against the mosaic pattern, the entire apparatusresting upon an includingv base 49 is pivoted in conjunction with frame members 81 back about rod 82 until the chips have been turned 180" and are then resting `on surface 86 of sheet 84. Because. sheet 84 is a resiliently deformable member, the individual chips are suitably pressed into sheet 84 and are retained in their relative positions during the pivotal movement. Consequently, the mosaic pattern is not disturbed during this pivoting movement. Suit-able clamps (not shown) may be employed to lock arms 81 and sheet 84 to belt 41 and base 49 during the pivotal movement. After the chips have been positioned onto surface 86, base 49 with the conveyor apparatus thereon is repositioned on tracks 75, 76 and shifted longitudinally to the right back to its position shown in FIGS. 6 and 7. I-t is then ready to begin a subsequent cycle for the formation of a mosaic pattern from chips supplied from trough 38.

The mosaic pattern that is now on surface 86 of sheet 84 is ready for joinder directly to la permanent backing member by a sequence of steps similar to that already described in FIG. 2a. Frame members 81 with sheet 84 and the mosaic chips resting on surface 86 may be slid in a horizontal position with the frame members 81 supported on `rod 82 on one side, and on the other side resting upon a Irod 87 that is parallel to `rod 82 and transversely spaced therefrom. Movement is continued a suitable distance until frame members 81 are adjacent to vacuum plate 88 and left bearing 83 is adjacent to vacuum plate lbearing 89. Vacuum plate 88 is suitably pivotally mounted on rod 8'2 on bearings 89, 90 and maintained in a fixed desired position by bearings 91, 92. When frame members 81 are in proper position, vacuum plate 88 is pivoted about rod 82. If a suitable permanent backing 93 is uniformly supported by vacuum plate 88 in the manner described with reference to FIG. 2a and has a suitable adhesive 94 on the surface of backing 93, vacuum plate 88 may be swung so 4that adhesive surface 94 may be brought into parallel bonding contact with the chips that are disposed on the surface 86 of ysheet 84. FIG. 9 illustrates the relationship of .the parts in these last named steps. In this figure, vacuum plate 88 and sheet 84 are shown in a position 60 from the horizontal. The remaining steps to complete the formation of a mosaic panel may then be executed -as noted hereinbefore.

Although the foregoing invention has been described.

in some detail by way of illustration and example for purposes of clarity of understanding, it is understood that certain changes and modifications may be practiced within the spirit of the invention as limited only by the scope of the appended claims.

What is claimed is:

1. A method of positioning a plurality of mosaic chips in a common plane to define a mosaic pattern comprising providing a controlled flow of chips onto a moving web in a single layer, providing a tunnel having one closed end and a height approximately equal to the thickness of sai-d layer of chips, moving said web with said chips resting thereon through said tunnel along its bottom and under the closed end thereof so that the chips on said web are stopped by the closed end of the tunnel and retained therein, said closed tunnel end and chips initially stopped also serving to stop subsequent chips moved by said web while the impact of chip upon chip and tunnel serve to shift the chips into a closely spaced mosaic pattern on said web, transferring said closely spaced mosaic pattern of chips from said web to a gener-ally flat resiliently deformable horizontal surface by holding said web stationary, swinging said tunnel about a fixed point away from said web, swinging said lresilient fiat surface about a fixed point into overhead parallel contact with the mosaic pattern on said web, turning said resilient fiat surface 180 in cooperation with the web without disturbing the mosaic pattern so that the chips face upwardly on said resilient surface, providing a permanent normally fiexible backing member having first and second flat surfaces and adhesive on the first Hat surface thereof, supporting said backing member substantially uniformly over its second flat surface with a vacuum plate so that said entire first flat adhesive surface lies substantially in a single plane, moving said first at adhesive surface by swinging said backing member about a fixed point, while continuing to uniformly support the backing member, parallel to said upwardly spaced chips and into parallel bonding contact therewith.

2. Apparatus for the manufacture of mosaics comprising: a horizontal conveyor, means for controllably supplying chips to said conveyor, means for arranging said chips on said conveyor in a single layer, a tunnel having one closed end and a height approximately equal to said single layer of said chips, said conveyor being disposed as as to pass through said tunnel along its bottom and then under the closed end thereof, the closed end of said tunnel being operable to stop said layer of chips within the tunnel as the conveyor passes under the closed end, said layer of chips being repositioned on the conveyor inside the tunnel into a closely spaced mosaic pattern by the impact of chip upon chip and tunnel as the chips are stopped within said tunnel, means for rotating said mosaic pattern and -transferring the same from within said tunnel to the top of a `generally horizontal flat surface without disturbing said pattern, and means for directly bonding a permanent backing member to said mosaic pattern on said fiat surface without disturbing said pattern.

3. Apparatus for the manufacture of mosaics cornprising: a continuous horizontal belt conveyor, means for driving said belt conveyor, a hopper and vibrating trough feeder adapted for controllably supplying chips onto said belt, a plurality of transverse arms supported over said belt adjacent said trough, means to transversely reciprocate said arms, a plurality of closely spaced liexible brushes depending .from each of said arms over said belt at a distance operable to arrange the chips passing thereunder on the belt ina single layer, a pair of supporting tracks parallel to the longitudinal axis of said belt conveyor for slidably supporting said conveyor for movement to -a first position for cooperation with said trough and to a second position spaced therefrom, a plate pivotally supported on a rail adjacent `said tracks for periodic positioning over said belt conveyor, said plate having depending lips on its sides and on one of its ends opposite from said trough to define -a tunnel over said belt of an internal height approximately equal to the thickness of a single layer of chips, said belt defining the bottom of the tunnel, a -rail parallel and adjacent to said belt conveyor when in its second position, a flat resiliently deformable surface pivotally supported on said rail adjacent said second position for overhead contact with said belt and chips thereon, said conveyor being swingable in cooperation with the pivoting of said resiliently deformable surface when the conveyor is in said second position and the deformable surface is in overhead contact therewith to transfer chips in a mosaic pattern from said belt to said deformable surface and to thereby rotate the chips 180 from their starting position on the belt, and a pivot-ally supported vacuum plate for uniformly supporting a permanent mosaic backing member, said vacuum plate and resiliently deformable surface being slidable relative to each other so that said surface may be placed alongside said vacuum plate and a. permanent backing member may be pivoted into parallel bonding contact with chips on said resilient surface.

References Cited by the Examiner UNITED STATES PATENTS 942,902 2/1910 Karazej et al 156-560 X 1,315,167 9/1919 Semashko 156-562 X 1,460,865 7/1923 Sharp 156-561 3,013,370 l2/1961 Vidya 156-562 X 3,113,900 12/1965 Abernethy et al. 156--560 X 3,181,987 5/1965 Polevitzky 156-562 X EARL M. BERGERT, Primary Examiner.

I. J. BURNS, HAROLD ANSHER, Assistant Examiners.

Claims

1. A METHOD OF POSITIONING A PLURALITY OF MOSAIC CHIPS IN A COMMON PLANE TO DEFINE A MOSAIC PATTERN COMPRISING PROVIDING A CONTROLLED FLOW OF CHIPS ONTO A MOVING WEB IN A SINGLE LAYER, PROVIDING A TUNNEL HAVING ONE CLOSED END AND A HEIGHT APPROXIMATELY EQUAL TO THE THICKNESS OF SAID LAYER OF CHIPS, MOVING SAID WEB WITH SAID CHIPS RESTING THEREON THROUGH SAID TUNNEL ALONG ITS BOTTOM AND UNDER THE CLOSED END THEREOF SO THAT THE CHIPS ON SAID WEB ARE STOPPED BY THE CLOSED END OF THE TUNNEL AND RETAINED THEREIN, SAID CLOSED TUNNEL END AND CHIPS INITIALLY STOPPED ALSO SERVING TO STOP SUBSEQUENT CHIPS MOVED BY SAID WEB WHILE THE IMPACT OF CHIP UPON CHIP AND TUNNEL SERVE TO SHIFT THE CHIPS INTO A CLOSELY SPACED MOSAIC PATTERN ON SAID WEB, TRANSFERRING SAID CLOSELY SPACED MOSAIC PATTERN OF CHIPS FROM SAID WEB TO A GENERALLY FLAT RESILIENTLY DEFORMABLE HORIZONTAL SURFACE BY HOLDING SAID WEB STATIONARY, SWINGING SAID RESILIENT FLAT SURFACE ABOUT A FIXED POINT INTO OVERHEAD PARALLEL CONTACT WITH THE MOSAIC PATTERN ON SAID WEB, TURNING SAID RESILIENT FLAT SURFACE 180* IN COOPERATION WITH THE WEB WITHOUT DISTURBING THE MOSAIC PATTERN SO THAT THE CHIPS FACE UPWARDLY ON SAID RESILIENT SURFACE, PROVIDING A PERMANENT NORMALLY FLEXIBLE BACKING MEMBER HAVING FIRST AND SECOND FLAT SURFACES AND ADHESIVE ON THE FIRST FLAT SURFACE THEREOF, SUPPORTING SAID BACKING MEMBER SUBSTANTIALLY UNIFORMLY OVER ITS SECOND FLAT SURFACE WITH A VACUUM PLAT SO THAT SAID ENTIRE FIRST FLAT ADHESIVE SURFACE LIES SUBSTANTIALLY IN A SINGLE PLANE, MOVING SAID FIRST FLAT ADHESIVE SURFACE BY SWINGING SAID BACKING MEMBER ABOUT A FIXED POINT, WHILE CONTINUING TO UNIFORMLY SUPPORT THE BACKING MEMBER, PARALLEL TO SAID UPWARDLY SPACED CHIPS AND INTO PARALLEL BONDING CONTACT THEREWITH.