Connect public, paid and private patent data with Google Patents Public Datasets

Electrodeposition of copper

Download PDF

Info

Publication number
US2475974A
US2475974A US61321545A US2475974A US 2475974 A US2475974 A US 2475974A US 61321545 A US61321545 A US 61321545A US 2475974 A US2475974 A US 2475974A
Authority
US
Grant status
Grant
Patent type
Prior art keywords
copper
solution
plating
deposits
ounces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
Inventor
Abraham M Max
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils

Description

Patented July 12, 1949 ELECTRODEPOSITION OF COPPER Abraham M. Max, Indianapolis, Ind., assignor to Radio Corporation of America, a corporation of Delaware No Drawing. Application August 28, 1945,

Serial No. 613,215 r 2 Claims. (01. 204-52) This invention relates to electroforming copper deposits, and more particularly to a copper plat ing solution from which fine-grain deposits of copper may be plated.

One of the aims of electroforming deposits of various metals is to obtain metal matrices the surfaces of which duplicate the surfaces on which electroforming takes place. The surface of an electroformed matrix is the negative of the original surface, the impressions or depressions in the original surface becoming elevations in the electroformed surface.

Acid copper plating solutions have been used heretofore for electroforming copper deposits. Such solutions have the advantages, among others, that (1) they have comparatively wide limits of operation, (2) they can be easily controlled, (3) they provide smooth, heavy deposits of copper, and (4) they have the ability to cover a thin, conductive film on a non-conductive material. Hence, acid copper plating solutions are preferred to other types. However, copper deposits obtained from an acid copper plating solution are very soft and have a tendency to tree. Consequently, addition agents are employed to produce harder and smoother deposits.

Electroformed copper deposits from an acid copper plating solution consists of columnar crystals perpendicular to the starting surface, or surface on which the copper is being plated, the crystals becoming larger, by lateral growth, as the deposits become heavier. If the surface being plated has an impression or depression therein, there results in the columnar, crystal structure a weakness perpendicular to the impression where the columnar crystals come together. Most commonly used addition agents retard the lateral growth of crystals, but due to the retained columnar structure, the weaknesses in irregular surfaces remain. Thus, many addition agents.

result in a brittle electroformed structure which splits under the stresses to which matrices are subjected.

It is apparent that a desirable structure for electroformed deposits is one in which the columnar growth is retarded completely. I have found that if triethanolamine is added to a standard acid copper plating solution, the resulting solution will produce fine-grain deposits both laterally and perpendicularly to the surface which is plated, the columnar crystal growth being retarded. Tensile tests made with specimens of such copper deposits show a tensile strength equal to a strong copper alloy.

In accordance with my present invention, there is added to a more or less standard, acid copper plating solution triethanolamine in the proportions of approximately 0.7 ounce to 1 ounce per gallon of plating solution. The plating solution may consist of approximately 25 ounces to 32 ounces of copper sulfate and approximately 3 ounces to 10 ounces of sulfuric acid per gallon of plating solution. The copper may be plated out in known manner at suitable current densities and suitable plating solution temperatures. I have found that a copper deposit plated out from a solution according to my present invention has an extremely fine and uniform grain structure which gives the copper considerable strength.

Copper deposits resulting from my improved plating solution have a tensile strength of from about 60,000 pounds per square inch to about 73,000

pounds per square inch with an elongation of approximately 6 per cent to 9 per cent. This is about per cent stronger than known samples of electroformed copper obtained from standard, conventional, plating solutions employing various addition agents proposed heretofore.

It will be apparent to those skilled in the art that the various proportions of the addition agent indicated above. are not necessarily limiting and that they may be varied more or less depending upon the particular application or the particular articles to be plated. It will also be obvious, no doubt, that my improved plating solution may be employed in providing electroformed copper deposits on a great many articles other than phonograph record matrices, printing plates, and the like.

I claim as my invention:

1. An acid copper plating solution consisting essentially of approximately 25 ounces to 32 ounces of copper sulfate, approximately 3 ounces to 10 ounces of sulfuric acid, and an addition agent comprising approximately 0.7 ounce to 1 ounce of triethanolamine per gallon of plating solution.

2. The method of producing on an article a fine-grain deposit of copper comprising immersing said article in a solution consisting essentially of approximately 25 to 32 ounces of copper sulfate, approximately 3 to 10 ounces of sulfuric acid and approximately 0.7 to 1 ounce of triethanola (References on following page) I I I The following references are of record in the Number. count Date file this 503,095 Great Britain Mar. 31, 1939 UNITED STATES PATENTS OTHER'REFERENCES Number Name Date I f 694,658 Meurant Mar. 4, 1902 f gf g 'ggfi gfl fi w 1,642,238 Gardner Sept. 13, 1927 1,805,920 Muschler May 19, 1931 v 2,391,289 Beaver Dec. 18', 1945

US2475974A 1945-08-28 1945-08-28 Electrodeposition of copper Expired - Lifetime US2475974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US2475974A US2475974A (en) 1945-08-28 1945-08-28 Electrodeposition of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2475974A US2475974A (en) 1945-08-28 1945-08-28 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
US2475974A true US2475974A (en) 1949-07-12

Family

ID=24456354

Family Applications (1)

Application Number Title Priority Date Filing Date
US2475974A Expired - Lifetime US2475974A (en) 1945-08-28 1945-08-28 Electrodeposition of copper

Country Status (1)

Country Link
US (1) US2475974A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2853443A (en) * 1956-04-25 1958-09-23 Westinghouse Electric Corp Addition agent for acid copper electrolytes
US2996408A (en) * 1958-03-31 1961-08-15 Gen Electric Copper plating process and solution
US3075855A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solutions
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5958209A (en) * 1996-05-13 1999-09-28 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil and process of electrodepositing thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US694658A (en) * 1900-12-11 1902-03-04 Jules Meurant Electrolytic process.
US1642238A (en) * 1923-02-19 1927-09-13 Ford Motor Co Plating and method of accomplishing the same
US1805920A (en) * 1927-11-07 1931-05-19 Muschler Fred Making copper plated shingles
GB503095A (en) * 1937-10-04 1939-03-31 Bruno Friedrich Schweig Improvements in the production of electrodeposits of copper
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US694658A (en) * 1900-12-11 1902-03-04 Jules Meurant Electrolytic process.
US1642238A (en) * 1923-02-19 1927-09-13 Ford Motor Co Plating and method of accomplishing the same
US1805920A (en) * 1927-11-07 1931-05-19 Muschler Fred Making copper plated shingles
GB503095A (en) * 1937-10-04 1939-03-31 Bruno Friedrich Schweig Improvements in the production of electrodeposits of copper
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2853443A (en) * 1956-04-25 1958-09-23 Westinghouse Electric Corp Addition agent for acid copper electrolytes
US2996408A (en) * 1958-03-31 1961-08-15 Gen Electric Copper plating process and solution
US3075855A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solutions
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5454926A (en) * 1990-05-30 1995-10-03 Gould Electronics Inc. Electrodeposited copper foil
US5958209A (en) * 1996-05-13 1999-09-28 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil and process of electrodepositing thereof
US6194056B1 (en) 1996-05-13 2001-02-27 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil

Similar Documents

Publication Publication Date Title
US4430173A (en) Additive composition, bath and process for acid copper electroplating
US3969199A (en) Coating aluminum with a strippable copper deposit
US4195117A (en) Process for electroplating directly plateable plastic with nickel-iron alloy strike and article thereof
Finch et al. An electron-diffraction study of the structure of electro-deposited metals
US2532283A (en) Nickel plating by chemical reduction
Clarke et al. Abnormal high throwing power and cathode passivity in acid tin plating baths
US2241815A (en) Method of treating copper alloy castings
US3591350A (en) Novel plating process
US4529668A (en) Electrodeposition of amorphous alloys and products so produced
US3485725A (en) Method of increasing the deposition rate of electroless solutions
US2048276A (en) Plated metal having carbide surface
US1792082A (en) Metallic coating and process of producing the same
US4262875A (en) Information record stampers
US4994155A (en) High speed tin, lead or tin/lead alloy electroplating
US3925170A (en) Method and composition for producing bright palladium electrodepositions
US3963590A (en) Process for electroplating polyoxymethylene
US4036709A (en) Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
JPH062104A (en) Nickel plating steel strip with high corrosion resistance and its production
US3245885A (en) Method of manufacturing nickel-plated steel plate
US4411965A (en) Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
US4121982A (en) Gold alloy plating bath and method
US2240805A (en) Composite article and method of making same
US3386867A (en) Method for providing electrical contacts to a wafer of gaas
US4076598A (en) Method, electrolyte and additive for electroplating a cobalt brightened gold alloy
US2234552A (en) Hardened nonferrous alloy