US2446349A - Electrodeposition of aluminum - Google Patents
Electrodeposition of aluminum Download PDFInfo
- Publication number
- US2446349A US2446349A US524486A US52448644A US2446349A US 2446349 A US2446349 A US 2446349A US 524486 A US524486 A US 524486A US 52448644 A US52448644 A US 52448644A US 2446349 A US2446349 A US 2446349A
- Authority
- US
- United States
- Prior art keywords
- aluminum
- mixture
- bath
- electrodeposition
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052782 aluminium Inorganic materials 0.000 title description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title description 16
- 238000004070 electrodeposition Methods 0.000 title description 7
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000007788 liquid Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- -1 alkyl pyridinium chloride Chemical compound 0.000 description 4
- 150000001491 aromatic compounds Chemical class 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011255 nonaqueous electrolyte Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ABFDKXBSQCTIKH-UHFFFAOYSA-M 1-ethylpyridin-1-ium;bromide Chemical compound [Br-].CC[N+]1=CC=CC=C1 ABFDKXBSQCTIKH-UHFFFAOYSA-M 0.000 description 1
- AMFMJCAPWCXUEI-UHFFFAOYSA-M 1-ethylpyridin-1-ium;chloride Chemical compound [Cl-].CC[N+]1=CC=CC=C1 AMFMJCAPWCXUEI-UHFFFAOYSA-M 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
Definitions
- This invention relates to the electrodeposition of aluminum from a liquid mixture of a nitrogensubstituted alkyl pyridinium chloride or bromide and aluminum chloride.
- Hurley has disclosed a process for the electrodeposition of aluminum on dissimilar metal cathodes from a liquid mixture of aluminum chloride or bromide and an N-alkyl pyridinium chloride or bromide or an N-alkylene dipyridinium chloride or bromide. Hurley points out the temperature of the bath must be suiiiciently elevated to avoid spongy aluminum deposits and that one should generally work at a temperature above 100 C.
- Another object of the present invention is to provide a novel electrolyte for the electrodeposition of aluminum on dissimilar metals.
- the plate which is secured is materially improved in appearance when compared to a plate on the same material which is efiected at an elevated temperature without the use of the additional compound.
- liquid compound selected from the group consisting of liquid aromatic hydrocarbons such as benzene, toluene, xylene and the like, and their liquid chloro-substituted derivatives such as chlorobenzene. Mixtures of these liquids can also be used. 7
- the lower layer is the plating solution.
- the upper layer which consists principally of the added aromatic compound, is very useful for protecting the bath from atmospheric moisture. However, it is not necessary that completely saturated solutions be employed for the successful operation of the bath, and one need only add a. small amount of the aromatic substance to the aluminum chloride-pyridinium compound mixture to secure some of the advantages of this invention.
- a cell of glass, porcelain or other inert material may be used; or the container may be made of aluminum and can then serve as the anode. If the cell is made of other metals, any moisture which is present may result in corrosion of the metal by moist hydrogen halide. This can carry the metal halide into solution and may result in the formation of a plate consisting of an aluminum 81107.
- alloy plates may not be disadvantageous and accordingly the term aluminum as used here and in the claims is to be considered as including such alloys in which aluminum forms the major constituent.
- the anode should be as large as or larger than, the cathode object, and the electrodes should beso arranged in the cell that the resistance of the cell is not too high and the cathode current distribution is uniform.
- cathode current densities between 0.5 and 1.0 amp/rim. were found to be most useful.
- cathode densities about 0.5 ampJdmP
- white plates of aluminum were obtained, while at the higher current densities (about 1.0 ampJdmF), the plates were very bright and shiny.
- brown streaks appeared on the shiny deposits and with excessive current densities, black, non-adherent deposits were obtained. These appeared to contain some occluded aluminum chloride.
- cathode current densities as high as 2.0 ampozldm. and obtained bright and shiny plates.
- the white plates mentioned above may .be polished if desired.
- the cathode current eiiiciencies are very high, being about 85% at 0.5 amp./dm. to 92% at 1.0 link/(11113.
- this bath should be used'in a dry atmosphere, free of ongen and other oxidizing gases.
- the behaviour of the bath in the presence of moist air shows that it is sublcct to oxidation which can lead to deterioration of its plating properties.
- the oxidation is indicated by the appearance of a red color in the bath.
- a nitrogen atmosphere or an atmosphere a non-oxidizing gas should be maintained over the bath.
- a mixture of ethyl pyridinium bromide and aluminum chloride in the ratio of 66.7 mo1 per cent aluminum chloride (taken as A1013) and 33.3 mol per cent ethyl pyridlnium bromide was Prepared and toluene was added until the mixture was saturated.
- This mixture was used in a cylindrical glass cell, 5.2 cm. in diameter and filled the cell to a depthof about 5 cm. The mixture was covered with a layer of toluene about 1 cm. deep, which served as a protection against moisture.
- the anode was a circular aluminum sheet, 5 cm. high and 15 cm. in circumference. Thin sheets of iron or other metal 2.5 to 3.8 cm. wide, wereused as cathode objects and were immersed from 3 to 5 cm. in the plating liquid. These were suitably cleaned before use.
- the anode was a circular aluminum sheet, 5 cm. high and 15 cm. in circumference. Thin sheets of iron or other metal 2.5 to 3.8 cm. wide,
- a nonaqueous electrolyte for use in the electrodeposition of aluminum as a bright, adherent deposit that consists essentially of a mixture of (1) about 2 mols of aluminum chloride, (2) 1 mol of ethyl pyridiniu-m chloride and (3) a suflicient amount of toluene to saturate the mixture.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented Aug. 3, 1948 ELECTRODEPOSITION OF ALUMINUM Thomas P. Wier, Jr., Berkeley, Calif., and Frank H. Hurley, Portland, Orega, assignors to The William Marsh Rice Institute for the Advancement of Literature, Science and Art, 9, corporation of Texas No Drawing. Application February29, 1944,
Serial N 0. 524,486
2 Claims. 1
This invention relates to the electrodeposition of aluminum from a liquid mixture of a nitrogensubstituted alkyl pyridinium chloride or bromide and aluminum chloride.
In a co-pending application, Serial No. 522,375, filed February 14, 1944, Hurley has disclosed a process for the electrodeposition of aluminum on dissimilar metal cathodes from a liquid mixture of aluminum chloride or bromide and an N-alkyl pyridinium chloride or bromide or an N-alkylene dipyridinium chloride or bromide. Hurley points out the temperature of the bath must be suiiiciently elevated to avoid spongy aluminum deposits and that one should generally work at a temperature above 100 C.
It is obvious that if one can successfully plate aluminum at a lower temperature, preferably about room temperature, the operation is materially simplified, the operation can be conducted more economically, and various articles which cannot be handled readily at the more elevated temperatures can be plated at the lower temperature.
It is in general the broad object of the present invention to provide a process for the electrodeposition of aluminum on dissimilar metals at room temperature.
Another object of the present invention is to provide a novel electrolyte for the electrodeposition of aluminum on dissimilar metals. We have discovered that by the addition of certain aromatic compounds to liquid mixtures of aluminum chloride or bromide and the N-alkyl mono-pyridinium mono-chlorides or mono-bromides in which the alkyl radical is unsubstituted, an improved bath is obtained, one which permits successful plating at room temperature.
In addition, by utilization of the aromatic compounds, it is possible to materially lower the cost of the plating solution.
Further, the plate which is secured is materially improved in appearance when compared to a plate on the same material which is efiected at an elevated temperature without the use of the additional compound. Y
In addition to these advantages, there is less loss of the plating solution upon removal of the plated object from the bath. Further, it is possible to use higher current densities.
In making up the bath, we employ a liquid compound selected from the group consisting of liquid aromatic hydrocarbons such as benzene, toluene, xylene and the like, and their liquid chloro-substituted derivatives such as chlorobenzene. Mixtures of these liquids can also be used. 7
One proceeds to make up the desired mixture of aluminum chlorideand the desired nitrogensubstituted alkyl 'mono-pyridinium mono-chloride or mono-bromide. One then adds the aromatic substance, such as benzene, preferably until an excess of the added compound floats on the top of the aluminum chloride-pyridinium compound layer. The lower layer is the plating solution. When the plating mixture is saturated with the aromatic compound in this way, the volume of electrolytev solution is approximately doubled, except in the case of chloro-benzene which appears to be miscible with the aluminum chloride-pyridinium compound mixture in all proportions. The upper layer, which consists principally of the added aromatic compound, is very useful for protecting the bath from atmospheric moisture. However, it is not necessary that completely saturated solutions be employed for the successful operation of the bath, and one need only add a. small amount of the aromatic substance to the aluminum chloride-pyridinium compound mixture to secure some of the advantages of this invention.
Good plates of aluminum can be obtained when the nitrogen-substituted alkyl halide is the ethylited upon the cathode.
In removing the cathode from the bath a thin film of the plating solution remains on the cathode. This should be removed immediately by rinsing with water.
As a container forthe bath, a cell of glass, porcelain or other inert material may be used; or the container may be made of aluminum and can then serve as the anode. If the cell is made of other metals, any moisture which is present may result in corrosion of the metal by moist hydrogen halide. This can carry the metal halide into solution and may result in the formation of a plate consisting of an aluminum 81107.
Under certain conditions these alloy plates may not be disadvantageous and accordingly the term aluminum as used here and in the claims is to be considered as including such alloys in which aluminum forms the major constituent.
To obtain the proper conditions of current density and voltage, a suitably designed cell must be employed. In general, the anode should be as large as or larger than, the cathode object, and the electrodes should beso arranged in the cell that the resistance of the cell is not too high and the cathode current distribution is uniform.
In electroplating with this type of bath, cathode current densities between 0.5 and 1.0 amp/rim. were found to be most useful. At the lower cathode densities (about 0.5 ampJdmP) white plates of aluminum were obtained, while at the higher current densities (about 1.0 ampJdmF), the plates were very bright and shiny. At still higher current densities brown streaks appeared on the shiny deposits and with excessive current densities, black, non-adherent deposits were obtained. These appeared to contain some occluded aluminum chloride. In some cells we have successfully used cathode current densities as high as 2.0 ampozldm. and obtained bright and shiny plates. The white plates mentioned above may .be polished if desired.
The cathode current eiiiciencies are very high, being about 85% at 0.5 amp./dm. to 92% at 1.0 link/(11113.
In addition, the voltage requirements of this plating solution are very low, of the order of one volt. However. this depends on the cell size and the current density.
To obtain the best results with this bath, it should be used'in a dry atmosphere, free of ongen and other oxidizing gases. The behaviour of the bath in the presence of moist air shows that it is sublcct to oxidation which can lead to deterioration of its plating properties. The oxidation is indicated by the appearance of a red color in the bath. A nitrogen atmosphere or an atmosphere a non-oxidizing gas should be maintained over the bath.
The following example is given as illustrative of a practice within the present invention.
A mixture of ethyl pyridinium bromide and aluminum chloride in the ratio of 66.7 mo1 per cent aluminum chloride (taken as A1013) and 33.3 mol per cent ethyl pyridlnium bromide was Prepared and toluene was added until the mixture was saturated. This mixture was used in a cylindrical glass cell, 5.2 cm. in diameter and filled the cell to a depthof about 5 cm. The mixture was covered with a layer of toluene about 1 cm. deep, which served as a protection against moisture. The anode was a circular aluminum sheet, 5 cm. high and 15 cm. in circumference. Thin sheets of iron or other metal 2.5 to 3.8 cm. wide, wereused as cathode objects and were immersed from 3 to 5 cm. in the plating liquid. These were suitably cleaned before use. The
whole apparatus was fitted with a suitably deherent deposit on a metal from the group consisting of iron, copper, brass, bronze, lead, and nickel and tin from a cell containing a liquid nonaqueous electrolyte consisting essentially of a mixture of (1) about 2 mols of aluminum chloride, (2) about 1 mol of ethyl pyridinium chloride, and (3) a sumcient amount of toluene to saturate the mixture.
2. A nonaqueous electrolyte for use in the electrodeposition of aluminum as a bright, adherent deposit that consists essentially of a mixture of (1) about 2 mols of aluminum chloride, (2) 1 mol of ethyl pyridiniu-m chloride and (3) a suflicient amount of toluene to saturate the mixture.
THOMAS P. WIER. Ja. FRANK H.
REFERENCES crrnn The following references are of record in the file of this patent:
UNITED STATES PATENTS Number Name Date 1,911,122 Keyes et al May 23, 1933 1,939,397 Keyes et a1. Dec. 12, 1933 1,960,334 Ernst et all. May 29, 1934 OTHER REFERENCES 32, No. 18 (Sept. 20,
Society, vol. 19
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US524486A US2446349A (en) | 1944-02-29 | 1944-02-29 | Electrodeposition of aluminum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US524486A US2446349A (en) | 1944-02-29 | 1944-02-29 | Electrodeposition of aluminum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2446349A true US2446349A (en) | 1948-08-03 |
Family
ID=24089407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US524486A Expired - Lifetime US2446349A (en) | 1944-02-29 | 1944-02-29 | Electrodeposition of aluminum |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2446349A (en) |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2692850A (en) * | 1951-11-02 | 1954-10-26 | Battelle Development Corp | Aluminum electroforming |
| US2728718A (en) * | 1951-11-02 | 1955-12-27 | Battelle Development Corp | Aluminum coating |
| US2849349A (en) * | 1955-06-13 | 1958-08-26 | Ziegler | Process for the electrolytic deposition of aluminium |
| US3268421A (en) * | 1961-12-04 | 1966-08-23 | Nat Steel Corp | Electrodeposition of metals from a fused bath of aluminum halohydride organic complex and composition therefor |
| US3532609A (en) * | 1965-11-09 | 1970-10-06 | Nippon Kokan Kk | Process for the preliminary treatment adapted for the electrolytic formation of aluminum coatings on metallic surfaces in molten salt bath |
| US3775260A (en) * | 1971-04-27 | 1973-11-27 | Canadian Patents Dev | Electroplating aluminum |
| US4463072A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries containing room-temperature molten 1,2,3-trialkylimidazolium halide non-aqueous electrolyte |
| US4463071A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries using room-temperature molten non-aqueous electrolytes containing 1,2,3-trialkylimidazolium halides or 1,3-dialkylimidazolium halide |
| US4747916A (en) * | 1987-09-03 | 1988-05-31 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and process for the same |
| US4904355A (en) * | 1988-04-26 | 1990-02-27 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
| US4906342A (en) * | 1988-04-26 | 1990-03-06 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
| US4966660A (en) * | 1987-07-13 | 1990-10-30 | Nisshin Steel Co., Ltd. | Process for electrodeposition of aluminum on metal sheet |
| US5074973A (en) * | 1989-05-23 | 1991-12-24 | Nisshin Steel Co. Ltd. | Non-aqueous electrolytic aluminum plating bath composition |
| US5827602A (en) * | 1995-06-30 | 1998-10-27 | Covalent Associates Incorporated | Hydrophobic ionic liquids |
| US20040238352A1 (en) * | 2000-10-20 | 2004-12-02 | The University Of Alabama | Production, refining and recycling of lightweight and reactive metals in ionic liquids |
| US20060169590A1 (en) * | 2003-03-04 | 2006-08-03 | Hebditch David J | Process for separating metals |
| DE10108893C5 (en) * | 2001-02-23 | 2011-01-13 | Rolf Prof. Dr. Hempelmann | Process for the production of metals and their alloys |
| WO2012043129A1 (en) * | 2010-09-30 | 2012-04-05 | 株式会社日立製作所 | Aluminum electroplating solution |
| US20150144495A1 (en) * | 2013-11-22 | 2015-05-28 | Sikorsky Aircraft Corporation | Methods and materials for electroplating aluminum in ionic liquids |
| US9631290B2 (en) | 2011-10-07 | 2017-04-25 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Room temperature electrodeposition of actinides from ionic solutions |
| US10422048B2 (en) | 2014-09-30 | 2019-09-24 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Processes for recovering rare earth elements |
| US11142841B2 (en) | 2019-09-17 | 2021-10-12 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1911122A (en) * | 1929-08-13 | 1933-05-23 | Ellis Foster Co | Process for the electrodeposition of aluminum from its compounds |
| US1939397A (en) * | 1929-04-12 | 1933-12-12 | Ellis Foster Co | Process of electrodeposition of aluminum |
| US1960334A (en) * | 1934-05-29 | Process of preparing n-methyl com |
-
1944
- 1944-02-29 US US524486A patent/US2446349A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1960334A (en) * | 1934-05-29 | Process of preparing n-methyl com | ||
| US1939397A (en) * | 1929-04-12 | 1933-12-12 | Ellis Foster Co | Process of electrodeposition of aluminum |
| US1911122A (en) * | 1929-08-13 | 1933-05-23 | Ellis Foster Co | Process for the electrodeposition of aluminum from its compounds |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2692850A (en) * | 1951-11-02 | 1954-10-26 | Battelle Development Corp | Aluminum electroforming |
| US2728718A (en) * | 1951-11-02 | 1955-12-27 | Battelle Development Corp | Aluminum coating |
| US2849349A (en) * | 1955-06-13 | 1958-08-26 | Ziegler | Process for the electrolytic deposition of aluminium |
| US3268421A (en) * | 1961-12-04 | 1966-08-23 | Nat Steel Corp | Electrodeposition of metals from a fused bath of aluminum halohydride organic complex and composition therefor |
| US3532609A (en) * | 1965-11-09 | 1970-10-06 | Nippon Kokan Kk | Process for the preliminary treatment adapted for the electrolytic formation of aluminum coatings on metallic surfaces in molten salt bath |
| US3775260A (en) * | 1971-04-27 | 1973-11-27 | Canadian Patents Dev | Electroplating aluminum |
| US4463072A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries containing room-temperature molten 1,2,3-trialkylimidazolium halide non-aqueous electrolyte |
| US4463071A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries using room-temperature molten non-aqueous electrolytes containing 1,2,3-trialkylimidazolium halides or 1,3-dialkylimidazolium halide |
| US4966660A (en) * | 1987-07-13 | 1990-10-30 | Nisshin Steel Co., Ltd. | Process for electrodeposition of aluminum on metal sheet |
| US4747916A (en) * | 1987-09-03 | 1988-05-31 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and process for the same |
| US4904355A (en) * | 1988-04-26 | 1990-02-27 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
| US4906342A (en) * | 1988-04-26 | 1990-03-06 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
| US5074973A (en) * | 1989-05-23 | 1991-12-24 | Nisshin Steel Co. Ltd. | Non-aqueous electrolytic aluminum plating bath composition |
| US5827602A (en) * | 1995-06-30 | 1998-10-27 | Covalent Associates Incorporated | Hydrophobic ionic liquids |
| US20040238352A1 (en) * | 2000-10-20 | 2004-12-02 | The University Of Alabama | Production, refining and recycling of lightweight and reactive metals in ionic liquids |
| US7347920B2 (en) | 2000-10-20 | 2008-03-25 | The Board Of Trustees Of The University Of Alabama | Production, refining and recycling of lightweight and reactive metals in ionic liquids |
| DE10108893C5 (en) * | 2001-02-23 | 2011-01-13 | Rolf Prof. Dr. Hempelmann | Process for the production of metals and their alloys |
| US20060169590A1 (en) * | 2003-03-04 | 2006-08-03 | Hebditch David J | Process for separating metals |
| WO2012043129A1 (en) * | 2010-09-30 | 2012-04-05 | 株式会社日立製作所 | Aluminum electroplating solution |
| US9631290B2 (en) | 2011-10-07 | 2017-04-25 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Room temperature electrodeposition of actinides from ionic solutions |
| US20150144495A1 (en) * | 2013-11-22 | 2015-05-28 | Sikorsky Aircraft Corporation | Methods and materials for electroplating aluminum in ionic liquids |
| US9903034B2 (en) * | 2013-11-22 | 2018-02-27 | Sikorsky Aircraft Corporation | Methods and materials for electroplating aluminum in ionic liquids |
| US10422048B2 (en) | 2014-09-30 | 2019-09-24 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Processes for recovering rare earth elements |
| US11142841B2 (en) | 2019-09-17 | 2021-10-12 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
| US11459658B2 (en) | 2019-09-17 | 2022-10-04 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
| US12129551B2 (en) | 2019-09-17 | 2024-10-29 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
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